JPH0277200A - Apparatus for supplying chip electronic component - Google Patents

Abstract

PURPOSE:To prevent failure in picking up an electronic component due to breakage of coating tape or delay of tape winding by putting, in spite of winding, the coating tape which has been peeled off from a carrier tape to one side at an opening where the electronic component is to be picked up so that the coating tape is discarded together with the carrier tape after the chip electronic component is removed therefrom. CONSTITUTION:Tape 9 drawn out of a reel 10 is guided along the lower face of a tape guide plate 15. It is further guided between a tape presser plate 16 and a tape supporting member 18 and a coating tape 9a is peeled off from a carrier tape 9b by a peeling guide member 19. At an opening 23, an electronic component 20 is removed from the tape 9 by sucking it with a suction nozzle 24 mounted at the tip of an apparatus head 4. The tapes 9b and 9a from which the electronic component 20 has been removed are coupled again with each other and guided between the tape presser plate 21 and the supporting member 18 to reach a sprocket 13. The sprocket 13 engaged with a perforation 27 rotates intermittently so that the tape is passed through a guide 25 and finally it is recovered or discarded. According to such arrangement, it is possible to obviate the need of winding the coating tape or treating the wound tape.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a tape transport type chip electronic component supply device that supplies chip electronic components to an electronic component mounting device that sequentially mounts chip electronic components onto a printed circuit board at high speed. In particular, the present invention relates to improvements suitable for processing coated tapes.

[Prior Art] In a tape conveyance-type chip electronic component supply device, electronic components are sequentially taken out from a tape made by pasting a covering tape on a carrier tape having a number of lined pockets in which chip electronic components are stored one by one. The covering tape is sequentially peeled off from the carrier tape before the removal position, and the exposed chip electronic components are successively sucked and removed from the carrier tape by a suction nozzle of an electronic component mounting device. .

In such a conventional chip electronic component supply device, the covering tape is peeled off from the carrier tape using a peeling plate, as described in Utility Model Publication No. 57-48673.

It has a mechanism that winds it onto a friction-driven take-up reel. In such a mechanism, it is necessary to always wind the same amount of coated tape on the take-up reel in synchronization with tape feeding at the same pitch, so the rotation angle of the take-up reel is smaller than that at the beginning of the first winding. In order to absorb this difference in rotation angle, the take-up reel is driven by friction, and this frictional force is applied by a mechanism such as a spring force. There is.

Moreover, after all chip electronic components housed in the tape have been taken out, it is necessary to remove the covering tape from the take-up reel.

[Problems to be Solved by the Invention] As described above, in the prior art, in order to absorb the difference in the winding angle of the coated tape take-up reel, the take-up reel is driven by frictional force, and the coated tape is When the tension increases, the frictional force activation means slips. However, adjusting this frictional force becomes more difficult as the tape feed speed increases.

In other words, if the frictional force is too strong, the covering tape will break, and if it is not peeled off, there will be a delay in winding the covering tape, which may cause a mistake in suction of the electronic component.

Another problem with the prior art is the cumbersome post-processing of the coated tape. In other words, it is necessary to manually remove the covered tape from the take-up reel after all the electronic components in the tape are used up, but the covered tape can be up to 40m long.
Moreover, since it is removed manually, it is very inconvenient to handle.9 The purpose of the present invention is to process peeled covered tape without winding it up, and to solve the problem of peeling and winding of the covered tape and to eliminate the problem of peeling and winding of the covered tape. To provide an easy-to-use chip electronic component supply device that eliminates processing.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a chip electronic component supplying device according to claim 1, 2 or 3 of the claims.

[Function] The covering tape is peeled off from the carrier tape, detours around the opening position, and is again superimposed on the carrier tape or brought close to it and discharged, so that it can be collected or cut and disposed of at the same time as the carrier tape. Therefore, there is no need for winding the coated tape or post-treatment after winding.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 6.

