JPH0275726U - - Google Patents
Info
- Publication number
- JPH0275726U JPH0275726U JP15500288U JP15500288U JPH0275726U JP H0275726 U JPH0275726 U JP H0275726U JP 15500288 U JP15500288 U JP 15500288U JP 15500288 U JP15500288 U JP 15500288U JP H0275726 U JPH0275726 U JP H0275726U
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- base
- solder
- irradiate
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15500288U JPH0275726U (cs) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15500288U JPH0275726U (cs) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275726U true JPH0275726U (cs) | 1990-06-11 |
Family
ID=31432233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15500288U Pending JPH0275726U (cs) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275726U (cs) |
-
1988
- 1988-11-28 JP JP15500288U patent/JPH0275726U/ja active Pending