JPH0280412A - Resin composition and laminated sheet - Google Patents
Resin composition and laminated sheetInfo
- Publication number
- JPH0280412A JPH0280412A JP23306588A JP23306588A JPH0280412A JP H0280412 A JPH0280412 A JP H0280412A JP 23306588 A JP23306588 A JP 23306588A JP 23306588 A JP23306588 A JP 23306588A JP H0280412 A JPH0280412 A JP H0280412A
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- meth
- resin composition
- composition according
- radically polymerizable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 27
- 229920001577 copolymer Polymers 0.000 claims abstract description 27
- 239000000178 monomer Substances 0.000 claims abstract description 14
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims abstract description 13
- 150000001993 dienes Chemical class 0.000 claims abstract description 12
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims abstract description 11
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 23
- -1 maleic acid ester Chemical class 0.000 claims description 17
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 14
- 150000002148 esters Chemical class 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 5
- 239000001530 fumaric acid Substances 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 239000011976 maleic acid Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 238000004581 coalescence Methods 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-L fumarate(2-) Chemical class [O-]C(=O)\C=C\C([O-])=O VZCYOOQTPOCHFL-OWOJBTEDSA-L 0.000 abstract 1
- 150000002688 maleic acid derivatives Chemical class 0.000 abstract 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 20
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- 239000002253 acid Substances 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 7
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 5
- 239000005062 Polybutadiene Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920002857 polybutadiene Polymers 0.000 description 5
- 239000007870 radical polymerization initiator Substances 0.000 description 5
- ZSVFYHKZQNDJEV-UHFFFAOYSA-N (2,3,4-tribromophenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(Br)C(Br)=C1Br ZSVFYHKZQNDJEV-UHFFFAOYSA-N 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- XQKQZOLAVMIQHZ-UHFFFAOYSA-N 1,1-dibromo-3-(3,3-dibromopropoxy)propane Chemical compound BrC(Br)CCOCCC(Br)Br XQKQZOLAVMIQHZ-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- FNAKEOXYWBWIRT-UHFFFAOYSA-N 2,3-dibromophenol Chemical compound OC1=CC=CC(Br)=C1Br FNAKEOXYWBWIRT-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- JHJUYGMZIWDHMO-UHFFFAOYSA-N 2,6-dibromo-4-(3,5-dibromo-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1S(=O)(=O)C1=CC(Br)=C(O)C(Br)=C1 JHJUYGMZIWDHMO-UHFFFAOYSA-N 0.000 description 1
- BNJMVIYUUNVKHZ-UHFFFAOYSA-N 2-(2,3,4,5,6-pentabromophenoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BNJMVIYUUNVKHZ-UHFFFAOYSA-N 0.000 description 1
- WPKYHACUJAHAQD-UHFFFAOYSA-N 2-(2,3,4,5,6-pentabromophenoxy)ethyl prop-2-enoate Chemical compound BrC1=C(Br)C(Br)=C(OCCOC(=O)C=C)C(Br)=C1Br WPKYHACUJAHAQD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical class CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229920000402 bisphenol A polycarbonate polymer Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- QUYMKXIXBJMIGU-UHFFFAOYSA-N but-1-ene;prop-2-enenitrile Chemical compound CCC=C.C=CC#N QUYMKXIXBJMIGU-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- SVHOVVJFOWGYJO-UHFFFAOYSA-N pentabromophenol Chemical compound OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br SVHOVVJFOWGYJO-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 235000012976 tarts Nutrition 0.000 description 1
- ROEHNQZQCCPZCH-UHFFFAOYSA-N tert-butyl 2-tert-butylperoxycarbonylbenzoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1C(=O)OC(C)(C)C ROEHNQZQCCPZCH-UHFFFAOYSA-N 0.000 description 1
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Laminated Bodies (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂組成物および積層板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a resin composition and a laminate.
プリント配線基板用積属板に用いる硬化性樹脂組成物と
してはエポキシ樹脂、フェノール樹脂および不飽和ポリ
エステル樹脂等が知られている。Epoxy resins, phenol resins, unsaturated polyester resins, and the like are known as curable resin compositions used for printed wiring board stacking boards.
最近、安全性の面から、難燃性への要求が強く、難燃性
を向上させるために上記樹脂に芳香族ハロゲン化合物(
例えば、デカブロムジフェニルオキサイド、テトラブロ
ムビスフェノールAビスジブロモプロビルエーテル、テ
トラブロムビスフェノールAポリカーボネート等)を添
加することが知られている。Recently, there has been a strong demand for flame retardancy from the standpoint of safety, and aromatic halogen compounds (
For example, it is known to add decabromo diphenyl oxide, tetrabromo bisphenol A bis dibromopropyl ether, tetrabromo bisphenol A polycarbonate, etc.).
また、プリント配線基板に用いる積層板においては、多
様化が進む中で、折り曲げ可能な可撓性に優れた積層板
が求められている。可撓性を付与するために、ゴム変性
ビニルエステルを用いることが知られている(例えば、
特開昭80−217232号公報)。In addition, as laminates used for printed wiring boards become increasingly diverse, there is a demand for laminates that are bendable and have excellent flexibility. It is known to use rubber-modified vinyl esters to impart flexibility (e.g.
