JPH0273763U - - Google Patents

Info

Publication number

JPH0273763U

JPH0273763U JP15348688U JP15348688U JPH0273763U JP H0273763 U JPH0273763 U JP H0273763U JP 15348688 U JP15348688 U JP 15348688U JP 15348688 U JP15348688 U JP 15348688U JP H0273763 U JPH0273763 U JP H0273763U

Authority

JP

Japan

Prior art keywords

metal plate

circuit layer

hole

wiring board

printed wiring

Prior art date

1988-11-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002184 metal Substances 0.000 claims description 7
• 229910052751 metal Inorganic materials 0.000 claims description 7
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1