FIG. 1 is a schematic diagram of an electronic component mounting apparatus 1 incorporating a chip electronic component supplying apparatus according to an embodiment of the present invention. In FIG. 1, a large number of chip electronic component supply devices 2 are arranged side by side, and are moved left and right according to commands from a controller 3, and one selected electronic component supply device 2 stops at a predetermined position. When it stops, the electronic component supply device 2
The chip electronic components stored in the inner tape are mounted by a mounting head 4 supported by an index rotating disk 5.
They are attracted by vacuum action or the like, are intermittently rotated by the index rotating disk 5, and after their postures are corrected along the way, they are sequentially mounted on the printed circuit boards on the XY table G.

FIG. 2 shows an overall side view of a chip electronic component supplying device 2 as an embodiment of the present invention for supplying chip electronic components to the electronic component mounting device 1. As shown in FIG. 3 is a perspective view of the part circled in FIG. 2, FIG. 4 is a perspective view of the peeling guide member 19 alone, FIG. 5 is a sectional view taken along line BB in FIG. 3, and FIG. is a plan view of FIG. 3 viewed from direction C.

In FIG. 2, reference numeral 8 denotes a fixing plate for axially supporting the reel 10 of the tape 9 in which chip electronic components are housed;
1 is a lever that is pivotally supported by the fixed plate 8 and driven to swing; 12 is a sprocket drive pawl that is pivotally supported by the swinging lever 11; 1;
3 is a sprocket that is pivotally supported by the fixed plate 8 and is intermittently rotated by the pawl 12; 14 is a member for preventing the sprocket 13 from reversing.

15 is a tape guide plate, and 16 is a tape holding plate, both of which are integrated, and are given rotational force by a spring 17 about a fulcrum 15a (which is attached to the fixed plate 8) to support the tape. A tape retainer 16 is pressed against the member 18. The tape support member 18 is attached to the fixed plate 8. A mounting plate 20 is fixed to the tape downstream end of the tape holding plate 16, and the mounting plate 20 is integrally connected to a wedge-shaped peeling guide member 19 at both ends. Another tape holding plate 21 is attached to the. 22 is a peeling guide member 19
The mount attached is a spring to force the plate 20 towards the tape support member 18. 23 is a peeling guide member 19
This is an opening for taking out a chip electronic component provided in the holder, and is located at a position facing the suction nozzle 24. 25 is an empty tape guide.

First, the operation of the chip electronic component supplying apparatus 2 of this embodiment will be briefly described. The tape 9 includes a carrier tape 9b having a large number of lined-up pockets 26 each housing a chip electronic component 29, and a covering tape affixed to the surface of the carrier tape 9b to prevent the electronic components from scattering. It consists of 9a. Tape 9 pulled out from reel 10
is guided along the lower surface of the tape guide plate 15, sandwiched between the tape presser plate 16 and the tape supporting member 18, and the covering tape 9a is peeled off from the carrier tape 9b by the peeling guide member 19, and the cover tape 9a is peeled off from the carrier tape 9b through the opening 23. The exposed electronic component 29 is sucked by the suction nozzle 24 at the tip of the device head 4 and taken out, and then the empty carrier tape 9b and the covering tape 9a are put together again and held between the tape pressing plate 21 and the tape support member 18. and reaches sprocket 13. Here, perforation 2 provided on one side edge of the empty tape
Due to the intermittent rotation of the sprocket 13 that engages with the sprocket 7, the tape coming out of the reel 10 is pulled along the above-mentioned path. Thereafter, the empty tape passes through the guide 25 and is cut as appropriate or collected and discarded as is.

Now, a more detailed explanation will be given below with reference to FIGS. 2 to 6.

The peeling guide member 19 is attached to the inner side of the plate 20 on its l side, and one end of the plate 20 is fixed to the tape holding plate 16, and the other end is fixed to the tape holding plate 21. There is. The covering tape 9a of the tape 9 released from the tape holding plate 16 is peeled off from the carrier tape 9b at the wedge-shaped end 19a of the peeling guide member 19, and the carrier tape 9
b is sandwiched between the lower surface of the peeling guide plate 19 and the tape support member 18, and the covering tape 9a is attached to the upper and side surfaces of the peeling guide member 19 as described below and moves to the right.

