JPH0275890U - - Google Patents
Info
- Publication number
- JPH0275890U JPH0275890U JP15430888U JP15430888U JPH0275890U JP H0275890 U JPH0275890 U JP H0275890U JP 15430888 U JP15430888 U JP 15430888U JP 15430888 U JP15430888 U JP 15430888U JP H0275890 U JPH0275890 U JP H0275890U
- Authority
- JP
- Japan
- Prior art keywords
- speaker
- headphone
- damping material
- metal outer
- outer container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Headphones And Earphones (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Description
第１図はこの考案のヘツドホンセツトの１実施
例を示す概略図であり、第２図は本考案のヘツド
ホン部の内部構成を示した断面図である。
１：スピーカ、３：スピーカ保持部材、５：制
振材、６：金属製外郭容器、８：骨伝導マイク。
FIG. 1 is a schematic diagram showing an embodiment of the headphone set of the present invention, and FIG. 2 is a sectional view showing the internal structure of the headphone section of the present invention. 1: Speaker, 3: Speaker holding member, 5: Damping material, 6: Metal outer container, 8: Bone conduction microphone.
Claims (1)
して遮音効果を付与する制振材と、前記金属性外
郭容器の周縁部に略長円型パツドより構成される
２つのヘツドホン部を有し、 前記ヘツドホン部の少なくとも一方は、制振材
の内側に音源であるスピーカーと、その周囲にス
ピーカー保持部材を有し、さらにヘツドホン部の
少なくとも一方には略長円型パツドに骨伝導マイ
クを有することを特徴とするヘツドホンセツト。[Claims for Utility Model Registration] Consists of a substantially bowl-shaped metal outer container, a damping material that adheres to the inside of the container to provide a sound insulation effect, and a substantially elliptical pad on the periphery of the metal outer container. At least one of the headphone parts has a speaker serving as a sound source inside a damping material and a speaker holding member around the speaker, and furthermore, at least one of the headphone parts has a substantially long speaker. A headphone set characterized by having a bone conduction microphone in a circular pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15430888U JPH0275890U (en) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15430888U JPH0275890U (en) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275890U true JPH0275890U (en) | 1990-06-11 |
Family
ID=31430922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15430888U Pending JPH0275890U (en) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275890U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010157974A (en) * | 2009-01-05 | 2010-07-15 | Audio Technica Corp | Headset with built-in bone conduction microphone |
-
1988
- 1988-11-29 JP JP15430888U patent/JPH0275890U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010157974A (en) * | 2009-01-05 | 2010-07-15 | Audio Technica Corp | Headset with built-in bone conduction microphone |