JPH0270437U - - Google Patents

Info

Publication number
JPH0270437U
JPH0270437U JP15024088U JP15024088U JPH0270437U JP H0270437 U JPH0270437 U JP H0270437U JP 15024088 U JP15024088 U JP 15024088U JP 15024088 U JP15024088 U JP 15024088U JP H0270437 U JPH0270437 U JP H0270437U
Authority
JP
Japan
Prior art keywords
insulating film
lead frame
lead
recess
electrode terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15024088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15024088U priority Critical patent/JPH0270437U/ja
Publication of JPH0270437U publication Critical patent/JPH0270437U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP15024088U 1988-11-17 1988-11-17 Pending JPH0270437U (US06168655-20010102-C00055.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15024088U JPH0270437U (US06168655-20010102-C00055.png) 1988-11-17 1988-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15024088U JPH0270437U (US06168655-20010102-C00055.png) 1988-11-17 1988-11-17

Publications (1)

Publication Number Publication Date
JPH0270437U true JPH0270437U (US06168655-20010102-C00055.png) 1990-05-29

Family

ID=31423205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15024088U Pending JPH0270437U (US06168655-20010102-C00055.png) 1988-11-17 1988-11-17

Country Status (1)

Country Link
JP (1) JPH0270437U (US06168655-20010102-C00055.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325739A (zh) * 2012-03-23 2013-09-25 南茂科技股份有限公司 半导体封装基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325739A (zh) * 2012-03-23 2013-09-25 南茂科技股份有限公司 半导体封装基板

Similar Documents

Publication Publication Date Title
JPH0270437U (US06168655-20010102-C00055.png)
JPS5813473Y2 (ja) センシングスイッチ装置
JPS6397237U (US06168655-20010102-C00055.png)
JPH031438U (US06168655-20010102-C00055.png)
JPS6378230U (US06168655-20010102-C00055.png)
JPS6253550U (US06168655-20010102-C00055.png)
JPS63159842U (US06168655-20010102-C00055.png)
JPS61153344U (US06168655-20010102-C00055.png)
JPS6249237U (US06168655-20010102-C00055.png)
JPS6452260U (US06168655-20010102-C00055.png)
JPH036842U (US06168655-20010102-C00055.png)
JPS60143356U (ja) 被酸化性物質検出用センサ
JPH03130528U (US06168655-20010102-C00055.png)
JPH01127238U (US06168655-20010102-C00055.png)
JPS6316471U (US06168655-20010102-C00055.png)
JPS62151748U (US06168655-20010102-C00055.png)
JPS61179589U (US06168655-20010102-C00055.png)
JPS6217131U (US06168655-20010102-C00055.png)
JPS6070075U (ja) 金属膜抵抗測定用電極
JPS61132775U (US06168655-20010102-C00055.png)
JPS6367253U (US06168655-20010102-C00055.png)
JPH01126538U (US06168655-20010102-C00055.png)
JPH02137003U (US06168655-20010102-C00055.png)
JPH02131302U (US06168655-20010102-C00055.png)
JPS5868035U (ja) テ−プキヤリア枯化試験用の帯状接続器