(Japanese Patent Application Laid-open No. 80-217232).
しかし、難燃性を向上させるために芳香族ハロゲン化合
物を添加すると可視性に欠け、また、ゴム変性ビニルエ
ステルを用いる方法は難燃性が十分でない。However, when aromatic halogen compounds are added to improve flame retardancy, visibility is lacking, and methods using rubber-modified vinyl esters do not provide sufficient flame retardancy.
本発明者らは、難燃性、耐熱性及び可視性に優れた樹脂
組成物を開発するため、種々研究を重ねた結果、本発明
に至った。すなわち本発明は、共役ジエン系単2体と、
必要により他のエチレン性不飽和単正体との(共)重合
体の(メタ)アクリル酸、フマル酸モしくはマレイン酸
のエステルから成るラジカル重合性(共)重合体[但し
、ラジカル重合性(共)重合体中の、 (メタ)アクリ
ル酸、フマル酸もしくはマレイン酸のエステルの個数は
平均1〜5個であり、ラジカル重合性(共)重合体の数
平均分子量が500〜20000である](A)と、ハ
ロゲン置換アリール基含有(メタ)アクリル酸モノエス
テル(B)とを必須成分とする硬化性樹脂組成物、およ
び、合成樹脂を基材に含浸、硬化させてなる積層板にお
いて、該合成樹脂が、請求項1〜6のいずれか記載の硬
化性樹脂組成物であることを特徴とする積層板である。The present inventors have conducted various studies in order to develop a resin composition with excellent flame retardancy, heat resistance, and visibility, and as a result, they have arrived at the present invention. In other words, the present invention provides a conjugated diene molecule,
A radically polymerizable (co)polymer consisting of an ester of (meth)acrylic acid, fumaric acid, or maleic acid as a (co)polymer with other ethylenically unsaturated monomers if necessary [However, radically polymerizable ( The average number of esters of (meth)acrylic acid, fumaric acid or maleic acid in the co)polymer is 1 to 5, and the number average molecular weight of the radically polymerizable (co)polymer is 500 to 20,000.] (A) and a halogen-substituted aryl group-containing (meth)acrylic acid monoester (B) as essential components, and a laminate obtained by impregnating and curing a synthetic resin into a base material, A laminate, wherein the synthetic resin is the curable resin composition according to any one of claims 1 to 6.
共役ジエン単量体の(共)重合体には共役ジエン単量体
の重合体および共役ジエン単量体と他のエチレン性単量
体との共重合体があげられる。Examples of (co)polymers of conjugated diene monomers include polymers of conjugated diene monomers and copolymers of conjugated diene monomers and other ethylenic monomers.
共役ジエン系単6体としては、炭素数4または5の共役
ジエン、例えば、1,3−ブタジェン、イソプレン、ク
ロロプレン等が挙げられ、好ましくはl。Examples of the conjugated diene 6-unit include conjugated dienes having 4 or 5 carbon atoms, such as 1,3-butadiene, isoprene, and chloroprene, with 1 being preferred.
3−ブタジェンである。3-butadiene.
他のエチレン性不飽和単l、1体としては、芳香族ビニ
ル単fit体(スチレン、a−メチルスチレン、クロロ
スチレン等);(メタ)アクリル酸及びその誘導体[ア
クリロニトリル、 (メタ)アクリル酸メチル、 (メ
タ)アクリル酸ブチル、メタクリル酸グリンジル等];
オレフィン系炭化水素(エチレン、プロピレン、イソ
ブチレン等); ビニルジエステル単rJ体(酢酸ビ
ニル等); ハロゲン含有単11体(塩化ビニル、」シ
化ビニリデン等); ビニルエーテル単n1体(ビニ
ルメチルエーテル等); アリルアルコール及びその誘
導体(アリルエーテル類、アリルエステル類)等および
これらの2種以上の混合物である。Examples of other ethylenically unsaturated monomers include aromatic vinyl monomers (styrene, a-methylstyrene, chlorostyrene, etc.); (meth)acrylic acid and its derivatives [acrylonitrile, methyl (meth)acrylate] , (meth)butyl acrylate, grindyl methacrylate, etc.];
Olefinic hydrocarbons (ethylene, propylene, isobutylene, etc.); vinyl diester single rJ forms (vinyl acetate, etc.); halogen-containing single 11 forms (vinyl chloride, vinylidene silide, etc.); vinyl ether single n1 forms (vinyl methyl ether, etc.) ; Allyl alcohol and its derivatives (allyl ethers, allyl esters), etc., and mixtures of two or more thereof.
これらの内で好ましいのは、アクリロニトリル、スチレ
ン、メタクリル酸メチル、エチレンおよびプロピレンで
あり、特に好ましくはアクリロニi・リルおよびスチレ
ンである。Preferred among these are acrylonitrile, styrene, methyl methacrylate, ethylene and propylene, particularly preferred are acrylonitrile and styrene.
