JPH0275725U - - Google Patents
Info
- Publication number
- JPH0275725U JPH0275725U JP15444288U JP15444288U JPH0275725U JP H0275725 U JPH0275725 U JP H0275725U JP 15444288 U JP15444288 U JP 15444288U JP 15444288 U JP15444288 U JP 15444288U JP H0275725 U JPH0275725 U JP H0275725U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- analog
- chip
- adhesive
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000008602 contraction Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15444288U JPH0275725U (th) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15444288U JPH0275725U (th) | 1988-11-28 | 1988-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0275725U true JPH0275725U (th) | 1990-06-11 |
Family
ID=31431174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15444288U Pending JPH0275725U (th) | 1988-11-28 | 1988-11-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0275725U (th) |
-
1988
- 1988-11-28 JP JP15444288U patent/JPH0275725U/ja active Pending