JPH026716Y2 - - Google Patents
Info
- Publication number
- JPH026716Y2 JPH026716Y2 JP4072283U JP4072283U JPH026716Y2 JP H026716 Y2 JPH026716 Y2 JP H026716Y2 JP 4072283 U JP4072283 U JP 4072283U JP 4072283 U JP4072283 U JP 4072283U JP H026716 Y2 JPH026716 Y2 JP H026716Y2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- pick
- unit
- adhesive
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 229910001369 Brass Inorganic materials 0.000 claims description 9
- 239000010951 brass Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000013464 silicone adhesive Substances 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 244000145845 chattering Species 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Description
【考案の詳細な説明】
本考案はボイスコイルの起動で振動する振動板
の振動をピツクアツプユニツトでピツクアツプ
し、これをボイスコイルを駆動するアンプに帰還
して振動板の振動をアンプに入力する信号に近づ
けるMFB型スピーカの改良に関するものである。[Detailed description of the invention] This invention uses a pick-up unit to pick up the vibrations of the diaphragm that vibrate when the voice coil is activated, and then returns this to the amplifier that drives the voice coil to send a signal that inputs the vibrations of the diaphragm to the amplifier. This is related to the improvement of MFB type loudspeakers to bring them closer to .
従来のこの種のMFB型スピーカに於ては振動
板の材質としてはガラス繊維を混入したプラスチ
ツク、例えばガラス繊維強化ポリエチレンテレフ
タレート樹脂が使用され、この振動板の裏面には
環状の突条を突設し、銅又は真鍮板上にセラミツ
ク等のピツクアツプ素子を接着したピツクアツプ
ユニツトの銅板を、固形化性又は固形化しなくと
も硬度が高くなる接着剤、例えばゴム系接着剤に
より接着したものである。 In conventional MFB type speakers of this type, the diaphragm is made of plastic mixed with glass fibers, such as glass fiber-reinforced polyethylene terephthalate resin, and an annular protrusion is provided on the back of the diaphragm. However, the copper plate of the pick-up unit, in which a pick-up element such as a ceramic is bonded to a copper or brass plate, is bonded with an adhesive such as a rubber-based adhesive, which has a solidifying property or has a high hardness without solidifying.
然るに振動板及びピツクアツプユニツトの周辺
雰囲気は、スピーカの磁気損失、振動の分子運動
等によつて発熱して温度上昇するが、振動板に使
用されるガラス繊維強化ポリエチレンテレフタレ
ート樹脂のグレードの熱膨張系数は、2.5×10-5
cm／cm℃であり、一方ピツクアツプユニツトの銅
又は真鍮板の熱膨張系数は16.5×10-6cm／cm℃で
あるために前記の温度上昇によつて両者の伸びに
差を生じ、そのために銅板及びピツクアツプ素子
に反り、波打ち等の歪を生じ、ピツクアツプ素子
はこれによつて常に電圧を生じることとなり、振
動板の振動で発生する電圧以外のこの電圧も帰還
されるので、正しい入力電圧の再生ができない欠
点があつた。 However, the atmosphere around the diaphragm and pickup unit generates heat and rises in temperature due to the magnetic loss of the speaker, the molecular motion of vibration, etc. is 2.5×10 -5
cm/cm°C, and on the other hand, the thermal expansion coefficient of the copper or brass plate of the pick-up unit is 16.5×10 -6 cm/cm°C, so the temperature increase causes a difference in the elongation of the two, and therefore This causes distortion such as warping and waving on the copper plate and the pickup element, and the pickup element constantly generates a voltage. This voltage, in addition to the voltage generated by the vibration of the diaphragm, is also fed back, so it is difficult to determine the correct input voltage. There was a drawback that it could not be played.
