JPH0279041U - - Google Patents
Info
- Publication number
- JPH0279041U JPH0279041U JP15862488U JP15862488U JPH0279041U JP H0279041 U JPH0279041 U JP H0279041U JP 15862488 U JP15862488 U JP 15862488U JP 15862488 U JP15862488 U JP 15862488U JP H0279041 U JPH0279041 U JP H0279041U
- Authority
- JP
- Japan
- Prior art keywords
- device hole
- hole structure
- chip
- inner lead
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15862488U JPH0279041U (en18) | 1988-12-06 | 1988-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15862488U JPH0279041U (en18) | 1988-12-06 | 1988-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279041U true JPH0279041U (en18) | 1990-06-18 |
Family
ID=31439116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15862488U Pending JPH0279041U (en18) | 1988-12-06 | 1988-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279041U (en18) |
-
1988
- 1988-12-06 JP JP15862488U patent/JPH0279041U/ja active Pending