JPH0267657U - - Google Patents
Info
- Publication number
- JPH0267657U JPH0267657U JP14707088U JP14707088U JPH0267657U JP H0267657 U JPH0267657 U JP H0267657U JP 14707088 U JP14707088 U JP 14707088U JP 14707088 U JP14707088 U JP 14707088U JP H0267657 U JPH0267657 U JP H0267657U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- type semiconductor
- mounting board
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14707088U JPH0267657U (nl) | 1988-11-10 | 1988-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14707088U JPH0267657U (nl) | 1988-11-10 | 1988-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267657U true JPH0267657U (nl) | 1990-05-22 |
Family
ID=31417141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14707088U Pending JPH0267657U (nl) | 1988-11-10 | 1988-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267657U (nl) |
-
1988
- 1988-11-10 JP JP14707088U patent/JPH0267657U/ja active Pending