本考案はピツクアツプユニツトと振動板の突条
の接着をシリコン接着剤のような非固形性で、し
かも軟度の高い持続性のある接着剤を使用するこ
とにより、前記の温度上昇による伸びの差を、こ
の接着層の接着面間の歪で逃げ、ピツクアツプユ
ニツトに変形を起させないようにして従来の欠点
を除去しようとするものである。 The present invention uses a non-solid, soft and long-lasting adhesive such as silicone adhesive to bond the protrusions of the pickup unit and the diaphragm, thereby reducing the difference in elongation due to temperature rise. This is an attempt to eliminate the drawbacks of the conventional method by eliminating the distortion between the adhesive surfaces of the adhesive layer and preventing deformation of the pickup unit.
本考案の実施例を図面に就いて説明すれば、円
形の平面振動板１は、その表面に環状の凹溝２，
２′を設けてその内側の凹溝２の最深部に射出成
型の際のピンゲート３を等間隔で設け、ガラス繊
維強化ポリエチレンテレフタレート樹脂で平面振
動板１を射出成型した時にゲートがその表面に突
出して体裁を損じたり、仕上を行うための手数を
要したり、或いはゲートからの樹脂の流れの不均
一による内部歪によつて均一的な平面振動板１の
振動が得られなかつたりするようなことがないよ
うにする。 To explain the embodiment of the present invention with reference to the drawings, a circular plane diaphragm 1 has an annular groove 2 on its surface.
2', and pin gates 3 for injection molding are provided at equal intervals in the innermost part of the groove 2, and when the flat diaphragm 1 is injection molded with glass fiber reinforced polyethylene terephthalate resin, the gates protrude from the surface thereof. This may spoil the appearance, require a lot of effort for finishing, or make it impossible to obtain uniform vibration of the flat diaphragm 1 due to internal distortion due to non-uniform flow of resin from the gate. I'll make sure this doesn't happen.
平面振動板１の裏面中心部には環状で二重の突
条４を形成し、この突条４の間隙にボイスコイル
５を巻装したボビン６の一端部を接着剤と共に挿
入して接着し、又平面振動板１には突条４と同心
に外周部に環状の突条４ａ、突条４，４ａの中間
部分に突条４ｂを、更に突条４，４ｂと交叉する
よう放射状に３本の突条７を、該突条７と突条４
ｂの交叉点を中心として平面振動板１のバランス
を取るための３ケの小環突条８を配設する。 A double ring-shaped protrusion 4 is formed at the center of the back surface of the flat diaphragm 1, and one end of a bobbin 6, on which a voice coil 5 is wound, is inserted into the gap between the protrusions 4 together with an adhesive and bonded. In addition, the flat diaphragm 1 has an annular protrusion 4a on the outer periphery concentrically with the protrusion 4, a protrusion 4b in the middle of the protrusions 4 and 4a, and three radial protrusions intersecting the protrusions 4 and 4b. The protrusion 7 of the book is connected to the protrusion 7 and the protrusion 4.
Three small annular protrusions 8 are arranged to balance the plane diaphragm 1 around the intersection point b.
平面振動板１はその周囲が発泡ウレタンのエツ
ジ９を介してフレーム１０に支持され、フレーム
１０の中心部にはドライバーユニツト１１が固定
されて居り、このドライバーユニツト１１のエア
ギヤツプにボイスコイル５が位置している。 The periphery of the flat diaphragm 1 is supported by a frame 10 via an edge 9 of urethane foam, and a driver unit 11 is fixed to the center of the frame 10, and a voice coil 5 is located in the air gap of this driver unit 11. are doing.
更にフレーム１０には入力端子１２、フイード
バツク端子１３が設けられており、又平面振動板
１にはその外周縁に近接して１つの小環突条８と
の間に側面に支持切込み１４を有する突壁１５
を、この突壁１５と反対側にも外周縁に近接して
側面に支持切込み１６を有する突壁１７を突設
し、入力端子１２に接続されている錦糸線１８の
一端を支持切込み１６に挿着すると共に接着剤で
固定し、かつ錦糸線１８の先端を緊張状態で延長
して、ボビン６においてボイスコイル５からのリ
ード線１９の端部とハンダ付けする。 Further, the frame 10 is provided with an input terminal 12 and a feedback terminal 13, and the flat diaphragm 1 has a support notch 14 on the side surface between it and one small ring protrusion 8 near its outer periphery. Projection wall 15
On the opposite side of the projecting wall 15, a projecting wall 17 having a support notch 16 on the side surface is protruded close to the outer peripheral edge, and one end of the tinsel wire 18 connected to the input terminal 12 is connected to the support notch 16. The tinsel wire 18 is inserted and fixed with adhesive, and the tip of the tinsel wire 18 is stretched under tension and soldered to the end of the lead wire 19 from the voice coil 5 on the bobbin 6.
