JPH0268948A - Fitting method of wafer to wafer stage - Google Patents

Fitting method of wafer to wafer stage

Info

Publication number
JPH0268948A
JPH0268948A JP63220487A JP22048788A JPH0268948A JP H0268948 A JPH0268948 A JP H0268948A JP 63220487 A JP63220487 A JP 63220487A JP 22048788 A JP22048788 A JP 22048788A JP H0268948 A JPH0268948 A JP H0268948A
Authority
JP
Japan
Prior art keywords
wafer
suction
fitting
stage
suction force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63220487A
Other languages
Japanese (ja)
Inventor
Shinichi Hara
Eiji Sakamoto
Isamu Shimoda
Shunichi Uzawa
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP63220487A priority Critical patent/JPH0268948A/en
Publication of JPH0268948A publication Critical patent/JPH0268948A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent reduction in patterning accuracy being based on thermal deformation by sucking a wafer to the fitting surface of the water stage with a specified suction force by wafer suction means, reducing suction force of the wafer suction means temporarily, and then sucking the wafer to the fitting surface of the wafer stage by the wafer suction means.
CONSTITUTION: In an aligner provided with a wafer stage 5 having a wafer suction means and a transfer means 2 for transferring a wafer 1 and passing it to the wafer stage 5, the wafer transferred to the wafer fitting surface 6 of the wafer stage 5 is sucked to the fitting surface 6 with a specified suction force by the above wafer suction means, and then suction force of the above wafer suction means is temporarily reduced, then the wafer 1 is sucked to the fitting surface 6 of the wafer stage 5 by means of the wafer suction means. For example, the above wafer suction means is a vacuum chuck. Then, when reducing the suction force of the above wafer suction means temporarily, the wafer 1 is retained by the above transfer means 2 and the suction force is cancelled by the wafer suction means.
COPYRIGHT: (C)1990,JPO&Japio
JP63220487A 1988-09-05 1988-09-05 Fitting method of wafer to wafer stage Pending JPH0268948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63220487A JPH0268948A (en) 1988-09-05 1988-09-05 Fitting method of wafer to wafer stage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63220487A JPH0268948A (en) 1988-09-05 1988-09-05 Fitting method of wafer to wafer stage

Publications (1)

Publication Number Publication Date
JPH0268948A true JPH0268948A (en) 1990-03-08

Family

ID=16751841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63220487A Pending JPH0268948A (en) 1988-09-05 1988-09-05 Fitting method of wafer to wafer stage

Country Status (1)

Country Link
JP (1) JPH0268948A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069597A1 (en) * 1999-05-17 2000-11-23 Kashiwara Machine Mfg. Co., Ltd. Method and device for polishing double sides

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069597A1 (en) * 1999-05-17 2000-11-23 Kashiwara Machine Mfg. Co., Ltd. Method and device for polishing double sides
US8002610B2 (en) 1999-05-17 2011-08-23 Sumitomo Mitsubishi Silicon Corporation Double side polishing method and apparatus

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