If the entire length is divided into five parts, the peeling guide member 19 peels off the covering tape 9a from the carrier tape 9b at the first division 19a and lifts one side of it, and rotates the covering tape 9a by about 90 degrees at the second division 19b. Raise it to one side, 3
Opening 2 by moving the covering tape 9a to one side at the dividing opening 19c:
Leave a space above the carrier tape 9b at the 3rd position, return to the 2nd division state at the 4th division 19d, and open the 5th division opening 19e.
The slopes 19a to 19 (numbered 3) are such that one side gradually slopes to return to its original state and finally returns to its original state. It is opened.

In addition, the mounting is such that both ends of the plate 20 have a U-shaped cross section that straddles the tape as a guide to prevent the carrier tape from shifting laterally.

The operation of the chip electronic component supply device 2 described above will be explained. In FIG. 2, the tape pulled out from the reel 10 extends along the lower surface of the guide plate 15 and the tape presser plate 16
and the tape support member 18, and the peeling guide member 1
At step 9, the covering tape 9a is separated from the carrier tape 9b as shown in FIG. The cover tape 9a and the carrier tape 9b are sucked by the provided suction nozzle 24, and then the covering tape 9a and the carrier tape 9b are brought together again, passed between the tape presser plate 21 and the tape support member 18, and the perforated shims on the side edges of the tape 9 are removed. 27 is engaged with the sprocket 13. In FIG. 2, the swing lever 11 is swung in synchronization with the operation of the electronic component mounting device 1, and the sprocket 13 is intermittently rotated clockwise in the figure by the mechanical driving pawl 12 in contact with it. , the tape 9 is intermittently pulled and conveyed rightward in the figure at a pitch corresponding to the interval between the pockets 26. The covering tape 9a stuck to the carrier tape 9b is peeled off from the carrier tape 9b by the peeling guide member 19, and as it progresses, it is moved to one side so as to rotate by nearly 90 degrees. Pocket 2 of carrier tape 9b from which covering tape 9a has been peeled off in this way
The chip electronic component 29 inside 6 is exposed at the opening 23 position.

The carrier tape 9b is vacuum-sucked by the vacuum suction nozzle 24 that descends thereon, and is sequentially taken out from pockets 1 to 26 of the carrier tape 9b, and then mounted on the printed circuit board 7 on the XY child table. The empty carrier tape 9b from which the chip electronic components have been taken out is combined with the covering tape 9a again, passes between the tape holding plate 21 and the tape support member 18, and is guided from the guide 25 via the sub-button 1-13. The material is either collected as is or cut into an appropriate length with a cutter (not shown) and disposed of. In order to feed the recombined covering tape 9a and carrier tape 9b, it is more reliable to guide the two tapes by sandwiching them between the sprocket 13 and an idler (not shown) that rotates in synchronization with the sprocket 13.

Other embodiments of the invention are shown in FIGS. 7 and 8.

FIG. 8 is a view of FIG. 7 viewed from direction D. Portions that are the same as or correspond to those in the previous embodiment are designated by the same reference numerals. In this embodiment, there is no peeling guide member as described above, and the attachment is to the plate 2.
The cover tape 9a is removed from the carrier tape 9b at the tip 16a of the tape presser plate 16 extending halfway into the opening of 0.
After the carrier tape 9b is peeled off and the chip electronic component is suctioned and taken out by the suction nozzle 24, the carrier tape 9b passes under the tape pressing plate 21 and engages with the sprocket 13.

On the other hand, the peeled off covering tape 9a reaches the sprocket 1-13 via a pulley 30, 30' pivoted on the fixed plate 8, where it is combined with the empty carrier tape 9b, and then both tapes 9a, 9b passes through guide 25 and is disposed of in the same manner as in the previous embodiment. Between pulleys 30 and 30',
The covering tape 9a is.

In order not to interfere with the suction nozzle 24, it is shifted laterally by a tape guide 32 attached to the fixed plate 8. Pulley 30.30' is sprocket 13
The sprocket 13 is driven by a rubber belt 33 in synchronization with the rotation of the sprocket 13.