更に付近に突壁１５を設けた小環突条８には円
形段部２０を設け、銅又は真鍮板２１上にセラミ
ツクのピツクアツプ素子２２を接着したピツクア
ツプユニツトａの該銅又は真鍮板２１を円形段部
２０にシリコン接着剤で接着層２３を設けて接着
し、又フイードバツク端子１３に接続された錦糸
線２４の一端は突壁１５の支持切込み１４に挿入
してピツクアツプユニツトａのリード線２５とハ
ンダ付すると共に、このハンダ付部分と支持切込
み１４に挿入した部分を接着剤で固めて錦糸線２
４を突壁１５に固定し、ボイスコイル５のボビン
６とフレーム１０間にはボイスコイル５の振動を
ダンプするダンパー２６を設ける。 Furthermore, a circular step 20 is provided on the small ring protrusion 8 with a protruding wall 15 provided nearby, and the copper or brass plate 21 of the pick-up unit a, in which a ceramic pick-up element 22 is bonded to the copper or brass plate 21, is circularly shaped. An adhesive layer 23 is provided on the stepped portion 20 with silicone adhesive and bonded, and one end of the tinsel wire 24 connected to the feedback terminal 13 is inserted into the support notch 14 of the projecting wall 15 and connected to the lead wire 25 of the pickup unit a. At the same time as soldering, the soldered part and the part inserted into the support notch 14 are hardened with adhesive to form the tinsel wire 2.
4 is fixed to a projecting wall 15, and a damper 26 for damping vibrations of the voice coil 5 is provided between the bobbin 6 of the voice coil 5 and the frame 10.
本考案は叙上のような構成であるから、入力端
子１２にアンプからの出力を供給すれば、その音
声電流が錦糸線１８、リード線１９を通つてドラ
イバーユニツト１１のエアギヤツプ内に位置する
ボイスコイル５に流れて、ボイスコイル５が前後
に振動し、平面振動板１の環状の突条４にボビン
６の端部が接着されているので、ボイスコイル５
の振動は平面振動板１に伝達されて平面振動板１
は前後に振動する。 Since the present invention has the above configuration, when the output from the amplifier is supplied to the input terminal 12, the audio current passes through the tinsel wire 18 and the lead wire 19 to the voice located in the air gap of the driver unit 11. The current flows through the coil 5, causing the voice coil 5 to vibrate back and forth.Since the end of the bobbin 6 is bonded to the annular protrusion 4 of the flat diaphragm 1, the voice coil 5 vibrates back and forth.
The vibration of is transmitted to the plane diaphragm 1 and
vibrates back and forth.
平面振動板１は前述のようなピンゲート３より
樹脂が注入されて成形されるので、樹脂の流れの
不均一による歪がないと共に、環状の突条４，４
ａ，４ｂと放射状の３本の突条７によつて平面振
動板１の二次共振を防止し、且つ小環突条８で振
動のバランスを取り、平面振動板１が正しくピス
トン運動をする。 Since the flat diaphragm 1 is molded by injecting resin from the pin gate 3 as described above, there is no distortion due to uneven resin flow, and the annular protrusions 4, 4
a, 4b and the three radial protrusions 7 prevent secondary resonance of the planar diaphragm 1, and the small annular protrusions 8 balance the vibrations, allowing the planar diaphragm 1 to move correctly as a piston. .
