JPH0271166A - Surface potential sensor - Google Patents

Surface potential sensor

Info

Publication number
JPH0271166A
JPH0271166A JP22243088A JP22243088A JPH0271166A JP H0271166 A JPH0271166 A JP H0271166A JP 22243088 A JP22243088 A JP 22243088A JP 22243088 A JP22243088 A JP 22243088A JP H0271166 A JPH0271166 A JP H0271166A
Authority
JP
Japan
Prior art keywords
surface potential
substrate
potential sensor
measurement electrode
sound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22243088A
Other languages
Japanese (ja)
Inventor
Koji Suzuki
鈴木 孝二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP22243088A priority Critical patent/JPH0271166A/en
Publication of JPH0271166A publication Critical patent/JPH0271166A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve measurement accuracy and reduce in size and weight by forming a sound reed, a measurement electrode and a circuit part with the same member (substrate). CONSTITUTION:A substrate (highly elastic plastic plate) 1 is fixed on a fixing member 2 with screws 8. A part of the substrate 1 is cut out by etching or machining to form a sound reed 3, and a measurement electrode 4 is formed on the tip of said reed 3. The electrode 4 is connected to a rear pattern via a through hole, and said pattern is connected to a preamplifier circuit 6. A piezoelectric element 5 is adhered to the vicinity of the supporting base of the sound reed 3. Driving signals and feedback signals are input to a driving circuit 7. The substrate 1 is equipped with a recess 9 for escaping vibration of the sound reed 3. This sensor is used while being covered by a console (shield case) having an opening. Relative positional relation among the respective elements 1, 3, 4 and the positional relation among the elements 1, 3, 4 and the console opening thus can be determined accurately. This improves accuracy for measuring potential.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、表面電位を非接触で測定する表面電位セン
サーに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface potential sensor that measures surface potential in a non-contact manner.

〔従来の技術〕[Conventional technology]

従来、交流型の表面電位センサーとしては、回転セクタ
ー型、測定電極自身が振動する振動容量型、あるいはチ
ューニングフォークの先端部にチョッパ一部を設けた振
動セクター型等が用いられてきた。特に、チューニング
フォークによるチョッパー駆動方式のものは、圧電素子
の性能向上とあいまって、小型で高振幅の安定した振動
が簡tltに得られるという理由で主流になっている。
Conventionally, as an AC type surface potential sensor, a rotating sector type, a vibration capacitive type in which the measuring electrode itself vibrates, or a vibrating sector type in which a part of a chopper is provided at the tip of a tuning fork have been used. In particular, the chopper drive type using a tuning fork has become mainstream because it is compact and can easily produce high-amplitude stable vibrations, along with improved performance of piezoelectric elements.

〔発明か解決しようとする3題〕 しかし、このチューニングフォークによるチョッパー駆
動方式のものは、チューニングフォーク、その支持部材
、回路部および表面電位センサーの框体が、いずれも独
立した部材ないし部品て構成されているため、次のよう
な問題があった。
[Three problems to be solved by the invention] However, in this chopper drive system using a tuning fork, the tuning fork, its supporting member, the circuit section, and the frame of the surface potential sensor are all composed of independent members or parts. As a result, the following problems occurred.

(1)各部材の組立て粒度に一定の限度かあり、チュー
ニングフォークと測定電極と測定窓(被測定面に対向す
る框体の開口部)の相対的な位置関係が寸法精度よく決
まりにくかった。このため、測定精度を一定以上あげる
ことができなかった。
(1) There was a certain limit to the assembly granularity of each member, and it was difficult to determine the relative positional relationship of the tuning fork, measurement electrode, and measurement window (the opening in the frame facing the surface to be measured) with good dimensional accuracy. For this reason, it was not possible to increase the measurement accuracy beyond a certain level.

(2)組立て後の厚さ方向の大きさ(rXみ)か大きく
なり、小型化ないし軽量化に一定の限度があった。
(2) The size in the thickness direction (rX) after assembly is large, and there is a certain limit to miniaturization or weight reduction.

