JPH0265373U - - Google Patents
Info
- Publication number
- JPH0265373U JPH0265373U JP14407988U JP14407988U JPH0265373U JP H0265373 U JPH0265373 U JP H0265373U JP 14407988 U JP14407988 U JP 14407988U JP 14407988 U JP14407988 U JP 14407988U JP H0265373 U JPH0265373 U JP H0265373U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- semiconductor chip
- chip mounting
- conductor wire
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14407988U JPH0265373U (enrdf_load_stackoverflow) | 1988-11-02 | 1988-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14407988U JPH0265373U (enrdf_load_stackoverflow) | 1988-11-02 | 1988-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265373U true JPH0265373U (enrdf_load_stackoverflow) | 1990-05-16 |
Family
ID=31411469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14407988U Pending JPH0265373U (enrdf_load_stackoverflow) | 1988-11-02 | 1988-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265373U (enrdf_load_stackoverflow) |
-
1988
- 1988-11-02 JP JP14407988U patent/JPH0265373U/ja active Pending