更に平面振動板１の小環突条８は、そのうちの
一つに設けた段部２０にピツクアツプユニツトａ
を接着してあるので、ピツクアツプユニツトａも
一緒に振動し、その振動に従つてピツクアツプユ
ニツトａの発電効果によつて電圧を生じ、これを
リード線２５、錦糸線２４を通つてフイードバツ
ク端子１３に取り出し、この電圧をアンプに帰還
して入力波形との差を補正し、これを入力端子１
２から入力するうにして原音を再生させるように
するものである。 Furthermore, the small ring protrusion 8 of the flat diaphragm 1 is provided with a pick-up unit a at a step 20 provided on one of them.
Since the pick-up unit a vibrates together with the pick-up unit a, a voltage is generated by the power generation effect of the pick-up unit a according to the vibration, and this is passed through the lead wire 25 and the tinsel wire 24 to the feedback terminal 13. This voltage is returned to the amplifier to correct the difference with the input waveform, and this voltage is input to input terminal 1.
2, the original sound is played back.
然るにボイスコイル５には直流抵抗があり、こ
れを流れる電流の一部は熱として消費され、又平
面振動板１はその振動によつて分子運動が盛んに
なるため、その一部が熱として消費されるので、
これ等の発熱により平面振動板１、ピツクアツプ
ユニツトａはその周辺の雰囲気と共に温度が上昇
して来る。 However, the voice coil 5 has a DC resistance, and part of the current flowing through it is consumed as heat, and the vibration of the plane diaphragm 1 increases molecular motion, so a part of it is consumed as heat. Because it is done,
Due to this heat generation, the temperature of the flat diaphragm 1 and the pickup unit a rises together with the surrounding atmosphere.
しかしながら平面振動板１に通常使用されるガ
ラス繊維強化ポリエチレンテレフタレート樹脂の
熱膨張率は2.5×10-5cm／cm℃であり、ピツクア
ツプユニツトａの銅又は真鍮板２１の熱膨張率は
16.5×10-6cm／cm℃と相違するため、前記のよう
な温度上昇によつて伸びに差を生じ、ピツクアツ
プユニツトａを加熱等によつて固形化して接着が
できる接着剤、固形化しないまでも柔軟性が減退
する例えばゴム系のような接着剤を使用したので
は、両者の伸びの差によつてピツクアツプユニツ
トａの銅又は真鍮板２１を反らせ、或いは波打た
せる等の変形歪を与えてしまつて、この変化歪に
該当する電圧をピツクアツプユニツトａが発生
し、この電圧をも帰還して原音再生を不可能にし
てしまうが、この接着剤に非固形化性で、適当な
柔軟性を維持するシリコン系の接着剤を使用して
その接着層２３を設けたので、前記両者の伸びの
差はこの接着層２３が歪むことにより吸収され、
ピツクアツプユニツトａに前記のような変形歪を
発生させず、従つて忠実な原音再生を可能とする
ものである。 However, the coefficient of thermal expansion of the glass fiber reinforced polyethylene terephthalate resin normally used for the flat diaphragm 1 is 2.5 x 10 -5 cm/cm°C, and the coefficient of thermal expansion of the copper or brass plate 21 of the pickup unit a is
16.5 x 10 -6 cm/cm℃, so there is a difference in elongation due to the rise in temperature as mentioned above, and there are adhesives that can be solidified and bonded by heating etc. For example, if a rubber-based adhesive is used, which reduces flexibility, the difference in elongation between the two may cause deformation such as warping or waving the copper or brass plate 21 of the pick-up unit a. If this happens, the pickup unit A will generate a voltage corresponding to this changing distortion, and this voltage will also be fed back, making it impossible to reproduce the original sound. Since the adhesive layer 23 was provided using a silicone adhesive that maintains its properties, the difference in elongation between the two is absorbed by the distortion of the adhesive layer 23.
This does not cause the above-mentioned deformation distortion in the pickup unit a, and therefore enables faithful reproduction of the original sound.
