JPH0269602A - Aligning device - Google Patents

Aligning device

Info

Publication number
JPH0269602A
JPH0269602A JP63221536A JP22153688A JPH0269602A JP H0269602 A JPH0269602 A JP H0269602A JP 63221536 A JP63221536 A JP 63221536A JP 22153688 A JP22153688 A JP 22153688A JP H0269602 A JPH0269602 A JP H0269602A
Authority
JP
Japan
Prior art keywords
alignment
signal
gravity
wafer
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63221536A
Other languages
Japanese (ja)
Other versions
JP2623757B2 (en
Inventor
Masakazu Matsugi
Kenji Saito
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP63221536A priority Critical patent/JP2623757B2/en
Priority claimed from DE1989625142 external-priority patent/DE68925142T2/en
Publication of JPH0269602A publication Critical patent/JPH0269602A/en
Priority claimed from US07/919,380 external-priority patent/US5327221A/en
Application granted granted Critical
Publication of JP2623757B2 publication Critical patent/JP2623757B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049Technique, e.g. interferometric

Abstract

PURPOSE: To carry out aligning a first object with a second object with high accuracy by detecting gravity of the light quantity of reference luminous flux based on an alignment signal obtained from a first detector and zero-order diffracted light from a second alignment mark by a second detector.
CONSTITUTION: First and second alignment marks 4 and 3 having the optical property are provided on each mask 1 and wafer 2 and aligning is carried out in the following manner by utilizing both luminous fluxs of signal luminous flux via each mark and the zero-order reference luminous flux from the second alignment mark 3. Namely, even if the gravity position of alignment light is changed by an inclination of the wafer 2 surface or an inclination of uneven application of a resist, a warp generated during the exposure process, etc., the relative gravity position between a reference signal and the alignment signal is detected, by which a deviation in the position is detected accurately without being influenced by the inclination of the wafer 2 surface. In addition, even if the gravity positions on optical sensors 11 and 12 of the alignment signal are changed, the deviation in the position between the mask 1 and the wafer 2 can be accurately detected by detecting the relative gravity position between the reference signal 8 and the alignment signal 7.
COPYRIGHT: (C)1990,JPO&Japio
JP63221536A 1988-09-05 1988-09-05 Positioning device Expired - Fee Related JP2623757B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63221536A JP2623757B2 (en) 1988-09-05 1988-09-05 Positioning device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP63221536A JP2623757B2 (en) 1988-09-05 1988-09-05 Positioning device
DE1989625142 DE68925142T2 (en) 1988-02-16 1989-02-16 Device for proving the local relationship between two objects
EP19890301477 EP0336537B1 (en) 1988-02-16 1989-02-16 Device for detecting positional relationship between two objects
US07/919,380 US5327221A (en) 1988-02-16 1992-07-29 Device for detecting positional relationship between two objects

Publications (2)

Publication Number Publication Date
JPH0269602A true JPH0269602A (en) 1990-03-08
JP2623757B2 JP2623757B2 (en) 1997-06-25

Family

ID=16768258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63221536A Expired - Fee Related JP2623757B2 (en) 1988-09-05 1988-09-05 Positioning device

Country Status (1)

Country Link
JP (1) JP2623757B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180548A (en) * 2005-12-27 2007-07-12 Asml Netherlands Bv Pattern alignment method and lithography apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56157033A (en) * 1980-04-11 1981-12-04 Western Electric Co Method and device for positioning mask and wafer
JPS60166808A (en) * 1984-02-10 1985-08-30 Toshiba Corp Shape measuring apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56157033A (en) * 1980-04-11 1981-12-04 Western Electric Co Method and device for positioning mask and wafer
JPS60166808A (en) * 1984-02-10 1985-08-30 Toshiba Corp Shape measuring apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180548A (en) * 2005-12-27 2007-07-12 Asml Netherlands Bv Pattern alignment method and lithography apparatus
JP4543026B2 (en) * 2005-12-27 2010-09-15 エーエスエムエル ネザーランズ ビー.ブイ. Pattern alignment method and lithographic apparatus

Also Published As

Publication number Publication date
JP2623757B2 (en) 1997-06-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees