JPH0267670U - - Google Patents

Info

Publication number

JPH0267670U

JPH0267670U JP14706688U JP14706688U JPH0267670U JP H0267670 U JPH0267670 U JP H0267670U JP 14706688 U JP14706688 U JP 14706688U JP 14706688 U JP14706688 U JP 14706688U JP H0267670 U JPH0267670 U JP H0267670U

Authority

JP

Japan

Prior art keywords

thick film

film wiring

sides

hole portion

integrated circuit

Prior art date

1988-11-10

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims 3
• 239000011521 glass Substances 0.000 claims 1
• 230000000149 penetrating effect Effects 0.000 claims 1
• 238000000034 method Methods 0.000 description 1
• 238000004080 punching Methods 0.000 description 1