JPH0267304U - - Google Patents

Info

Publication number
JPH0267304U
JPH0267304U JP14659188U JP14659188U JPH0267304U JP H0267304 U JPH0267304 U JP H0267304U JP 14659188 U JP14659188 U JP 14659188U JP 14659188 U JP14659188 U JP 14659188U JP H0267304 U JPH0267304 U JP H0267304U
Authority
JP
Japan
Prior art keywords
optical components
aligning
optical
soldering device
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14659188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14659188U priority Critical patent/JPH0267304U/ja
Publication of JPH0267304U publication Critical patent/JPH0267304U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例の要部側断面図、第2
図は従来例の要部側断面図、第3図はLEDモジ
ユールの軸ズレによる特性劣化量を示す図、第4
図はフアイバ端面部の温度を示す図、第5図はレ
ンズホルダの保持力の変化を示す図である。 1……半田付装置、2……XYZステージ、3
……ブラケツト、4……LEDモジユール、5A
……レンズ、5B……レンズホルダ、6……フア
イバ、7……チツプ、8……ホルダ、9……フア
イバホルダ、11……高周波誘導加熱用電極、1
2A,12B……加熱防止治具。
Figure 1 is a side sectional view of the main part of the embodiment of the present invention, Figure 2
The figure is a side sectional view of the main part of the conventional example, Figure 3 is a diagram showing the amount of characteristic deterioration due to axis misalignment of the LED module, and Figure 4 is a diagram showing the amount of characteristic deterioration due to axis misalignment of the LED module.
The figure shows the temperature of the fiber end face, and FIG. 5 shows the change in the holding force of the lens holder. 1... Soldering device, 2... XYZ stage, 3
... Bracket, 4 ... LED module, 5A
... Lens, 5B ... Lens holder, 6 ... Fiber, 7 ... Chip, 8 ... Holder, 9 ... Fiber holder, 11 ... Electrode for high frequency induction heating, 1
2A, 12B... Heating prevention jig.

Claims (1)

【実用新案登録請求の範囲】 光部品の光軸を合わせた後、高周波の電磁誘導
作用により半田接合を行う半田付装置において、 前記光部品の半田付け部以外の周辺部分に比抵
抗の小さい材料からなる加熱防止治具を配設した
ことを特徴とする光部品の光軸合わせ半田付装置
[Scope of Claim for Utility Model Registration] In a soldering device that performs soldering using high-frequency electromagnetic induction after aligning the optical axes of optical components, a material with low resistivity is used in the peripheral portions of the optical components other than the soldered portions. A soldering device for aligning optical axes of optical components, characterized in that a heating prevention jig is provided.
JP14659188U 1988-11-11 1988-11-11 Pending JPH0267304U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14659188U JPH0267304U (en) 1988-11-11 1988-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14659188U JPH0267304U (en) 1988-11-11 1988-11-11

Publications (1)

Publication Number Publication Date
JPH0267304U true JPH0267304U (en) 1990-05-22

Family

ID=31416223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14659188U Pending JPH0267304U (en) 1988-11-11 1988-11-11

Country Status (1)

Country Link
JP (1) JPH0267304U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04152307A (en) * 1990-10-17 1992-05-26 Hitachi Ltd Manufacture of optical semiconductor element module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04152307A (en) * 1990-10-17 1992-05-26 Hitachi Ltd Manufacture of optical semiconductor element module

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