JPH0270443U - - Google Patents
Info
- Publication number
- JPH0270443U JPH0270443U JP15019088U JP15019088U JPH0270443U JP H0270443 U JPH0270443 U JP H0270443U JP 15019088 U JP15019088 U JP 15019088U JP 15019088 U JP15019088 U JP 15019088U JP H0270443 U JPH0270443 U JP H0270443U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- recess
- rod
- resin sheet
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000007373 indentation Methods 0.000 description 1
Description
第１図ａ及びｂは本考案の一実施例を説明する
ための半導体チツプ剥し治具の断面図、第２図は
第１図に示す半導体チツプ剥し治具の上面図、第
３図は従来の一例を示す半導体チツプを含めた剥
し治具の断面図である。
１……突き出し棒、２……半導体チツプ、３…
…樹脂シート、４……コレツト、５……排気孔、
６……窪み、７……ガイドリング、８……細針。
1A and 1B are cross-sectional views of a semiconductor chip peeling jig for explaining one embodiment of the present invention, FIG. 2 is a top view of the semiconductor chip peeling jig shown in FIG. 1, and FIG. 3 is a conventional FIG. 2 is a sectional view of a peeling jig including a semiconductor chip, showing an example of the peeling jig. 1...Pushing rod, 2...Semiconductor chip, 3...
...Resin sheet, 4...Collection, 5...Exhaust hole,
6...Indentation, 7...Guide ring, 8...Fine needle.
Claims (1)
置されガイドリング中央に可動自在に挿入された
先端が細い突き出し棒と、前記半導体チツプ側の
一端にこの半導体チツプが挿入できる大きさの窪
みとこの窪みの中心に排気孔とを有する棒体とを
備え、前記半導体チツプを前記樹脂シートを介し
て前記突き出し棒で押し剥す半導体チツプ剥し治
具において、前記突き出し棒はその先端が同一面
上にある少なくとも三本の細針を備えたことを特
徴とする半導体チツプ剥し治具。 An ejector rod with a thin tip is placed on the side of the resin sheet to which the semiconductor chip is attached and is movably inserted into the center of the guide ring, a recess with a size that allows the semiconductor chip to be inserted at one end on the semiconductor chip side, and a recess in the recess that is large enough to allow insertion of the semiconductor chip. A semiconductor chip peeling jig comprising a rod having an exhaust hole in the center, and for pushing and peeling the semiconductor chip through the resin sheet with the ejecting rod, the ejecting rod having at least three tips thereof on the same plane. A semiconductor chip peeling jig characterized by being equipped with a fine needle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15019088U JPH0270443U (en) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15019088U JPH0270443U (en) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270443U true JPH0270443U (en) | 1990-05-29 |
Family
ID=31423110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15019088U Pending JPH0270443U (en) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270443U (en) |
-
1988
- 1988-11-17 JP JP15019088U patent/JPH0270443U/ja active Pending
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