(3)組立て工程か複雑になり、コスト高になった。(3) The assembly process became complicated and the cost increased.

このほかにも、次のような問題があった。すなわち、測
定電極に誘起された極めてハイインピーダンスの微小信
号を、他の外部雑音、特に圧電素子の駆動信号に影響さ
れないように増幅するための信号線の処理が難しかった
In addition, there were the following problems. That is, it is difficult to process the signal line for amplifying the very high impedance minute signal induced in the measurement electrode so that it is not affected by other external noise, especially the drive signal for the piezoelectric element.

この発明は、このような従来の問題点を解消するために
なされたもので、(1)測定精度をあげることができ、
(2)小型、軽量であり、(3)組立てが簡単で、自動
化でき、したがって、製造コストを低減でき、(4)外
部雑音で悪影響を受けない表面電位センサーを提供する
ことを目的とする。
This invention was made to solve these conventional problems; (1) measurement accuracy can be improved;
The present invention aims to provide a surface potential sensor that (2) is small and lightweight, (3) is easy to assemble and can be automated, thus reducing manufacturing costs, and (4) is not adversely affected by external noise.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するために、この発明の表面電位センサ
ーにおいては、音片、測定電極1回路部を同一部材(基
板)で形成するようにした。
In order to achieve the above object, in the surface potential sensor of the present invention, the vibrating bar and the measurement electrode 1 circuit section are formed of the same member (substrate).

また、音片を2個設ける場合は、その支持部を中心に対
称に設け、互いに逆位相で振動するようにしてバランス
をとるようにした。
In addition, when two vibrating bars are provided, they are provided symmetrically around the supporting portion so that they vibrate in opposite phases to each other to maintain balance.

さらに、音片を2個設ける場合は、それらのうちの測定
電極を設けない一方の音片に、第2の測定電極を、他方
の音片の測定電極と対称に設け、その信号を増幅回路の
差動入力に入力するようにした。
Furthermore, when two sound bars are provided, a second measurement electrode is provided on one of the sound bars on which no measurement electrode is provided, symmetrically with the measurement electrode of the other sound bar, and the signal is sent to the amplifier circuit. input to the differential input.

〔作用〕[Effect]

この発明においては、音片、測定電極9回路部を同一部
材(基板)で形成するので、音片と測定電極と測定窓(
框体の開口部)の位置関係を寸法精度よく決めることが
できる。このため、電位測定の精度をあげることができ
る。
In this invention, since the vibrating bar and the measuring electrode 9 circuit part are formed of the same material (substrate), the vibrating bar, the measuring electrode, and the measuring window (
The positional relationship of the openings in the frame can be determined with high dimensional accuracy. Therefore, the accuracy of potential measurement can be improved.

また、同じ理由で、表面電位センサーの厚みを薄くでき
、その小型、軽量化が可能になる。そして、組立て工程
が単純になるので、自動化でき、製造コストの低減が可
能になる。
Furthermore, for the same reason, the thickness of the surface potential sensor can be reduced, making it possible to make it smaller and lighter. Since the assembly process is simplified, it can be automated and manufacturing costs can be reduced.

さらに、2個の音片を設ける場合には両者の振動が互い
にバランスするようにしたので、外部への振動の漏れが
なく、また音片が外部の雑音によって悪影響を受けない
Furthermore, when two sound bars are provided, their vibrations are balanced with each other, so there is no leakage of vibrations to the outside, and the sound bars are not adversely affected by external noise.

そして、また、2個の音片を設ける場合、測定電極を設
けない一方の音片に、第2の測定電極を他方の音片の測
定電極と対称に設け、その信号を増幅回路の差動入力に
入力するようにしたので、被測定物の表面電位以外の雑
音成分を、第2の電極の誘起電圧との差分な増幅するこ
とによって、相殺することができる。このため、高蹟度
の電位測定ができる。
When two sound bars are provided, a second measurement electrode is provided symmetrically to the measurement electrode of the other sound bar on one sound bar without a measurement electrode, and the signal is transmitted to the differential of the amplifier circuit. Since the voltage is input to the input, noise components other than the surface potential of the object to be measured can be canceled out by amplifying the difference between the voltage and the induced voltage of the second electrode. Therefore, high-level potential measurements can be made.

