JPH0268446U - - Google Patents
Info
- Publication number
- JPH0268446U JPH0268446U JP14864588U JP14864588U JPH0268446U JP H0268446 U JPH0268446 U JP H0268446U JP 14864588 U JP14864588 U JP 14864588U JP 14864588 U JP14864588 U JP 14864588U JP H0268446 U JPH0268446 U JP H0268446U
- Authority
- JP
- Japan
- Prior art keywords
- package
- mounted semiconductor
- mount
- packaging
- making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14864588U JPH0268446U (bs) | 1988-11-14 | 1988-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14864588U JPH0268446U (bs) | 1988-11-14 | 1988-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268446U true JPH0268446U (bs) | 1990-05-24 |
Family
ID=31420152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14864588U Pending JPH0268446U (bs) | 1988-11-14 | 1988-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268446U (bs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213504A (ja) * | 1995-02-03 | 1996-08-20 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |
-
1988
- 1988-11-14 JP JP14864588U patent/JPH0268446U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213504A (ja) * | 1995-02-03 | 1996-08-20 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |