JPH0273080U - - Google Patents
Info
- Publication number
- JPH0273080U JPH0273080U JP15255588U JP15255588U JPH0273080U JP H0273080 U JPH0273080 U JP H0273080U JP 15255588 U JP15255588 U JP 15255588U JP 15255588 U JP15255588 U JP 15255588U JP H0273080 U JPH0273080 U JP H0273080U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- connector
- fitting portion
- insulating board
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 239000011889 copper foil Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15255588U JPH0273080U (zh) | 1988-11-25 | 1988-11-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15255588U JPH0273080U (zh) | 1988-11-25 | 1988-11-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0273080U true JPH0273080U (zh) | 1990-06-04 |
Family
ID=31427589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15255588U Pending JPH0273080U (zh) | 1988-11-25 | 1988-11-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0273080U (zh) |
-
1988
- 1988-11-25 JP JP15255588U patent/JPH0273080U/ja active Pending