JPH0275795U - - Google Patents
Info
- Publication number
- JPH0275795U JPH0275795U JP15507288U JP15507288U JPH0275795U JP H0275795 U JPH0275795 U JP H0275795U JP 15507288 U JP15507288 U JP 15507288U JP 15507288 U JP15507288 U JP 15507288U JP H0275795 U JPH0275795 U JP H0275795U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- printed wiring
- tongue
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15507288U JPH0275795U (xx) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15507288U JPH0275795U (xx) | 1988-11-28 | 1988-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0275795U true JPH0275795U (xx) | 1990-06-11 |
Family
ID=31432368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15507288U Pending JPH0275795U (xx) | 1988-11-28 | 1988-11-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0275795U (xx) |
-
1988
- 1988-11-28 JP JP15507288U patent/JPH0275795U/ja active Pending