JPH0275738U - - Google Patents
Info
- Publication number
- JPH0275738U JPH0275738U JP15490188U JP15490188U JPH0275738U JP H0275738 U JPH0275738 U JP H0275738U JP 15490188 U JP15490188 U JP 15490188U JP 15490188 U JP15490188 U JP 15490188U JP H0275738 U JPH0275738 U JP H0275738U
- Authority
- JP
- Japan
- Prior art keywords
- pressure welding
- block
- heating element
- welding block
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15490188U JPH0275738U (de) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15490188U JPH0275738U (de) | 1988-11-30 | 1988-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0275738U true JPH0275738U (de) | 1990-06-11 |
Family
ID=31432047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15490188U Pending JPH0275738U (de) | 1988-11-30 | 1988-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0275738U (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0465156A (ja) * | 1990-07-05 | 1992-03-02 | Toshiba Corp | 半導体装置の冷却器 |
-
1988
- 1988-11-30 JP JP15490188U patent/JPH0275738U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0465156A (ja) * | 1990-07-05 | 1992-03-02 | Toshiba Corp | 半導体装置の冷却器 |