JPH028056U - - Google Patents
Info
- Publication number
- JPH028056U JPH028056U JP1988084671U JP8467188U JPH028056U JP H028056 U JPH028056 U JP H028056U JP 1988084671 U JP1988084671 U JP 1988084671U JP 8467188 U JP8467188 U JP 8467188U JP H028056 U JPH028056 U JP H028056U
- Authority
- JP
- Japan
- Prior art keywords
- light
- image sensor
- entered
- emitted
- transmitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Facsimile Heads (AREA)
Description
第１−Ａ図は本考案による密着型イメージセン
サの第１実施例の断面図、第１−Ｂ図は同密着型
イメージセンサの第２実施例の断面図、第２−Ａ
図は同密着型イメージセンサの第３実施例の断面
図、第２−Ｂ図は同密着型イメージセンサの第４
実施例の断面図、第３−Ａ図は同密着型イメージ
センサの第５実施例の断面図、第３−Ｂ図は同密
着型イメージセンサの第６実施例の断面図、第４
図は従来の密着型イメージセンサの断面図である
。 Ｐ……原稿、Ｌｉ……照明光、Ｌｏ……反射光
、Ｓ……密着型イメージセンサ、１……透光性基
板、１ｂ……傾斜反射面、２……光源（ＬＥＤ）
、９……受光素子、１０……光透過部。
サの第１実施例の断面図、第１−Ｂ図は同密着型
イメージセンサの第２実施例の断面図、第２−Ａ
図は同密着型イメージセンサの第３実施例の断面
図、第２−Ｂ図は同密着型イメージセンサの第４
実施例の断面図、第３−Ａ図は同密着型イメージ
センサの第５実施例の断面図、第３−Ｂ図は同密
着型イメージセンサの第６実施例の断面図、第４
図は従来の密着型イメージセンサの断面図である
。 Ｐ……原稿、Ｌｉ……照明光、Ｌｏ……反射光
、Ｓ……密着型イメージセンサ、１……透光性基
板、１ｂ……傾斜反射面、２……光源（ＬＥＤ）
、９……受光素子、１０……光透過部。
Claims (1)
- 表面に複数の受光素子９が配設された透光性基
板１内に入射した照明光Ｌｉが前記表面の前記受
光素子９に隣接する部分に設けられた複数の光透
過部１０から出射して原稿Ｐ面を照射し、原稿Ｐ
面からの反射光Ｌｏが前記受光素子９で受光され
るように構成された密着型イメージセンサにおい
て、前記透光性基板１内に入射した照明光Ｌｉを
前記光透過部１０から出射させる傾斜反射面１ｂ
が前記透光性基板１に設けられた密着型イメージ
センサ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084671U JPH028056U (ja) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084671U JPH028056U (ja) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028056U true JPH028056U (ja) | 1990-01-18 |
Family
ID=31309352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988084671U Pending JPH028056U (ja) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028056U (ja) |
-
1988
- 1988-06-27 JP JP1988084671U patent/JPH028056U/ja active Pending