JPH0279044U - - Google Patents
Info
- Publication number
- JPH0279044U JPH0279044U JP1988158032U JP15803288U JPH0279044U JP H0279044 U JPH0279044 U JP H0279044U JP 1988158032 U JP1988158032 U JP 1988158032U JP 15803288 U JP15803288 U JP 15803288U JP H0279044 U JPH0279044 U JP H0279044U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- semiconductor package
- ceramic substrate
- substrate
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988158032U JPH0719155Y2 (ja) | 1988-12-06 | 1988-12-06 | 半導体パツケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988158032U JPH0719155Y2 (ja) | 1988-12-06 | 1988-12-06 | 半導体パツケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0279044U true JPH0279044U (US08087162-20120103-C00010.png) | 1990-06-18 |
| JPH0719155Y2 JPH0719155Y2 (ja) | 1995-05-01 |
Family
ID=31437997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988158032U Expired - Lifetime JPH0719155Y2 (ja) | 1988-12-06 | 1988-12-06 | 半導体パツケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719155Y2 (US08087162-20120103-C00010.png) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250617A (ja) * | 1995-03-10 | 1996-09-27 | Nec Corp | 半導体装置の製造方法 |
| JP2006247833A (ja) * | 2005-03-07 | 2006-09-21 | Samsung Electronics Co Ltd | Ｍｅｍｓ素子パッケージ及びその製造方法 |
| WO2007061062A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体の製造方法 |
| WO2007061047A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体およびその製造方法 |
| WO2007061056A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置及びその製造方法 |
| WO2007061059A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置およびその製造方法 |
| JP2013105967A (ja) * | 2011-11-16 | 2013-05-30 | Nikkiso Co Ltd | 半導体パッケージ用基板及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6053054A (ja) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | 半導体装置 |
| JPS6298648A (ja) * | 1985-10-25 | 1987-05-08 | Hitachi Ltd | 半導体基体搭載用セラミックパッケージ |
-
1988
- 1988-12-06 JP JP1988158032U patent/JPH0719155Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6053054A (ja) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | 半導体装置 |
| JPS6298648A (ja) * | 1985-10-25 | 1987-05-08 | Hitachi Ltd | 半導体基体搭載用セラミックパッケージ |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250617A (ja) * | 1995-03-10 | 1996-09-27 | Nec Corp | 半導体装置の製造方法 |
| JP2006247833A (ja) * | 2005-03-07 | 2006-09-21 | Samsung Electronics Co Ltd | Ｍｅｍｓ素子パッケージ及びその製造方法 |
| WO2007061062A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体の製造方法 |
| WO2007061054A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体、および同パッケージ構造体から得られるセンサ装置 |
| WO2007061047A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体およびその製造方法 |
| WO2007061056A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置及びその製造方法 |
| WO2007061059A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置およびその製造方法 |
| US7674638B2 (en) | 2005-11-25 | 2010-03-09 | Panasonic Electric Works Co., Ltd. | Sensor device and production method therefor |
| US8026594B2 (en) | 2005-11-25 | 2011-09-27 | Panasonic Electric Works Co., Ltd. | Sensor device and production method therefor |
| US8067769B2 (en) | 2005-11-25 | 2011-11-29 | Panasonic Electric Works Co., Ltd. | Wafer level package structure, and sensor device obtained from the same package structure |
| US8080869B2 (en) | 2005-11-25 | 2011-12-20 | Panasonic Electric Works Co., Ltd. | Wafer level package structure and production method therefor |
| JP2013105967A (ja) * | 2011-11-16 | 2013-05-30 | Nikkiso Co Ltd | 半導体パッケージ用基板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719155Y2 (ja) | 1995-05-01 |