第７図及び第８図は従来使用されているゴム系
の接着剤とシリコン接着剤を使用した本考案の実
施品の比較チヤートで、Ａは試験開始直前の周波
数特性で、Ｂはこれを100℃の恒温槽内に、24時
間放置後の周波数特性で、両者の差の少い第８図
の本考案の実施品が、従来のものに比して優れた
成績を示して居る。 Figures 7 and 8 are comparison charts of the products of the present invention using conventionally used rubber-based adhesives and silicone adhesives, where A is the frequency characteristics just before the start of the test, and B is the frequency characteristics of In the frequency characteristics after being left in a constant temperature bath at ℃ for 24 hours, the product of the present invention shown in Fig. 8, which shows a small difference between the two, shows superior results compared to the conventional product.
更に平面振動板１にはその周縁に近接して突壁
１５，１７を設けてその支持切込み１４，１６
に、ボイスコイル５からのリード線１９が接続さ
れた錦糸線１８と、フイードバツク端子１３から
の錦糸線２４を挿入し、かつピツクアツプユニツ
トａからのリード線２５をハンダ付けした後に、
支持切込み１４，１６に挿入した部分を接着剤で
固めるようにしたので、錦糸線１８，２４の端部
の処理とリード線１９，２５の接続作業が容易で
あると共に、平面振動板１と共に錦糸線１８，２
４は振動するので、平面振動板１にこれ等が当つ
てビビル音を発生することがなく、突壁１５，１
７は平面振動板１の周縁に近く突設してあり、こ
の周縁には発泡ウレクンのエツジ９の内周が貼着
されているので、錦糸線１８，２４が振動によつ
て当る場合でも、このエツジ９に当るので、発泡
ウレタンとの接触振動では吸音されてしまつてビ
ビリ音を発生することはない。 Further, the planar diaphragm 1 is provided with protruding walls 15, 17 close to its periphery, and supporting notches 14, 16 are provided thereon.
After inserting the tinsel wire 18 to which the lead wire 19 from the voice coil 5 is connected, and the tinsel wire 24 from the feedback terminal 13, and soldering the lead wire 25 from the pick-up unit a,
Since the portions inserted into the support notches 14 and 16 are hardened with adhesive, it is easy to process the ends of the tinsel wires 18 and 24 and connect the lead wires 19 and 25, and the tinsel wires can be secured together with the flat diaphragm 1. line 18,2
4 vibrate, so that they do not hit the flat diaphragm 1 and generate a chattering sound, and the projecting walls 15, 1
7 protrudes near the periphery of the flat diaphragm 1, and the inner periphery of the foamed urethane edge 9 is adhered to this periphery, so that even if the tinsel wires 18 and 24 are hit by vibration, Since this is the edge 9, the contact vibration with the foamed urethane is absorbed and no chattering noise is generated.
本考案は叙上のように振動板とピツクアツプユ
ニツトとがガラス繊維強化ポリエチレンテレフタ
レート樹脂と銅又は真鍮板のような熱膨張率の違
う材質で構成されていても、ボイスコイル等の磁
気、電流損失による発熱、振動板の振動に伴う分
子運動の発熱によつて振動板及びピツクアツプユ
ニツトの周囲の雰囲気温度が上昇し、これ等が熱
膨張して振動板とピツクアツプユニツト間で伸び
に差を生じても、これ等の接着にはシリコン接着
剤の如き非固形性で、しかも或る程度の軟性を維
持する接着剤を使用しているので、両者の伸びの
差は振動板接着面とピツクアツプユニツト接着面
間の接着層が歪むことによつて吸収され、ピツク
アツプユニツトを反らせる、或いは波打たせる等
の歪を生じさせることがなく、その歪によつてバ
イアスがかかつたかの如き不自然の電圧を帰還さ
せることがないので、長時間使用で熱発生時でも
原音に近い音を再生することができる効果があ
る。 As mentioned above, even if the diaphragm and pickup unit are made of materials with different coefficients of thermal expansion, such as glass fiber reinforced polyethylene terephthalate resin and copper or brass plate, magnetic and current loss due to voice coil etc. The ambient temperature around the diaphragm and pickup unit rises due to the heat generated by the molecular motion that accompanies the vibration of the diaphragm, which thermally expands and causes a difference in elongation between the diaphragm and the pickup unit. However, since a non-solid adhesive such as silicone adhesive that maintains a certain degree of flexibility is used for bonding these, the difference in elongation between the two is due to the difference between the adhesive surface of the diaphragm and the pickup unit adhesive. Absorbed by the distortion of the adhesive layer between the surfaces, it does not cause distortion such as warping or waving the pickup unit, and returns unnatural voltage that appears to be biased by the distortion. This has the effect of being able to reproduce sound close to the original sound even when heat is generated due to long-term use.