〔実施例〕〔Example〕

(実施例1) 第1図は、この発明の第1実施例を示す。 (Example 1) FIG. 1 shows a first embodiment of the invention.

図において、1は基板、2は基板1の取付部材である。In the figure, 1 is a board, and 2 is a mounting member for the board 1.

基板1はネジ8で取付部材に固定されている。3は基板
の一部をエツチング処理もしくは切削により切り抜いて
形成した音片、4は音片3の先端部に形成した測定電極
である。測定電極4はスルーホールで裏側パターンへ接
続され、同パターンはプリアンプ回路6に接続されてい
る。5は圧電素子で、音片3の支持部付近に接着されて
いる。駆動信号および9逼信号は駆動回路7へ入力され
るようになっている。9は音片3の振動を逃がすために
基板1に設けた凹部である。
The board 1 is fixed to a mounting member with screws 8. Reference numeral 3 designates a vibrating bar formed by cutting out a part of the substrate by etching or cutting, and 4 designates a measurement electrode formed at the tip of the vibrating bar 3. The measurement electrode 4 is connected to a back side pattern through a through hole, and the same pattern is connected to a preamplifier circuit 6. Reference numeral 5 denotes a piezoelectric element, which is glued near the support portion of the vibrating bar 3. The drive signal and the 9-pass signal are input to the drive circuit 7. Reference numeral 9 denotes a recess provided in the substrate 1 to release vibrations of the vibrating bar 3.

基板lは、第2図のように、高弾性の樹脂板11の両面
に導電11i10a、10bで測定電極4と回路パター
ンを形成したものである。導電膜10a、jobは、メ
ツキ、塗装によって形成してもよいし、導電金属薄膜を
ラミネートして形成してもよい。測定電極4と回路パタ
ーンは、通常の印刷配線板(プリント板)と同じ工程で
形成されている。
As shown in FIG. 2, the substrate 1 is a highly elastic resin plate 11 on both sides of which a measuring electrode 4 and a circuit pattern are formed using conductors 11i10a and 10b. The conductive film 10a, job may be formed by plating or painting, or may be formed by laminating conductive metal thin films. The measurement electrode 4 and the circuit pattern are formed in the same process as a normal printed wiring board (printed board).

基板1は、第3図のように、りん青銅、ニリン八等の高
弾性の金属薄板12に、絶縁11Q 13を印刷した後
、その上に導電膜14を印刷して測定電極4と回路パタ
ーンを形成したものでもよい。
As shown in FIG. 3, the substrate 1 is made by printing insulation 11Q 13 on a highly elastic metal thin plate 12 made of phosphor bronze, Nilin 8, etc., and then printing a conductive film 14 thereon to form a measurement electrode 4 and a circuit pattern. It may also be formed by

絶縁膜13は、絶縁剤をコーティングするか、絶縁フィ
ルムを焼付けて形成する。導電膜14は、導電性塗料の
焼付け、あるいは蒸着によって形成することかできる。
The insulating film 13 is formed by coating an insulating agent or by baking an insulating film. The conductive film 14 can be formed by baking or vapor depositing a conductive paint.

この実施例の表面電位センサーは、第4図のように、開
口部16を有する框体(シールドケース)15でカバー
して使用する。
The surface potential sensor of this embodiment is used by covering it with a frame (shield case) 15 having an opening 16, as shown in FIG.

次に作用を説明する。Next, the effect will be explained.

