JPH028038U - - Google Patents
Info
- Publication number
- JPH028038U JPH028038U JP8357488U JP8357488U JPH028038U JP H028038 U JPH028038 U JP H028038U JP 8357488 U JP8357488 U JP 8357488U JP 8357488 U JP8357488 U JP 8357488U JP H028038 U JPH028038 U JP H028038U
- Authority
- JP
- Japan
- Prior art keywords
- collect
- mounter
- nozzle
- pellets
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8357488U JPH028038U (US07860544-20101228-C00003.png) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8357488U JPH028038U (US07860544-20101228-C00003.png) | 1988-06-24 | 1988-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028038U true JPH028038U (US07860544-20101228-C00003.png) | 1990-01-18 |
Family
ID=31308288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8357488U Pending JPH028038U (US07860544-20101228-C00003.png) | 1988-06-24 | 1988-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028038U (US07860544-20101228-C00003.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54179914U (US07860544-20101228-C00003.png) * | 1978-06-09 | 1979-12-19 | ||
| JPH0624060U (ja) * | 1992-08-21 | 1994-03-29 | 株式会社ノーリツ | 浴槽用壁付き水栓の接続構造 |
| KR101395536B1 (ko) * | 2012-09-04 | 2014-05-15 | 에스티에스반도체통신 주식회사 | 반도체 다이 픽업용 콜렛 모듈 |
-
1988
- 1988-06-24 JP JP8357488U patent/JPH028038U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54179914U (US07860544-20101228-C00003.png) * | 1978-06-09 | 1979-12-19 | ||
| JPH0624060U (ja) * | 1992-08-21 | 1994-03-29 | 株式会社ノーリツ | 浴槽用壁付き水栓の接続構造 |
| KR101395536B1 (ko) * | 2012-09-04 | 2014-05-15 | 에스티에스반도체통신 주식회사 | 반도체 다이 픽업용 콜렛 모듈 |
