JPH0275479A - Method and device for diffusion joining - Google Patents

Abstract

PURPOSE:To reduce the joining time of materials to be joined and to improve joining performance thereof by heating the materials to be joined in a vacuum or an inert gas atmosphere and giving amplitude oscillation to the mutual contact surfaces by frequency under ultrasonic waves while applying compression load on the contact surfaces and then, applying the prescribed compression load thereon. CONSTITUTION:The materials 1 and 2 to be joined are brought into contact with each other in the vacuum or the inert gas atmosphere and held by holders 6 and 8 of the materials to be joined and fitted to a vertical bearing 7 and a horizontal bearing 9 and these contact surfaces are heated to the prescribed temperature by a heating coil 3. While applying compression load on the contact surfaces of the materials 1 and 2 to be joined by a horizontal actuator 5, amplitude sliding is given to the mutual contact surfaces by frequency under ultrasonic waves by a vertical actuator 4 and then, amplitude sliding of the vertical actuator 4 is stopped and the prescribed compression load is applied to the contact surfaces of the materials 1 and 2 to be joined by the horizontal actuator 5 and these are subjected to diffusion joining.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a diffusion bonding method and apparatus for bonding metals such as Mo, Ta, and Ti, ceramic materials, etc., which are used, for example, in precision machining of aircraft parts. Ru,.

[Prior Art] Diffusion bonding may be used in cases where various types of fusion bonding are difficult, in cases where precise assembly and bonding are required, or in cases where dissimilar materials are bonded.

The principle of diffusion bonding is that clean, smooth surfaces are brought into contact with each other and heated, and when pressure is applied until the contact surfaces become microscopically intimate, cohesive force is created between atoms, and crystal grains around the interface grow due to thermal diffusion of atoms. However, since there is actually a surface film on the contact surface, joining is not easy and takes a long time.

[Problem to be solved by the invention] Since diffusion bonding is an interfacial phenomenon, it is a necessary condition to remove the surface coating on the bonding surface, and until now this has been removed by statically applying pressure while heating the interface for a long time. Productivity is low, and depending on the material, compounds may form at the interface due to long-term heating, deteriorating bonding performance.

In addition, the smoothness of the bonding surface greatly affects the bonding time, so the cost is high due to precision machining as much as possible.

Due to the low productivity and high cost, the fields in which diffusion bonding can be used have been limited.

The present invention has been made in view of the above circumstances.

It is an object of the present invention to provide a diffusion bonding method and apparatus that can improve productivity by bonding in a short time and reduce costs by slowing precision processing.

[Means and effects for solving the problem] In order to achieve the above-mentioned object, the present invention physically destroys the surface coating of the surfaces to be joined of workpieces by amplitude vibration or compressive vibration load and joins them. .

This aims to shorten the bonding time and at the same time reduce processing costs by eliminating the need for rigorous mirror-finish precision machining of the bonding surfaces. In other words, in the present invention, the joining process is divided into two parts, and the first step involves removing the surface coating on the surfaces of the workpieces to be joined, and then applying vibration sliding to the contact surfaces heated to a predetermined temperature in a vacuum or inert gas atmosphere. Alternatively, a compressive vibration load is applied to increase 3-surface film failure or microcreep failure to generate a new surface, and the interfaces become familiar with each other by an amplitude sliding or compressive vibration load to facilitate microscopic adhesion.

The second step is pressure bonding, in which when the new surfaces generated in the previous step are pressurized, thermal diffusion of atoms occurs in a short time, promoting bonding.

[Example] Embodiments of the present invention will be described in detail below with reference to the drawings.

Fig. 1 is an explanatory diagram of the principle of the present invention, in which workpieces 1 and 2 to be joined are supported by corresponding workpiece holders 6°8 in a vacuum or inert gas atmosphere. are placed in contact with each other.

A high frequency heating coil 3 is provided near the contact surface between the workpiece 1 and the workpiece 2 and heated to a predetermined temperature. The workpiece holders 6.8 each have a corresponding vertical bearing 7.
．． Mounted on horizontal bearing 9.

A horizontal actuator 5 is attached to this workpiece holder 8, and this horizontal actuator 5 applies a compressive load or compressive vibration load to the workpiece 2 in the horizontal direction. A vertical actuator 4 is attached to the workpiece holder 6, and when the vertical actuator 4 is vibrated with a predetermined amplitude, the contact surfaces of the workpieces 1 and 2 mutually undergo amplitude sliding of vibratory sliding. and destroys the surface film.

Further, when the horizontal actuator 5 is vibrated with a predetermined compressive load, the contact interface between the workpiece 1 and the workpiece 2 receives the compressive vibration load, and the contact interface between the workpieces 1 and 2 is closely bonded due to microscopic leap fatigue.

Note that the compressive vibration load is applied to the contact interface between the workpiece 1 and the workpiece 2 while changing the strength of the compressive load.

That is, in a vacuum or an inert gas atmosphere, the joining surfaces of the workpiece 1 and the workpiece 2 are brought into contact with each other and held in the workpiece holder 6.8, and the vertical bearing 7. It is attached to a horizontal bearing 9, and the contact surface between the workpiece 1 and the workpiece 2 is heated to a predetermined temperature by a heating coil 3.

