JPH0275727U - - Google Patents
Info
- Publication number
- JPH0275727U JPH0275727U JP15585888U JP15585888U JPH0275727U JP H0275727 U JPH0275727 U JP H0275727U JP 15585888 U JP15585888 U JP 15585888U JP 15585888 U JP15585888 U JP 15585888U JP H0275727 U JPH0275727 U JP H0275727U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- support base
- divided piece
- tiltable
- pivoting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15585888U JPH0275727U (un) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15585888U JPH0275727U (un) | 1988-11-29 | 1988-11-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0275727U true JPH0275727U (un) | 1990-06-11 |
Family
ID=31433861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15585888U Pending JPH0275727U (un) | 1988-11-29 | 1988-11-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0275727U (un) |
-
1988
- 1988-11-29 JP JP15585888U patent/JPH0275727U/ja active Pending