JPH0263547U - - Google Patents
Info
- Publication number
- JPH0263547U JPH0263547U JP14318888U JP14318888U JPH0263547U JP H0263547 U JPH0263547 U JP H0263547U JP 14318888 U JP14318888 U JP 14318888U JP 14318888 U JP14318888 U JP 14318888U JP H0263547 U JPH0263547 U JP H0263547U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- molded
- semiconductor device
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000008188 pellet Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14318888U JPH0263547U (el) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14318888U JPH0263547U (el) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263547U true JPH0263547U (el) | 1990-05-11 |
Family
ID=31409785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14318888U Pending JPH0263547U (el) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263547U (el) |
-
1988
- 1988-10-31 JP JP14318888U patent/JPH0263547U/ja active Pending