JPH0272536U - - Google Patents

Info

Publication number
JPH0272536U
JPH0272536U JP1988150745U JP15074588U JPH0272536U JP H0272536 U JPH0272536 U JP H0272536U JP 1988150745 U JP1988150745 U JP 1988150745U JP 15074588 U JP15074588 U JP 15074588U JP H0272536 U JPH0272536 U JP H0272536U
Authority
JP
Japan
Prior art keywords
circuit electrode
metal plate
wiring board
printed wiring
electrode portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988150745U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988150745U priority Critical patent/JPH0272536U/ja
Publication of JPH0272536U publication Critical patent/JPH0272536U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4807Shape of bonding interfaces, e.g. interlocking features
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4845Details of ball bonds
    • H01L2224/48451Shape
    • H01L2224/48453Shape of the interface with the bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1988150745U 1988-11-21 1988-11-21 Pending JPH0272536U (US07968547-20110628-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988150745U JPH0272536U (US07968547-20110628-C00004.png) 1988-11-21 1988-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988150745U JPH0272536U (US07968547-20110628-C00004.png) 1988-11-21 1988-11-21

Publications (1)

Publication Number Publication Date
JPH0272536U true JPH0272536U (US07968547-20110628-C00004.png) 1990-06-01

Family

ID=31424160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988150745U Pending JPH0272536U (US07968547-20110628-C00004.png) 1988-11-21 1988-11-21

Country Status (1)

Country Link
JP (1) JPH0272536U (US07968547-20110628-C00004.png)

Similar Documents

Publication Publication Date Title
JPH0272536U (US07968547-20110628-C00004.png)
JPS6186970U (US07968547-20110628-C00004.png)
JPS6379677U (US07968547-20110628-C00004.png)
JPS6338328U (US07968547-20110628-C00004.png)
JPS6331572U (US07968547-20110628-C00004.png)
JPS6429872U (US07968547-20110628-C00004.png)
JPS61177479U (US07968547-20110628-C00004.png)
JPH01110495U (US07968547-20110628-C00004.png)
JPS6338368U (US07968547-20110628-C00004.png)
JPH02116741U (US07968547-20110628-C00004.png)
JPH0338653U (US07968547-20110628-C00004.png)
JPS62182574U (US07968547-20110628-C00004.png)
JPS62188174U (US07968547-20110628-C00004.png)
JPH0385682U (US07968547-20110628-C00004.png)
JPS61131871U (US07968547-20110628-C00004.png)
JPS6429885U (US07968547-20110628-C00004.png)
JPS6387860U (US07968547-20110628-C00004.png)
JPS6351478U (US07968547-20110628-C00004.png)
JPH033770U (US07968547-20110628-C00004.png)
JPH0238743U (US07968547-20110628-C00004.png)
JPH03102757U (US07968547-20110628-C00004.png)
JPS61153374U (US07968547-20110628-C00004.png)
JPH0351872U (US07968547-20110628-C00004.png)
JPH0379469U (US07968547-20110628-C00004.png)
JPS6387869U (US07968547-20110628-C00004.png)