実施例のセンサーでは、測定電極4と回路パターンを形
成した基板1を切り抜いて音片3を作るので、つまり、
音片3と測定電極4と回路パターンが1つの基板1で形
成されているので、各要素1,3.4の相対的位置関係
を寸法精度よく決めることができる。また、框体15の
開口部16と上記各要素1,3.4の位置関係も精度よ
く決めることができる。このため、電位測定の精度が向
上する。
In the sensor of the embodiment, the sound bar 3 is made by cutting out the measurement electrode 4 and the substrate 1 on which the circuit pattern is formed, so that
Since the vibrating bar 3, the measuring electrode 4, and the circuit pattern are formed on one substrate 1, the relative positional relationship of each element 1, 3.4 can be determined with high dimensional accuracy. Furthermore, the positional relationship between the opening 16 of the frame 15 and each of the above-mentioned elements 1, 3.4 can be determined with high precision. Therefore, the accuracy of potential measurement is improved.

また、上述した理由で、表面電位センサーの厚みが薄く
なるので、センサーの小型、軽量化が可能である。その
上、基板1の製造と音片3の切り抜き工程が比較的単純
であるので、自動化が可能になる。したがって、製造コ
ストの低減が可能となる。
Furthermore, for the reasons mentioned above, the thickness of the surface potential sensor is reduced, so the sensor can be made smaller and lighter. Furthermore, the manufacturing of the substrate 1 and the cutting out of the sound bars 3 are relatively simple, allowing for automation. Therefore, manufacturing costs can be reduced.

(実施例2) 第5図は第2実施例を示す。この実施例は、基板1を切
り抜いて一対の音片3a、3bを、その支持部を中心に
互いに対称に設けたものである。
(Example 2) FIG. 5 shows a second example. In this embodiment, a pair of sound pieces 3a and 3b are formed by cutting out a substrate 1 and are provided symmetrically with respect to their support portions.

圧電素子5a、5bは音片3a、3bに対称に接着され
ている。圧′1「素子5a、5bは、一方が駆動用、他
方が振動検出用として用いられる。図中、第1図におけ
ると同じ部分には同符号が付しである。
The piezoelectric elements 5a, 5b are symmetrically bonded to the vibrating bars 3a, 3b. One of the pressure elements 5a and 5b is used for driving and the other for vibration detection. In the figure, the same parts as in FIG. 1 are given the same reference numerals.

この実施例によれば、音片3aと3bが、第6図のよう
に、互いに逆位相で振動してバランスするため、外部へ
の振動の漏れが無く、また音片3a、3bが外部よりの
機械的雑音によって悪影響を受けない。また、基板1を
取り付ける部材を軽量化できる利点がある。その他の作
用効果は第1実施例と同じである。
According to this embodiment, the vibrating bars 3a and 3b are balanced by vibrating in opposite phases to each other as shown in FIG. 6, so there is no leakage of vibration to the outside, and the vibrating bars 3a and 3b are is not adversely affected by mechanical noise. Further, there is an advantage that the weight of the member to which the substrate 1 is attached can be reduced. Other effects are the same as in the first embodiment.

(実施例3) 第7図は第3実施例を示す。この実施例は、第2実施例
における音片3bの先端部に、音片3aの測定電極4と
対称の位置に第2の電極4aを設け、この第2の電極4
aの信号をプリアンプ6の差動入力に入力するようにし
たものである。
(Embodiment 3) FIG. 7 shows a third embodiment. In this embodiment, a second electrode 4a is provided at the tip of the vibrating bar 3b in the second embodiment at a position symmetrical to the measuring electrode 4 of the vibrating bar 3a.
The signal a is input to the differential input of the preamplifier 6.

