JPH0275772U - - Google Patents
Info
- Publication number
- JPH0275772U JPH0275772U JP15573188U JP15573188U JPH0275772U JP H0275772 U JPH0275772 U JP H0275772U JP 15573188 U JP15573188 U JP 15573188U JP 15573188 U JP15573188 U JP 15573188U JP H0275772 U JPH0275772 U JP H0275772U
- Authority
- JP
- Japan
- Prior art keywords
- board
- hole
- solder resist
- double
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15573188U JPH0275772U (sh) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15573188U JPH0275772U (sh) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275772U true JPH0275772U (sh) | 1990-06-11 |
Family
ID=31433617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15573188U Pending JPH0275772U (sh) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275772U (sh) |
-
1988
- 1988-11-29 JP JP15573188U patent/JPH0275772U/ja active Pending