JPH0268493U - - Google Patents
Info
- Publication number
- JPH0268493U JPH0268493U JP14793088U JP14793088U JPH0268493U JP H0268493 U JPH0268493 U JP H0268493U JP 14793088 U JP14793088 U JP 14793088U JP 14793088 U JP14793088 U JP 14793088U JP H0268493 U JPH0268493 U JP H0268493U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic component
- aluminum heat
- insulating coating
- direct contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Insulating Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14793088U JPH0268493U (uk) | 1988-11-12 | 1988-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14793088U JPH0268493U (uk) | 1988-11-12 | 1988-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268493U true JPH0268493U (uk) | 1990-05-24 |
Family
ID=31418792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14793088U Pending JPH0268493U (uk) | 1988-11-12 | 1988-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268493U (uk) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007194442A (ja) * | 2006-01-20 | 2007-08-02 | Fuji Electric Holdings Co Ltd | 半導体装置 |
| JP2011054607A (ja) * | 2009-08-31 | 2011-03-17 | Denso Corp | 樹脂封止型半導体装置およびその製造方法 |
| JP2012195492A (ja) * | 2011-03-17 | 2012-10-11 | Mitsubishi Electric Corp | パワー半導体モジュール及びその取り付け構造 |
-
1988
- 1988-11-12 JP JP14793088U patent/JPH0268493U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007194442A (ja) * | 2006-01-20 | 2007-08-02 | Fuji Electric Holdings Co Ltd | 半導体装置 |
| JP2011054607A (ja) * | 2009-08-31 | 2011-03-17 | Denso Corp | 樹脂封止型半導体装置およびその製造方法 |
| JP2012195492A (ja) * | 2011-03-17 | 2012-10-11 | Mitsubishi Electric Corp | パワー半導体モジュール及びその取り付け構造 |