前記(共)重合体の共役ジエン系単量体に基づく不飽和
二m結合は、水素添加により、部分的にもしくは完全に
飽和されていてもよい。The unsaturated dim bonds based on the conjugated diene monomer of the (co)polymer may be partially or completely saturated by hydrogenation.
共重合体(A)巾の、水素化されていてもよい共役ジエ
ン系りLffi体に基づく構造単位は、通常30重量%
以」二、好ましくは00重量%以上である。共役ジエン
系り11i1体に基づく構造単位の量が30重量%未満
では耐熱性、相溶性が向」ニするが、可(n性が低下す
る傾向がある。The structural unit based on the optionally hydrogenated conjugated diene or Lffi body of the copolymer (A) is usually 30% by weight.
2, preferably 00% by weight or more. If the amount of the structural unit based on the conjugated diene 11i1 is less than 30% by weight, the heat resistance and compatibility will be improved, but the compatibility will tend to decrease.
ラジカル重合性(共)重合体(A)中の(メタ)アクリ
ル酸、フマル酸またはマレイン酸(以下、ラジカル重合
性不飽和酸とも言う)エステルの個数は、通常平均1〜
5個であり、好ましくは1.5〜3個である。ラジカル
重合性不飽和酸エステルの個数が5個より多いと可IA
性が低下し、1個未満では樹脂組成物を硬化させた場合
、硬化樹脂組成物の相溶性が悪くなる。The number of (meth)acrylic acid, fumaric acid, or maleic acid (hereinafter also referred to as radically polymerizable unsaturated acid) esters in the radically polymerizable (co)polymer (A) is usually 1 to 1 on average.
The number is 5, preferably 1.5 to 3. Possible IA when the number of radically polymerizable unsaturated acid esters is more than 5
If there is less than one, the compatibility of the cured resin composition will deteriorate when the resin composition is cured.
ラジカル重合性(共)重合体(A)の数平均分子量は通
常500〜10000. 好ましくは1000〜10
000である。The number average molecular weight of the radically polymerizable (co)polymer (A) is usually 500 to 10,000. Preferably 1000-10
It is 000.
分子■が20000より大きいと、(A)および(B)
からなる樹脂組成物の粘度が高くなりすぎ、作業性が低
下する。また、分子はが500未満では、本発明の組成
物の硬化物の可撓性が低下し、好ましくない。When the molecule ■ is larger than 20000, (A) and (B)
The viscosity of the resin composition becomes too high, resulting in reduced workability. Moreover, if the molecular number is less than 500, the flexibility of the cured product of the composition of the present invention will decrease, which is not preferable.
(共)重合体からラジカル重合性(共)重合体(A)を
得る方法としては、
(1)予め、 (共)重合体に水酸基を導入した、水酸
基変性(共)重合体を作成し、このものとラジカル重合
性不飽和酸またはその酸無水物、酸ハライド、低級アル
コールエステル等を反応させる方法、
(2)予め、 (共)重合体に水酸基を導入した、水酸
基変性(共)重合体を作成し、このものと水酸基を含有
するラジカル重合性不飽和酸エステル(例えば、メタク
リル酸2−ヒ1!ロキシエチル等)を、ジイソシアナー
ト化合物(例えば]・リレンジイソシアナート、ジフェ
ニルメタンジイソンアナート等)で結合させて導入する
方法、
(3)予め、 (共)重合体にエポキシ基を導入したエ
ポキシ変性(共)重合体を作成しておき、ラジカル重合
性不飽和酸と反応させる方法、等がある。The method for obtaining a radically polymerizable (co)polymer (A) from a (co)polymer is as follows: (1) In advance, a hydroxyl group-modified (co)polymer is created by introducing a hydroxyl group into the (co)polymer; A method of reacting this material with a radically polymerizable unsaturated acid or its acid anhydride, acid halide, lower alcohol ester, etc. (2) A hydroxyl group-modified (co)polymer in which a hydroxyl group is introduced into the (co)polymer in advance This product and a radically polymerizable unsaturated acid ester containing a hydroxyl group (e.g., 2-hyroxyethyl methacrylate, etc.) are combined with a diisocyanate compound (e.g., lylene diisocyanate, diphenylmethane diisonanate). (3) A method in which an epoxy-modified (co)polymer is prepared in advance by introducing an epoxy group into a (co)polymer and then reacted with a radically polymerizable unsaturated acid. etc.
ハロゲン置換アリールJ^を含有する(メタ)アクリル
酸モノエステル(ロ)としては、芳香環に少なくとも1
個のハロゲン原子が結合したハロゲン置換アリール化合
物と、1個のアクリル酸又はメタクリル酸とのエステル
が挙げられる。As the (meth)acrylic acid monoester (b) containing halogen-substituted aryl J^, at least one
Examples include esters of a halogen-substituted aryl compound to which 1 halogen atoms are bonded and 1 acrylic acid or methacrylic acid.
ハロゲンとしては、塩素および臭素が挙げられ、好まし
くは臭素である。Examples of halogen include chlorine and bromine, with bromine being preferred.
