JPH02744U - - Google Patents
Info
- Publication number
- JPH02744U JPH02744U JP1988078503U JP7850388U JPH02744U JP H02744 U JPH02744 U JP H02744U JP 1988078503 U JP1988078503 U JP 1988078503U JP 7850388 U JP7850388 U JP 7850388U JP H02744 U JPH02744 U JP H02744U
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- bonding
- bumps
- stacked
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
-
- H10W72/07551—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078503U JPH02744U (OSRAM) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078503U JPH02744U (OSRAM) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02744U true JPH02744U (OSRAM) | 1990-01-05 |
Family
ID=31303425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988078503U Pending JPH02744U (OSRAM) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02744U (OSRAM) |
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1988
- 1988-06-13 JP JP1988078503U patent/JPH02744U/ja active Pending