図面は本考案の実施例を示すもので、第１図は
断面図、第２図は正面図、第３図はピツクアツプ
ユニツト部の裏面図、第４図はその拡大断面図、
第５図、第６図は錦糸線とリード線の接続部の斜
面図、第７図は従来の接着剤を使用した場合、第
８図は実施例のピツクアツプユニツトの温度によ
る出力特性の変化を示す周波数特性線図である。
１……平面振動板、２，２′……環状の凹溝、
３……ピンゲート、４，４ａ，４ｂ……環状の突
条、８……小環突条、９……エツジ、１０……フ
レーム、１２……入力端子、１３……フイードバ
ツク端子、１４，１６……支持切込み、１５，１
７……突壁、１８，２４……錦糸線、１９，２５
……リード線、ａ……ピツクアツプユニツト、２
１……銅又は真鍮板、２２……ピツクアツプ素
子、２３……シリコン接着層。
The drawings show an embodiment of the present invention; FIG. 1 is a sectional view, FIG. 2 is a front view, FIG. 3 is a back view of the pick-up unit, and FIG. 4 is an enlarged sectional view thereof.
Figures 5 and 6 are perspective views of the connection between the tinsel wire and the lead wire, Figure 7 shows the change in output characteristics due to temperature of the pick-up unit of the example when a conventional adhesive is used, and Figure 8 shows the change in output characteristics due to temperature of the pick-up unit of the example. It is a frequency characteristic line diagram shown. 1... Plane diaphragm, 2, 2'... Annular groove,
3... Pin gate, 4, 4a, 4b... Annular protrusion, 8... Small annular protrusion, 9... Edge, 10... Frame, 12... Input terminal, 13... Feedback terminal, 14, 16 ...Support depth, 15,1
7... Projection wall, 18, 24... Tinsel wire, 19, 25
...Lead wire, a...Pickup unit, 2
1... Copper or brass plate, 22... Pick-up element, 23... Silicon adhesive layer.
Claims (1)
上に設けたピツクアツプユニツト接着用突条８
に、銅又は真鍮板２１上にセラミツク、バイモル
フ等のピツクアツプ素子２２を接着したピツクア
ツプユニツトａを、シリコン接着剤のような高軟
度を維持する非固形化接着層２３により接着した
ことを特徴とするMFB型スピーカ。 Vibration plate 1 made of resin mixed with glass fiber
Pick-up unit adhesive protrusion 8 provided on the top
A pick-up unit a, in which a pick-up element 22 made of ceramic, bimorph, etc. is bonded onto a copper or brass plate 21, is bonded with a non-solidified adhesive layer 23 that maintains high softness, such as silicone adhesive. MFB type speaker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4072283U JPS59147394U (en) | 1983-03-23 | 1983-03-23 | MFB type speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4072283U JPS59147394U (en) | 1983-03-23 | 1983-03-23 | MFB type speaker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59147394U JPS59147394U (en) | 1984-10-02 |
| JPH026716Y2 true JPH026716Y2 (en) | 1990-02-19 |
Family
ID=30171333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4072283U Granted JPS59147394U (en) | 1983-03-23 | 1983-03-23 | MFB type speaker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59147394U (en) |
-
1983
- 1983-03-23 JP JP4072283U patent/JPS59147394U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59147394U (en) | 1984-10-02 |
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