ハロゲン置換アリール化合物としては、ハロゲン化フェ
ノール化合物(ジブロモフェノール、トリブロモフェノ
ール、ペンタブロモフェノール、ポリブロモフェニレン
オキサイド等)、ハロゲン化ビスフェノール化合物(テ
トラブロムビスフェノールA1 テトラブロムビスフ
ェノールS等)等、およびこれらの化合物の誘導体、例
えば、エチレンオキサイドおよび/またはプロピレンオ
キサイ)’ 付加物、グリシジルエーテル等が挙げられ
る。Examples of halogen-substituted aryl compounds include halogenated phenol compounds (dibromophenol, tribromophenol, pentabromophenol, polybromophenylene oxide, etc.), halogenated bisphenol compounds (tetrabromobisphenol A1, tetrabromobisphenol S, etc.), and these. Derivatives of the compounds, such as ethylene oxide and/or propylene oxide)' adducts, glycidyl ethers, and the like.
(8)としては、ジまたはトリブロモフェノールメタク
リル酸エステル、ジブロモフェノールエポキシモノメタ
クリル酸エステル、アクリル酸ペンタブロモフェノキシ
エチルエステル、テトラブロモビスフェノールAエチレ
ンオキサイド付加物モノアクリル酸エステル、テトラブ
ロモビスフェノールAジエボキサイドのモノメタクリル
酸エステル等が挙げられる。(8) Examples include di- or tribromophenol methacrylate, dibromophenol epoxy monomethacrylate, pentabromophenoxyethyl acrylate, tetrabromobisphenol A ethylene oxide adduct monoacrylate, and tetrabromobisphenol A dieboxide. Examples include monomethacrylic acid ester.
(B)は、例えば、前記ハロゲンW lfiアリール化
合物と(メタ)アクリル酸またはその誘導体(例えば、
酸ハライド、低級アルコールエステル等)との反応によ
って1υることが出来る。(B) is, for example, the halogen W lfi aryl compound and (meth)acrylic acid or a derivative thereof (for example,
1υ can be obtained by reaction with acid halides, lower alcohol esters, etc.).
本発明の組成物において、(A)と(n)の重量比は、
(A): (B)が通常10:9G〜410:10であ
り、好ましくは20:8G〜80:20である。(A)
がこの比率より小さいと本発明の目的とする可撓性に優
れた樹脂が得難い。In the composition of the present invention, the weight ratio of (A) and (n) is
(A):(B) is usually 10:9G to 410:10, preferably 20:8G to 80:20. (A)
If the ratio is smaller than this ratio, it will be difficult to obtain a resin with excellent flexibility, which is the object of the present invention.
また、(A)がこの比率より大きいと樹脂そのものの機
械的強度が落ち実用上使用困難である。Moreover, if (A) is larger than this ratio, the mechanical strength of the resin itself decreases, making it difficult to use it practically.
また(B)は、(ロ)から出来するハロゲン含有量が、
本発明のJ1成物中に通常5〜50重量%、好ましくは
10〜30%となる量に(ロ)を配合される。(B)が
この範囲にあることは、本発明の目的の1つである難燃
性を付与するために好ましい。In addition, (B) has a halogen content formed from (B),
(B) is blended into the J1 composition of the present invention in an amount that is usually 5 to 50% by weight, preferably 10 to 30%. It is preferable that (B) be within this range in order to impart flame retardancy, which is one of the objects of the present invention.
本発明の組成物はラジカル重合性単量体を含むことが出
来る。ラジカル重合性単量体は、好ましくは、25°C
における粘度が1000センチボイズ以下、または分子
量が400以下で、常圧に於ける沸点が50″C以−に
の化合物である。例えば、芳香族ビニル化合物(例えば
、スチレン、α−メチルスチレン、ハロゲン化スチレン
、ジビニルベンゼン等);(メタ)アクリル酸またはそ
の誘導体[例えばアクリロニトリル、アルキル(CI”
CI 2 ) (メタ)アクリル酸エステル、 (
メタ)アクリル酸グリシジル、ヒドロキシアルキル(メ
タ)アクリル酸エステル、トリメチロールプロパントリ
(メタ)アクリル酸エステル、ペンタエリスリトールテ
トラ(メタ)アクリル酸エステル等); ビニルエステ
ル単量体(酢酸ビニル等); フタル酸ジアリル等およ
びこれらの2種以」二の混合物を挙げることができる。The composition of the present invention can contain a radically polymerizable monomer. The radically polymerizable monomer is preferably heated at 25°C.
A compound with a viscosity of 1,000 centiboise or less, a molecular weight of 400 or less, and a boiling point of 50"C or more at normal pressure. For example, aromatic vinyl compounds (e.g., styrene, α-methylstyrene, halogenated styrene, divinylbenzene, etc.); (meth)acrylic acid or its derivatives [e.g. acrylonitrile, alkyl (CI)
CI2) (meth)acrylic acid ester, (
Glycidyl meth)acrylate, hydroxyalkyl(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, etc.); Vinyl ester monomers (vinyl acetate, etc.); Phthal Examples include diallyl acids and mixtures of two or more thereof.
