JPH0274765U - - Google Patents
Info
- Publication number
- JPH0274765U JPH0274765U JP15453788U JP15453788U JPH0274765U JP H0274765 U JPH0274765 U JP H0274765U JP 15453788 U JP15453788 U JP 15453788U JP 15453788 U JP15453788 U JP 15453788U JP H0274765 U JPH0274765 U JP H0274765U
- Authority
- JP
- Japan
- Prior art keywords
- crimp
- diameter
- core wire
- parts
- crimp terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002788 crimping Methods 0.000 claims description 2
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15453788U JPH0274765U (sl) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15453788U JPH0274765U (sl) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0274765U true JPH0274765U (sl) | 1990-06-07 |
Family
ID=31431355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15453788U Pending JPH0274765U (sl) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0274765U (sl) |
-
1988
- 1988-11-28 JP JP15453788U patent/JPH0274765U/ja active Pending