A horizontal actuator 5 applies a compressive load of, for example, ID/m2 or less, to the contact surfaces of the workpiece 1 and the workpiece 2, and a vertical actuator 4 applies a compressive load to the contact surfaces of the workpiece 1 and the workpiece 2 at a frequency below ultrasonic waves, for example, 1000Hz or below. 0.1~10am
After applying the amplitude sliding motion, the amplitude sliding motion of the vertical actuator 4 is stopped, and a predetermined compressive load is applied to the contact surfaces of the workpieces 1 and 2 by the horizontal actuator 5 to perform diffusion bonding. In addition, when applying an amplitude sliding motion to the contact surfaces of the workpiece 1 and the workpiece 2 with the vertical actuator 4, the amplitude sliding may be performed in a straight line by reciprocating the workpiece 1, or in an arc shape. It may also be reciprocated and slid in an arcuate manner.

Further, the joining surfaces of the workpiece 1 and the workpiece 2 are brought into contact in a vacuum or an inert gas atmosphere, heated to a predetermined temperature, and a horizontal actuator 5 is applied to the contact surface at a temperature of, for example, 5 Kfl.
Diffusion bonding may be performed by applying a compressive vibration load such as /u2 or less.

Further, the joining surfaces of the workpiece 1 and the workpiece 2 are brought into contact in a vacuum or an inert gas atmosphere and heated to a predetermined temperature, and a horizontal actuator 5 is applied to this contact surface to, for example, 5! g
After applying a compressive vibration type such as /ll112 or less, the compressive vibration load of the horizontal actuator 5 is stopped, and a predetermined compressive load is applied by the horizontal actuator 5 to the contact surface between the workpiece 1 and the workpiece 2 to perform diffusion bonding. You may.

FIG. 2 shows an example of an apparatus embodying the present invention, in which workpieces 23. Each of the workpieces 24 is attached to a corresponding workpiece holder 25. Vertical bearing 19 .held by workpiece holder 26 . It is attached to a horizontal bearing 20 and set in the chamber 18 so that the joining surfaces of the workpiece 23 and the workpiece 24 are in contact with each other. The chamber 18
The interior is maintained in a vacuum or inert gas atmosphere by an atmosphere regulator 11.

The joining surfaces of the workpieces 23 and 24 are heated by a heating coil 22 connected to a high-frequency heater 12, and the temperature is measured by a radiation thermometer 21 and maintained at a predetermined temperature by a temperature controller 13. Ru.

The chamber 18 is provided with a horizontal actuator 16 and a vertical actuator 17, and the vibration controller 15 controls the hydraulic pressure generator 1.
The operation of each actuator 16, 17 is controlled by electrically controlling the servo valves 27 and 28 provided in the servo valves 27 and 28, and a compressive load or amplitude sliding is applied to the contact surface between the workpiece 23 and the workpiece 24.
Or apply compressive vibration load.

The operation of the diffusion bonding process is as shown in Fig. 1, which explains the principle.
Vibration is applied to either the horizontal actuator 16 or the vertical actuator 17 to apply compressive load, amplitude sliding, or compressive vibration load to the contact surface between the workpiece 23 and the workpiece 24, thereby causing the workpiece 23 and the workpiece 24 to move. Diffusion bonding is performed by promoting close contact between the contact surfaces of the workpieces 24.

[Effects of the Invention] As described above, according to the present invention, the bonding time can be significantly shortened and the bonding performance can be improved by vibrating the contact surfaces or applying a compressive vibration load. I was able to figure it out. Moreover, the processing cost of the joint surface could be reduced.

[Brief explanation of the drawing]

FIG. 1 is a configuration explanatory diagram for explaining the principle of an embodiment of the present invention, and FIG. 2 is a configuration explanatory diagram showing an example of a device embodying the present invention. 1.2.23.24... Workpiece, 3.22... Heating coil, 4.17... Vertical actuator, 5°16
...Horizontal actuator, 6,8,25.26...Workpiece holder, 7.19...Vertical bearing, 9°20.
...Horizontal bearing, 11...Atmosphere regulator, 12...High frequency heating machine, 13...Temperature controller, 14...Hydraulic pressure controller, 15...Excitation controller, 18... Chamber. 21... Radiation thermometer. Applicant's agent Patent attorney Takehiko Suzue Figure 1

Claims (4)

[Claims] (1) In a vacuum or inert gas atmosphere, the surfaces of the workpieces to be joined are brought into contact and heated to a predetermined temperature, and while applying a compressive load to the contact surfaces, the contact surfaces are subjected to amplitude sliding at a frequency less than ultrasonic waves. 1. A diffusion bonding method, characterized in that, after applying a motion, the amplitude sliding is stopped and a predetermined compressive load is applied to the contact surface of the workpieces to join them. (2) A diffusion bonding method characterized in that surfaces of workpieces to be bonded are brought into contact in a vacuum or an inert gas atmosphere, heated to a predetermined temperature, and bonded by applying a compressive vibration load to the contact surfaces. (3) In a vacuum or inert gas atmosphere, the surfaces to be joined of the workpieces are brought into contact and heated to a predetermined temperature, a compressive vibration load is applied to this contact surface, and then the compressive vibration load is stopped and the workpieces are heated to a predetermined temperature. A diffusion bonding method characterized by applying a predetermined compressive load to the contact surfaces of the . (4) A container whose interior is in a vacuum or inert gas atmosphere, a device in which the surface of the workpiece to be joined is placed in contact with the container, and a contact surface of the workpiece placed by this device. A diffusion bonding apparatus characterized by comprising a device that applies a compressive load, an amplitude sliding motion, or a compressive vibration load, and a device that heats the contacting surface of the workpiece.