これらの内で、好ましいのはアクリロニトリル、スチレ
ン、アルキル(C+〜C4)(メタ)アクリル酸エステ
ルおよび(メタ)アクリル酸グリシジルであり、特に好
ましくはスチレンである。Among these, preferred are acrylonitrile, styrene, alkyl (C+ to C4) (meth)acrylic acid esters and glycidyl (meth)acrylate, with styrene being particularly preferred.
本発明の組成物は添加型難燃剤を含むことが出来る。難
燃剤としては、トリオクチルホスフェート、トリフェニ
ルフォスフェート、 トリエチルホスファイト、トリフ
ェニルホスファイト、 トリス(クロロエチル)ホスフ
ェート、赤リン等のリン系難燃剤、デカブロムジフェニ
ルオキサイド、テトラブロムビスフェノールAビスジブ
ロモプロピルエーテル、テトラブロムビスフェノールA
ボリカーボネーj・、ヘキサブロモシクロドデカン、
II化パラフィン等のハロゲン化合物、三酸化アンチ
モン、五酸化アンチモン、アンチモン酸ソーダ等のアン
チモン化合物、ホウ酸亜鉛、水酸化アルミニウム等およ
びこれらの2種以上の混合物が挙げられる。Compositions of the invention can include additive flame retardants. Flame retardants include trioctyl phosphate, triphenyl phosphate, triethyl phosphite, triphenyl phosphite, tris (chloroethyl) phosphate, phosphorus flame retardants such as red phosphorus, decabrom diphenyl oxide, tetrabromo bisphenol A bis dibromopropyl Ether, tetrabromobisphenol A
polycarbonate, hexabromocyclododecane,
Examples include halogen compounds such as II-containing paraffin, antimony compounds such as antimony trioxide, antimony pentoxide, and sodium antimonate, zinc borate, aluminum hydroxide, and mixtures of two or more thereof.
本発明の組成物は充j1剤、酸化防11:剤、安定剤、
無機顔料等の各種添加剤を含有させることが出来る。The composition of the present invention includes a filling agent, an antioxidant 11 agent, a stabilizer,
Various additives such as inorganic pigments can be contained.
本発明の樹脂組成物は汎用のラジカル重合開始剤を用い
て硬化させることができる。ラジカル重合開始剤として
は、ベンゾイルパーオキサイド、ジクミルパーオキサイ
ド、メチルエチルケトンパーオキサイド、t−プチルパ
ーオキシラウエート、ジ−t−ブチルパーオキシフタレ
ート、t−ブチルクミルパーオキサイF1 t−ブチル
ハイドロバーオキサイ1!、ジ−t−ブチルパーオキサ
イド、クメンハイドロパーオキサイド、t−ブチルパー
オキシベンゾエート等の過酸化物等がある。ラジカル重
合1」11始剤の使用量は本発明の組成物に対して、通
常0,1〜10重量%である。The resin composition of the present invention can be cured using a general-purpose radical polymerization initiator. Examples of radical polymerization initiators include benzoyl peroxide, dicumyl peroxide, methyl ethyl ketone peroxide, t-butyl peroxylauate, di-t-butyl peroxyphthalate, t-butylcumyl peroxide F1, t-butyl hydrobar Okisai 1! , di-t-butyl peroxide, cumene hydroperoxide, t-butyl peroxybenzoate, and other peroxides. The amount of radical polymerization 1''11 initiator used is usually 0.1 to 10% by weight based on the composition of the present invention.
また、ラジカル反応促進剤としてジメチルアニリン等の
アミン化合物、ナフテン酸コバルト等の有機カルボン酸
金属塩等も用いることができる。Furthermore, amine compounds such as dimethylaniline, organic carboxylic acid metal salts such as cobalt naphthenate, etc. can also be used as radical reaction promoters.
本発明の組成物を硬化させる場合、硬化温度は通常常温
〜200°C1好ましくは60〜170℃である。When curing the composition of the present invention, the curing temperature is usually room temperature to 200°C, preferably 60 to 170°C.
本発明の組成物を硬化させた場合、硬化物の曲げ弾P1
ニ率としては、通常3〜80kgf/lll112、好
ましくは5〜30kgf/II■2である。曲げ弾性率
がこの値より低いと機植的強度が低く、本発明の組成物
を用いて作成した積層板においては、積層板を保持する
ための補強材が必要である。また曲げ弾性率がこれより
高いと、本発明の組成物を用いて作成した積層板を折り
曲げたときの復元力が強く、形状を保持するための補強
材が必要である。When the composition of the present invention is cured, bending elasticity P1 of the cured product
The ratio is usually 3 to 80 kgf/lll112, preferably 5 to 30 kgf/llll2. When the flexural modulus is lower than this value, the mechanical strength is low, and a laminate made using the composition of the present invention requires a reinforcing material to hold the laminate. If the flexural modulus is higher than this, the laminate produced using the composition of the present invention will have a strong restoring force when bent, and a reinforcing material will be required to maintain the shape.