31.31'' is a pressing rubber roller that prevents the covering tape 9a from coming off the pulley and sprocket.

In one or more embodiments, the bypassed covered tape after peeling is again overlapped with the carrier tape and discharged, but this is not necessarily the case unless it causes inconvenience in its collection and disposal. The covering tape may be discharged in close proximity to the carrier tape without overlapping.

[Effects of the Invention] According to the present invention, the covering tape that has been peeled off from the carrier tape is moved to one side at the opening at the chip electronic component suction position without being wound up, and after the chip electronic component is taken out, the covering tape is removed again. Since the cover tape is discarded together with the carrier tape, the inconvenience associated with conventional winding of the cover tape onto the take-up reel, that is, the failure of electronic component suction due to breakage of the cover tape or delay in winding, is eliminated. Furthermore, ease of use is improved by eliminating the need for post-processing such as removing the covering tape from the take-up reel.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view of an electronic component mounting apparatus incorporating a chip electronic component supplying apparatus according to an embodiment of the present invention, and FIG. 2 is an overall side view of the chip electronic component supplying apparatus according to an embodiment of the present invention. 3 is a detailed perspective view of part A in FIG. 2, FIG. 4 is a perspective view of the peeling guide member in the same embodiment, and FIG.
The figure is a sectional view taken along line B-B in FIG. 3, FIG. 6 is a plan view of FIG. 3 seen from direction C, and FIGS. 7 and 8 are side views and plan views of other embodiments of the present invention. It is a diagram. 1... Electronic component mounting device 2... Chip electronic component supply device 8... Fixing plate 9... Tape 9a...
Covering tape 9b...Carrier tape 10...
Reel 11... Swinging lever 12... Moving pawl 13... Sprocket 14... Reverse rotation prevention member 15... Tape guide handling 16... Tape holding plate 17... Spring 18... tape support member
19...Peeling guide plate 20...Mounting plate 2
1...Tape holding plate 22-0. Spring 2:
3... Opening 24... Suction nozzle 25... Guide 26... Pocket 27... Perforation 4-in 29... Chip electronic component 30.30'...
Pulley 31, 31'... Presser rubber roller 32... Tape guide Figure 2 Figure 5 Figure 6? q 29: Chip electronic components Fig. 7 Fig. 8

Claims (1)

[Scope of Claims] 1. A carrier tape having pockets lined up in the longitudinal direction containing chip electronic components and having a removable covering tape affixed to the upper surface is moved to an opening position where the chip electronic component removal means moves up and down. In a chip electronic component supply device, the covering tape is peeled off from the carrier tape before the opening position, and the carrier tape is intermittently pulled and discharged by an intermittent drive means downstream of the opening position. , the covering tape peeled off from the carrier tape is detoured around the opening position so as not to interfere with the chip electronic component ejecting means, and then overlapped or brought close to the carrier tape on the downstream side of the opening position, and together with the carrier tape. A chip electronic component supply device comprising a covering tape guide means for discharging the covered tape. 2. The covering tape guide means is composed of a peeling guide member, and the peeling guide member peels the covering tape from the carrier tape with a wedge-shaped portion at its tip, guides the carrier tape along the lower surface of the peeling guide member, and peels off the covering tape. The coated tape is gradually rotated approximately 90 degrees to one side along the top and side surfaces of the peeling guide member until it reaches the opening position, and after passing the opening position, The covering tape is guided along the side and top surfaces of the peeling guide member so as to gradually return to its original position, and at the rear end of the peeling guide member, the covering tape is advanced along the lower surface of the peeling guide member. 2. The chip electronic component supply device according to claim 1, further comprising a member having a shape to be overlapped again with a carrier tape that has been carried. 3. The covering tape guide means guides the covering tape peeled off from the carrier tape around the opening position so as not to interfere with the chip electronic component removal means, and then overlays the covering tape on the carrier tape. 2. The chip electronic component supply device according to claim 1, further comprising a pulley and a tape guide that guide the intermittent drive means.