JPH0280482U - - Google Patents
Info
- Publication number
- JPH0280482U JPH0280482U JP16058188U JP16058188U JPH0280482U JP H0280482 U JPH0280482 U JP H0280482U JP 16058188 U JP16058188 U JP 16058188U JP 16058188 U JP16058188 U JP 16058188U JP H0280482 U JPH0280482 U JP H0280482U
- Authority
- JP
- Japan
- Prior art keywords
- memory card
- semiconductor
- flexible board
- circuit board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16058188U JPH0280482U (ru) | 1988-12-09 | 1988-12-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16058188U JPH0280482U (ru) | 1988-12-09 | 1988-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0280482U true JPH0280482U (ru) | 1990-06-21 |
Family
ID=31442770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16058188U Pending JPH0280482U (ru) | 1988-12-09 | 1988-12-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0280482U (ru) |
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1988
- 1988-12-09 JP JP16058188U patent/JPH0280482U/ja active Pending