積層板は、本発明の組成物を基材に含浸させ硬化するこ
とにより1uられる。The laminate is manufactured by impregnating a base material with the composition of the present invention and curing it.
基材は、一般に積層材に使用されているものが使用でき
る。例えば、ガラス、シリカ、アスベスト等のtart
機繊維、ポリアミドイミド、 ポリエステル、ナイロン
、アクリル繊維、炭素繊維等の有機合成繊維からなる織
布、不織布またはマプト、紙、あるいはこれらの組合せ
ノ、(材がある。As the base material, those commonly used for laminated materials can be used. For example, tart of glass, silica, asbestos, etc.
Woven fabrics, non-woven fabrics, paper, or combinations of these are made of organic synthetic fibers such as machine fibers, polyamide-imide, polyester, nylon, acrylic fibers, and carbon fibers.
基材に含浸させる樹脂組成物の指は、積層板の重量を基
準として通常30〜95%、好ましくは40〜95%で
ある。The amount of resin composition impregnated into the substrate is usually 30 to 95%, preferably 40 to 95%, based on the weight of the laminate.
樹脂組成物を含浸させた基材を1枚ないし数枚重ね合わ
せ、無圧または加圧の条件で、常温または加熱硬化する
ことにより積層板が得られる。A laminate is obtained by stacking one or several substrates impregnated with the resin composition and curing at room temperature or heating under no pressure or pressurized conditions.
以下製造例、実施例および比較例によって本発明を更に
説明するが、本発明はこれに限定されるものではない。The present invention will be further explained below with reference to Production Examples, Examples, and Comparative Examples, but the present invention is not limited thereto.
実AI例中の部はfflffi部である。The part in the real AI example is the fffffi part.
製造例 1
四つロフラスコに、ポリテールHE三戻化成(1!1)
ポリブタジェングリコール水素添加物、水酸基価47.
3+ggK011/g12372部、無水マレイン酸1
96部を投入した。120℃で酸価が45.3となるま
で加熱し、マレイン化水素添加ポリブタジェングリコー
ルを得た。Production example 1 Polytail HE Mibokasei (1!1) in a four-roof flask
Polybutadiene glycol hydrogenated product, hydroxyl value 47.
3+ggK011/g12372 parts, maleic anhydride 1
96 copies were sold. The mixture was heated at 120° C. until the acid value reached 45.3 to obtain maleated hydrogenated polybutadiene glycol.
このものは室温では固形吠であった。This product had a solid bark at room temperature.
比較製造例 l
egつロフラスコに、ポリテトラメチレングリコール[
三洋化成(製)、水酸基価57.5mgKO1l/g]
1950部、無水マレイン酸l!]6部を投入した。1
20℃で酸価が52,4となるまで加熱し、マレイン化
ポリテトラメチレングリコールを得た。Comparative Production Example l In a two-flask, polytetramethylene glycol [
Manufactured by Sanyo Chemical Co., Ltd., hydroxyl value 57.5mgKO1l/g]
1950 parts of maleic anhydride! ] 6 copies were added. 1
The mixture was heated at 20° C. until the acid value reached 52.4 to obtain maleated polytetramethylene glycol.
実施例 1
poly bd R−45MA[出光石油化学(製)、
液状ポリブタジェングリコールマレイン化物、数平均分
子fi290G、酸価43mgKOII/g1317部
、トリブロモフェノールメタクリル酸エステル383部
、スチレン300gBを均一に溶解し、三酸化アンチモ
ン1o部、ラジカル重合開始剤としてバークミルH及び
パーキュア0[いずれも日本油脂C!12> ]を各々
5部加え、液状の本発明の樹脂組成物をtOた。Example 1 poly bd R-45MA [manufactured by Idemitsu Petrochemical Co., Ltd.]
Liquid polybutadiene glycol maleate, number average molecular fi 290G, acid value 43mg KOII/g 1317 parts, tribromophenol methacrylate 383 parts, styrene 300gB were uniformly dissolved, 10 part of antimony trioxide, and Bark Mill H as a radical polymerization initiator. and Percure 0 [both Nippon Oil & Fats C! 12>] were added to the mixture to form a liquid resin composition of the present invention.
樹脂組成物を2枚のガラス板中に/、lE型し、+21
1’Cで30分、170°Cで1時間加熱硬化させて、
平板を作成した。また、樹脂組成物をガラス/ポリエス
テルから成る不織布に含浸さ1・、これを2枚積層し、
120℃で30分、170℃で1時間加熱硬化し、厚さ
九。The resin composition was put into two glass plates /, 1E type, +21
Heat cure at 1'C for 30 minutes and at 170°C for 1 hour.
A flat plate was created. In addition, a nonwoven fabric made of glass/polyester is impregnated with a resin composition, and two sheets of this are laminated.
Heat cured at 120°C for 30 minutes and at 170°C for 1 hour to a thickness of 9.
の積層板を作成した
実施例 2
poly bd +?−45MAの代わりに製造例工で
作成したマレイン化水素添加ポリブタジェングリコ−/
L/ヲ用いたほかは、実施例1と同様にして樹脂組成物
を得、さらに平板及び積層板を作成した。Example 2 of creating a laminate of poly bd +? -Maleated hydrogenated polybutadiene glyco prepared by manufacturing example instead of 45MA-/
A resin composition was obtained in the same manner as in Example 1, except that L/W was used, and flat plates and laminates were further produced.