この実施例によれば、測定電極4に誘導される被測定物
の表面電位以外の雑音成分を、第2の電極4aの誘起電
圧との差分を増幅することにより相殺することができる
ので、高蹟度の電位測定が可能となる。その他の作用効
果は第1実施例と同じである。
According to this embodiment, noise components other than the surface potential of the object to be measured induced in the measurement electrode 4 can be canceled out by amplifying the difference between the induced voltage of the second electrode 4a and the It becomes possible to measure the potential of the degree of turbulence. Other effects are the same as in the first embodiment.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、この発明によれば、(1)電位測
定の精度をあげることができ、(2)小型、軽量であり
、(3)組立てが簡単で、自動化でき、したがって、製
造コストを低減でき、(4)外部雑音によって悪影響を
受けない表面電位センサーを得ることができる。
As explained above, according to the present invention, (1) it is possible to improve the accuracy of potential measurement, (2) it is small and lightweight, and (3) it is easy to assemble and can be automated, thus reducing manufacturing costs. (4) It is possible to obtain a surface potential sensor that is not adversely affected by external noise.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の第1実施例を示し、同図(a)は上
面図、同図(b)は側面図、同図(e)は底面図、第2
図は第1図における基板の側面図、第3図は第1図にお
ける基板の他の態様を示す側面図、第4図は第1図の音
片に框体を被せた状態を示す側面図、第5図は第2実施
例の上面図、第6図は第5図における音片の振動状態を
示す側面図、第7図は第3実施例の上面図である。 0b 笑1欠方ヒ伊Ut二9’lする基ネタ、の々]面図第2
図 ・・・・・・基板 ・・・・・・音片 ・・・・・・測定電極 ・・・・・・圧電素子 ・・・・・・プリアンプ回路 ・・・・・・駆動回路 基板の把のた。様乞示1側面図 第3図
FIG. 1 shows a first embodiment of the present invention, in which (a) is a top view, (b) is a side view, (e) is a bottom view, and (e) is a bottom view.
The figure is a side view of the board in Fig. 1, Fig. 3 is a side view showing another aspect of the board in Fig. 1, and Fig. 4 is a side view showing a state in which the sound piece in Fig. 1 is covered with a frame. , FIG. 5 is a top view of the second embodiment, FIG. 6 is a side view showing the vibration state of the sound bar in FIG. 5, and FIG. 7 is a top view of the third embodiment. 0b Laugh 1 Missing Hii Ut 2 9'l Basic story, Nono] View 2nd
Diagram...Board...Sound bar...Measuring electrode...Piezoelectric element...Preamplifier circuit...Drive circuit board Understand. 1 Side view Figure 3

Claims (6)

【特許請求の範囲】[Claims] (1)基板と、その1部を切り抜いて形成した片持ちの
音片と、この音片に接着した圧電素子と、音片の先端部
に設けた測定電極と、基板に設けた圧電素子の駆動回路
と、基板に設けた測定電極に誘起される交流信号の増幅
回路とを有する表面電位センサー。
(1) A substrate, a cantilever sound piece formed by cutting out a part of the sound piece, a piezoelectric element glued to this sound piece, a measurement electrode provided at the tip of the sound piece, and a piezoelectric element provided on the substrate. A surface potential sensor that includes a drive circuit and an amplification circuit for an alternating current signal induced in a measurement electrode provided on a substrate.
(2)基板は、高弾性の金属薄板と、この上に絶縁膜を
介して設けた導電膜によって形成した測定電極および回
路パターンとよりなる請求項1記載の表面電位センサー
(2) The surface potential sensor according to claim 1, wherein the substrate comprises a highly elastic thin metal plate and a measurement electrode and a circuit pattern formed of a conductive film provided thereon via an insulating film.
(3)基板は、高弾性の絶縁板と、その両面に設けた導
電膜のエッチング加工によって形成した測定電極および
回路パターンとよりなる請求項1記載の表面電位センサ
ー。
(3) The surface potential sensor according to claim 1, wherein the substrate comprises a highly elastic insulating plate and a measurement electrode and a circuit pattern formed by etching a conductive film provided on both sides of the board.
(4)音片は、支持部を中心に互いに対称に2個設けら
れ、両音片は互いに逆位相で振動するようにした請求項
1ないし3のいずれかに記載の表面電位センサー。
(4) The surface potential sensor according to any one of claims 1 to 3, wherein two vibrating bars are provided symmetrically with respect to each other around the support portion, and both vibrating bars vibrate in opposite phases to each other.
(5)2個の音片には、それぞれ駆動用の圧電素子と振
動検出用の圧電素子が接着され、かつ両圧電素子は、そ
れぞれ所定の増幅器の出力、入力に接続され、増幅器に
通電したとき、音片の固有の共振周波数で自動発振する
ようにした請求項4記載の表面電位センサー。
(5) A piezoelectric element for driving and a piezoelectric element for vibration detection are glued to each of the two vibrating bars, and both piezoelectric elements are connected to the output and input of a predetermined amplifier, respectively, and the amplifier is energized. 5. The surface potential sensor according to claim 4, wherein the surface potential sensor automatically oscillates at a resonance frequency specific to the vibrating bar.
(6)2個の音片のうちの測定電極を設けない音片に、
第2の測定電極を前記測定電極と対称に設け、その信号
を増幅回路の差動入力に入力するようにした請求項4ま
たは5記載の表面電位センサー。
(6) Of the two sound pieces, the sound piece that is not equipped with a measurement electrode,
6. The surface potential sensor according to claim 4, wherein a second measuring electrode is provided symmetrically to said measuring electrode, and the signal thereof is inputted to a differential input of an amplifier circuit.
JP22243088A 1988-09-07 1988-09-07 Surface potential sensor Pending JPH0271166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22243088A JPH0271166A (en) 1988-09-07 1988-09-07 Surface potential sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22243088A JPH0271166A (en) 1988-09-07 1988-09-07 Surface potential sensor

