JPH0272582U - - Google Patents
Info
- Publication number
- JPH0272582U JPH0272582U JP15074888U JP15074888U JPH0272582U JP H0272582 U JPH0272582 U JP H0272582U JP 15074888 U JP15074888 U JP 15074888U JP 15074888 U JP15074888 U JP 15074888U JP H0272582 U JPH0272582 U JP H0272582U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- soldering
- pattern
- mounted component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15074888U JPH0272582U (pl) | 1988-11-21 | 1988-11-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15074888U JPH0272582U (pl) | 1988-11-21 | 1988-11-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0272582U true JPH0272582U (pl) | 1990-06-01 |
Family
ID=31424166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15074888U Pending JPH0272582U (pl) | 1988-11-21 | 1988-11-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0272582U (pl) |
-
1988
- 1988-11-21 JP JP15074888U patent/JPH0272582U/ja active Pending