実施例 3
+1ycar YTBNX 1300X 23[Goo
drlch cl+e+5lca1社(製)ブタンエン
−アクリロニトリルオリゴマーアクリリックビニル基3
.8%含有〕429部、 トリブロモフェノールメタク
リル酸エステル428部、スチレン143部を均一に溶
解し、三酸化アンチモン10部、ラジカル重合開始剤と
してパークミルI(及びパーキュアOを各々5部加え、
樹脂組成物を得た。実施例1と同様にして平板及び積層
板を作成した。Example 3 +1ycar YTBNX 1300X 23[Goo
drlch cl+e+5lca1 (manufactured) butanene-acrylonitrile oligomer acrylic vinyl group 3
.. 8% containing] 429 parts, 428 parts of tribromophenol methacrylate, and 143 parts of styrene were uniformly dissolved, 10 parts of antimony trioxide, and 5 parts each of Percyl I (and Percure O) as radical polymerization initiators were added.
A resin composition was obtained. A flat plate and a laminate were produced in the same manner as in Example 1.
実施4’t44
トリブロモフェノールメタクリル酸エステルの代わりに
メタクリル酸ペンタブロモフェノキシエチルエステルを
用いたほかは、実施例1と同様にして樹脂組成物を得、
さらに平板及び積層板を作成した。Example 4't44 A resin composition was obtained in the same manner as in Example 1, except that pentabromophenoxyethyl methacrylate was used instead of tribromophenol methacrylate,
Furthermore, flat plates and laminated plates were created.
比較例 1
poly bd R−4511の代わりにpoly b
d R−45HT[出光石油化学(製)、液伏ポリブタ
ジェングリコール、数平均分子12800、水酸μ値4
G、6閣gKO[/gコを用いて、実施例1と同様にし
て樹脂組成物を得、さらに平板及び積層板を作成したと
ころきわめて脆い白濁固形物が得られた。このものは実
用には耐えないものであった。Comparative example 1 poly b instead of poly bd R-4511
d R-45HT [manufactured by Idemitsu Petrochemical Co., Ltd., liquid polybutadiene glycol, number average molecule 12800, hydroxyl μ value 4
A resin composition was obtained in the same manner as in Example 1 using G, 6KgKO [/gCo], and flat plates and laminates were produced, and very brittle white cloudy solids were obtained. This product was not suitable for practical use.
比較例 2
poly bd R−451Aの代わりに比較製造例1
で作成したマレインポリテトラメチレングリコールをm
いたほかは、実施例1と同様にして樹脂組成物を得、さ
らに平板及び積層板を作成した。Comparative Example 2 Comparative Production Example 1 instead of poly bd R-451A
Malein polytetramethylene glycol prepared with m
Except for the above, a resin composition was obtained in the same manner as in Example 1, and flat plates and laminates were also produced.
比較−例 3
poly bd R−45MA317部、テトラブロム
ビX7./−ルAエチレンオキサイド付加物のジメタク
リレ−) zss部、デカブσモジフェニルオキサイP
128部、スチレン300部を均一に溶解し、二酸化ア
ンチセフ10部、ラジカル重合開始剤としてバークミル
H及びバーキュア0を各々5部加え樹脂組成物を得た。Comparison-Example 3 317 parts of poly bd R-45MA, tetrabromubi X7. /-ru A ethylene oxide adduct dimethacrylate) zss part, Decab σ modiphenyl oxyP
A resin composition was obtained by uniformly dissolving 128 parts of styrene and 300 parts of styrene, and adding 10 parts of anticeph dioxide and 5 parts each of Bark Mill H and Vercure 0 as radical polymerization initiators.
樹脂組成物について実施例1と同様に加熱硬化させて、
平板及び積層板を作成した。The resin composition was heated and cured in the same manner as in Example 1,
A flat plate and a laminated plate were created.
実施例及び比較例によって得られた平板及び積層板につ
いて主な特P1ミを表に示す。平板については曲げ弾性
率(JIS K−G!III準Ij!りおよび熱重量測
定を行った。積層板については半[口耐熱性試験(JI
S C−[1481準m)および耐燃試験(DI、−9
4法)を行った。The main characteristics of P1 of the flat plates and laminates obtained in Examples and Comparative Examples are shown in the table. For flat plates, bending elastic modulus (JIS K-G!
S C-[1481 semi-m) and flame resistance test (DI, -9
4 method) was performed.
表1平板の物性 表2 積層板の物性 〔発明の効果〕 本発明の樹脂組成物および積層板は ■、難燃性に優れている。Table 1 Physical properties of flat plate Table 2 Physical properties of laminates 〔Effect of the invention〕 The resin composition and laminate of the present invention are ■Excellent flame retardancy.
2、耐熱性や積層板におけるハンダ耐熱性、オーブン耐
熱性に優れている。2. Excellent heat resistance, solder heat resistance in laminates, and oven heat resistance.
