JPH0272555U - - Google Patents

Info

Publication number

JPH0272555U

JPH0272555U JP15164488U JP15164488U JPH0272555U JP H0272555 U JPH0272555 U JP H0272555U JP 15164488 U JP15164488 U JP 15164488U JP 15164488 U JP15164488 U JP 15164488U JP H0272555 U JPH0272555 U JP H0272555U

Authority

JP

Japan

Prior art keywords

molded

hood

semiconductor device

resin

semiconductor

Prior art date

1988-11-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 8
• 239000011347 resin Substances 0.000 claims description 5
• 229920005989 resin Polymers 0.000 claims description 5
• 239000000463 material Substances 0.000 claims description 3
• 239000008188 pellet Substances 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims description 2
• 239000011800 void material Substances 0.000 claims 1
• 238000002347 injection Methods 0.000 description 1
• 239000007924 injection Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1