JPH02738U - - Google Patents

Info

Publication number
JPH02738U
JPH02738U JP7810388U JP7810388U JPH02738U JP H02738 U JPH02738 U JP H02738U JP 7810388 U JP7810388 U JP 7810388U JP 7810388 U JP7810388 U JP 7810388U JP H02738 U JPH02738 U JP H02738U
Authority
JP
Japan
Prior art keywords
lsi
heat dissipation
dissipation device
wrapping
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7810388U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7810388U priority Critical patent/JPH02738U/ja
Publication of JPH02738U publication Critical patent/JPH02738U/ja
Pending legal-status Critical Current

Links

JP7810388U 1988-06-13 1988-06-13 Pending JPH02738U (US06633600-20031014-M00021.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7810388U JPH02738U (US06633600-20031014-M00021.png) 1988-06-13 1988-06-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7810388U JPH02738U (US06633600-20031014-M00021.png) 1988-06-13 1988-06-13

Publications (1)

Publication Number Publication Date
JPH02738U true JPH02738U (US06633600-20031014-M00021.png) 1990-01-05

Family

ID=31303052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7810388U Pending JPH02738U (US06633600-20031014-M00021.png) 1988-06-13 1988-06-13

Country Status (1)

Country Link
JP (1) JPH02738U (US06633600-20031014-M00021.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051874A (ja) * 2014-09-02 2016-04-11 トヨタ自動車株式会社 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051874A (ja) * 2014-09-02 2016-04-11 トヨタ自動車株式会社 半導体装置及びその製造方法

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