3、可撓性に優れている。3. Excellent flexibility.
4、電気特性に優れ、特に積層板いおいては高周波電気
特性、誘電特性に特に優れている。4. Excellent electrical properties, particularly in high frequency electrical properties and dielectric properties in the case of laminated plates.
5、耐iT?tl性や積層板におけるパンチング特性に
優れている。5. Resistance to IT? It has excellent tl properties and punching properties in laminates.
6、耐水性に優れている。6. Excellent water resistance.
7、銅箔との密着性に優れている。7. Excellent adhesion to copper foil.
」二記効果を奏することにより、本発明の樹脂組成物お
よび積層板は、銅張積層板としてテレビ等の民生機器、
通信装置?i、オーディオ装置などのプリント配線基板
の材料として極めて適したもである。By exhibiting the effects mentioned above, the resin composition and laminate of the present invention can be used as a copper-clad laminate for consumer appliances such as televisions,
Communication device? i. It is extremely suitable as a material for printed wiring boards such as audio equipment.
Claims (1)
)重合体の(メタ)アクリル酸、フマル酸もしくはマレ
イン酸のエステルから成るラジカル重合性(共)重合体
[但し、ラジカル重合性(共)重合体中の、(メタ)ア
クリル酸、フマル酸もしくはマレイン酸エステルの個数
は1〜5でありラジカル重合性(共)重合体の数平均分
子量が500〜20000である](A)と、ハロゲン
置換アリール基含有(メタ)アクリル酸モノエステル(
B)とを必須成分とする硬化性樹脂組成物。 2、(A)と(B)の重量比が10:90〜90:10
である請求項1記載の組成物。 3、(A)と(B)の合計重量が硬化性樹脂組成物中で
50%以上である請求項1または2記載の組成物。 4、硬化性樹脂組成物中の(B)から由来するハロゲン
含有量が、5〜50重量%である請求項1〜3のいずれ
か記載の組成物。 5、(A)中の水素化されていてもよい共役ジエン系単
量体に基づく構造単位が30重量%以上である請求項1
〜4のいずれか記載の組成物。 6、曲げ弾性率が3〜80kgf/mm^2の硬化樹脂
を与える請求項1〜5のいずれか記載の組成物。 7、合成樹脂を基材に含浸、硬化させてなる積層板にお
いて、該合成樹脂が、請求項1〜6のいずれか記載の硬
化性樹脂組成物であることを特徴とする積層板。[Claims] 1. A radically polymerizable (co)polymer consisting of an ester of (meth)acrylic acid, fumaric acid, or maleic acid of a (co)polymer of an optionally hydrogenated conjugated diene monomer Coalescence [However, the number of (meth)acrylic acid, fumaric acid, or maleic acid ester in the radically polymerizable (co)polymer is 1 to 5, and the number average molecular weight of the radically polymerizable (co)polymer is 500 to 500. 20,000] (A), and (meth)acrylic acid monoester containing a halogen-substituted aryl group (
A curable resin composition containing B) as an essential component. 2. The weight ratio of (A) and (B) is 10:90 to 90:10
The composition according to claim 1. 3. The composition according to claim 1 or 2, wherein the total weight of (A) and (B) is 50% or more in the curable resin composition. 4. The composition according to any one of claims 1 to 3, wherein the halogen content derived from (B) in the curable resin composition is 5 to 50% by weight. 5. Claim 1, wherein the structural unit based on the optionally hydrogenated conjugated diene monomer in (A) is 30% by weight or more.
4. The composition according to any one of 4 to 4. 6. The composition according to any one of claims 1 to 5, which provides a cured resin having a flexural modulus of 3 to 80 kgf/mm^2. 7. A laminate formed by impregnating and curing a synthetic resin into a base material, wherein the synthetic resin is the curable resin composition according to any one of claims 1 to 6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23306588A JPH0280412A (en) | 1988-09-17 | 1988-09-17 | Resin composition and laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23306588A JPH0280412A (en) | 1988-09-17 | 1988-09-17 | Resin composition and laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0280412A true JPH0280412A (en) | 1990-03-20 |
Family
ID=16949252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23306588A Pending JPH0280412A (en) | 1988-09-17 | 1988-09-17 | Resin composition and laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0280412A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6242506B1 (en) | 1998-07-22 | 2001-06-05 | Mingxin Fan | Flame retardant additive for radiation curable acrylic compositions |
CN110249399A (en) * | 2017-01-25 | 2019-09-17 | 凯米特电子公司 | Self damping MLCC array |
-
1988
- 1988-09-17 JP JP23306588A patent/JPH0280412A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6242506B1 (en) | 1998-07-22 | 2001-06-05 | Mingxin Fan | Flame retardant additive for radiation curable acrylic compositions |
CN110249399A (en) * | 2017-01-25 | 2019-09-17 | 凯米特电子公司 | Self damping MLCC array |
CN110249399B (en) * | 2017-01-25 | 2022-05-03 | 凯米特电子公司 | Self-attenuating MLCC array |
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