JPH0267663U - - Google Patents
Info
- Publication number
- JPH0267663U JPH0267663U JP14648388U JP14648388U JPH0267663U JP H0267663 U JPH0267663 U JP H0267663U JP 14648388 U JP14648388 U JP 14648388U JP 14648388 U JP14648388 U JP 14648388U JP H0267663 U JPH0267663 U JP H0267663U
- Authority
- JP
- Japan
- Prior art keywords
- reflector
- led chip
- main
- light
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14648388U JPH0267663U (es) | 1988-11-09 | 1988-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14648388U JPH0267663U (es) | 1988-11-09 | 1988-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267663U true JPH0267663U (es) | 1990-05-22 |
Family
ID=31416016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14648388U Pending JPH0267663U (es) | 1988-11-09 | 1988-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267663U (es) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508884B1 (es) * | 1970-07-13 | 1975-04-08 | ||
| JPS59224185A (ja) * | 1983-06-03 | 1984-12-17 | Nec Corp | 半導体発光装置 |
-
1988
- 1988-11-09 JP JP14648388U patent/JPH0267663U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508884B1 (es) * | 1970-07-13 | 1975-04-08 | ||
| JPS59224185A (ja) * | 1983-06-03 | 1984-12-17 | Nec Corp | 半導体発光装置 |