Publications (1)

Publication Number Publication Date
JPH0271166A true JPH0271166A (en) 1990-03-09

Family

ID=16782274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22243088A Pending JPH0271166A (en) 1988-09-07 1988-09-07 Surface potential sensor

Country Status (1)

Country Link
JP (1) JPH0271166A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07244102A (en) * 1994-03-07 1995-09-19 Nec Corp Surface potential sensor
JP2006003131A (en) * 2004-06-15 2006-01-05 Canon Inc Potential sensor
US7242882B2 (en) 2003-03-28 2007-07-10 Canon Kabushiki Kaisha Electric potential measuring device using oscillating device, image forming apparatus, and electric potential measuring method
US7382137B2 (en) 2005-05-27 2008-06-03 Canon Kabushiki Kaisha Potential measuring apparatus
US7489135B2 (en) 2004-06-08 2009-02-10 Canon Kabushiki Kaisha Electric potential measuring instrument and image forming apparatus
US7554331B2 (en) 2003-03-28 2009-06-30 Canon Kabushiki Kaisha Electric potential measuring device and image forming apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07244102A (en) * 1994-03-07 1995-09-19 Nec Corp Surface potential sensor
US7242882B2 (en) 2003-03-28 2007-07-10 Canon Kabushiki Kaisha Electric potential measuring device using oscillating device, image forming apparatus, and electric potential measuring method
US7460803B2 (en) 2003-03-28 2008-12-02 Canon Kabushiki Kaisha Electric potential measuring device using oscillating device, image forming apparatus, and electric potential measuring method
US7554331B2 (en) 2003-03-28 2009-06-30 Canon Kabushiki Kaisha Electric potential measuring device and image forming apparatus
US7576546B2 (en) 2003-03-28 2009-08-18 Canon Kabushiki Kaisha Electric potential measuring device and image forming apparatus
US7489135B2 (en) 2004-06-08 2009-02-10 Canon Kabushiki Kaisha Electric potential measuring instrument and image forming apparatus
JP2006003131A (en) * 2004-06-15 2006-01-05 Canon Inc Potential sensor
US7382137B2 (en) 2005-05-27 2008-06-03 Canon Kabushiki Kaisha Potential measuring apparatus
US7741851B2 (en) 2005-05-27 2010-06-22 Canon Kabushiki Kaisha Potential measuring apparatus

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