JPH0276850U - - Google Patents
Info
- Publication number
- JPH0276850U JPH0276850U JP15758288U JP15758288U JPH0276850U JP H0276850 U JPH0276850 U JP H0276850U JP 15758288 U JP15758288 U JP 15758288U JP 15758288 U JP15758288 U JP 15758288U JP H0276850 U JPH0276850 U JP H0276850U
- Authority
- JP
- Japan
- Prior art keywords
- mount
- circuit pattern
- internal leads
- chip
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005611 electricity Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15758288U JPH0276850U (US06168776-20010102-C00028.png) | 1988-12-01 | 1988-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15758288U JPH0276850U (US06168776-20010102-C00028.png) | 1988-12-01 | 1988-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276850U true JPH0276850U (US06168776-20010102-C00028.png) | 1990-06-13 |
Family
ID=31437149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15758288U Pending JPH0276850U (US06168776-20010102-C00028.png) | 1988-12-01 | 1988-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276850U (US06168776-20010102-C00028.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6033457B2 (ja) * | 1981-09-22 | 1985-08-02 | カワサキ機工株式会社 | 製茶粗揉方法及び製茶粗揉装置 |
-
1988
- 1988-12-01 JP JP15758288U patent/JPH0276850U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6033457B2 (ja) * | 1981-09-22 | 1985-08-02 | カワサキ機工株式会社 | 製茶粗揉方法及び製茶粗揉装置 |
