JPH0272405U - - Google Patents
Info
- Publication number
- JPH0272405U JPH0272405U JP14912288U JP14912288U JPH0272405U JP H0272405 U JPH0272405 U JP H0272405U JP 14912288 U JP14912288 U JP 14912288U JP 14912288 U JP14912288 U JP 14912288U JP H0272405 U JPH0272405 U JP H0272405U
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film magnetic
- groove
- magnetic head
- bonding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Magnetic Heads (AREA)
Description
第１図乃至第３図は本考案に係り、第１図は薄
膜磁気ヘツドの要部断面図、第２図は溝の形成方
法を示す斜視図、第３図は基板と保護板との接合
過程を示す斜視図である。第４図は従来の薄膜磁
気ヘツドの要部断面図である。
１……基板、１１……ヘツドコア部、１２……
保護板、１３……接合材、１３ａ……余分な接合
材、１５……溝。
Figures 1 to 3 relate to the present invention; Figure 1 is a sectional view of essential parts of a thin film magnetic head, Figure 2 is a perspective view showing a method for forming grooves, and Figure 3 is a bonding between a substrate and a protection plate. It is a perspective view showing a process. FIG. 4 is a sectional view of a main part of a conventional thin film magnetic head. 1... Board, 11 ... Head core section, 12...
Protective plate, 13...bonding material, 13a...excess bonding material, 15...groove.
Claims (1)
保護板を接合材により接合してなる薄膜磁気ヘツ
ドにおいて、前記保護板の接合面に溝を設け、該
溝内に余分な接合材を浸入させたことを特徴とす
る薄膜磁気ヘツド。 In a thin film magnetic head in which a protective plate is bonded with a bonding material to a substrate on which a head core portion is adhered and formed on the upper surface, a groove is provided on the bonding surface of the protection plate, and excess bonding material is allowed to infiltrate into the groove. A thin film magnetic head characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14912288U JPH0272405U (en) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14912288U JPH0272405U (en) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272405U true JPH0272405U (en) | 1990-06-01 |
Family
ID=31421064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14912288U Pending JPH0272405U (en) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272405U (en) |
-
1988
- 1988-11-15 JP JP14912288U patent/JPH0272405U/ja active Pending