JPH0262988A - Manufacture of magnetic sensor - Google Patents
Manufacture of magnetic sensorInfo
- Publication number
- JPH0262988A JPH0262988A JP63215398A JP21539888A JPH0262988A JP H0262988 A JPH0262988 A JP H0262988A JP 63215398 A JP63215398 A JP 63215398A JP 21539888 A JP21539888 A JP 21539888A JP H0262988 A JPH0262988 A JP H0262988A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- resin base
- lead parts
- lead
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 8
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、例えばＶＴＲ，テープデツキの回転ドラム等
を被検出体とし、その被検出体の着磁帯数をカウントす
ることにより被検出体の回転状況をフィードバック制御
するのに用いられる磁気センサーの製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention uses a VTR, a rotating drum of a tape deck, etc. as an object to be detected, and measures the rotational status of the object by counting the number of magnetized bands on the object. The present invention relates to a method for manufacturing a magnetic sensor used for feedback control.
従来の技術
従来、この種の磁気センサーは予め樹脂成形した基体と
、被検出体の着磁帯数をカウントする半導体素子と、被
検出体の磁力に応じて半導体素子を例示するマグネット
体と、半導体素子の着磁帯カウント数に応じて被検出体
制御信号を出力する必要数のリード線とを組立部品とし
て夫々用意し、それらを個々別に樹脂基体の挿通孔や凹
部にアッセンブリすることにより必要な回路構成に組立
てられているのが通常である。BACKGROUND OF THE INVENTION Conventionally, this type of magnetic sensor has a base body molded with resin in advance, a semiconductor element that counts the number of magnetized bands of an object to be detected, and a magnet body that exemplifies the semiconductor element according to the magnetic force of the object to be detected. The required number of lead wires for outputting detection object control signals according to the number of magnetized band counts of the semiconductor element are prepared as assembly parts, and these are individually assembled into the insertion holes or recesses of the resin base. It is usually assembled into a similar circuit configuration.
発明が解決しようとＩする課題
然し、これでは組立てに多くの工数を要するばかりでな
く、半導体素子をリード線のボンディング面と位置合せ
させて組付けるのに極めて手間が掛り、また、その位置
合せに要するリード線の形状出しも画一的にできない等
の欠点がある。However, this method not only requires a large number of man-hours for assembly, but also requires an extremely long time to align and assemble the semiconductor element with the bonding surface of the lead wire. There are drawbacks such as the fact that the shape of the lead wire required for this cannot be uniformly formed.
荘において、本発明は極めて簡単に組立て得て正確な回
路構成で組立て可能な磁気センサーの製造方法を）是供
することを目的とする。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method for manufacturing a magnetic sensor that is extremely easy to assemble and can be assembled with a precise circuit configuration.
課題を解決するための手段
本発明に係る磁気センサーの製造方法においては、被検
出体の着磁帯数をカウントする半導体素子を組付ける樹
脂基体をインジェクション成形する際に半導体素子と片
端側で接続するリード部並びに半導体素子を適宜に励磁
するマグネット体を金型のキャビティ空間内に夫々位置
決め挿置し、この金型の型締めに伴ってリード部の所定
形状に折り曲げ成形された突端側を半導体素子とのワイ
ヤーボンディング端子面としてキャビティ空間の外部に
位置させ、その金型のキャビティ空間に射出する樹脂で
リード部の軸線並びにマグネット体を内部に保持した樹
脂基体を一体成形し、この型外し後に樹脂基体のワイヤ
ーボンディング端子面が露出位置する近傍個所に設けた
凹部で半導体素子を嵌込み固定すると共に、半導体素子
とリード部のワイヤーボンディング端子面とを電気的に
接続させて組立てるものであり、その工程中にリード部
はリードフレームでピッチ送りすれば樹脂基体を金型で
連続的にインジェクション成形するようにできる。Means for Solving the Problems In the method for manufacturing a magnetic sensor according to the present invention, when injection molding a resin base on which a semiconductor element for counting the number of magnetized bands of a detected object is attached, the resin base is connected at one end to the semiconductor element. A lead part to excite the semiconductor element and a magnet body to appropriately excite the semiconductor element are positioned and inserted into the cavity space of the mold, and as the mold is clamped, the tip end of the lead part, which is bent into a predetermined shape, is inserted into the semiconductor element. A resin base is placed outside the cavity space as a terminal surface for wire bonding with the element, and is injected into the cavity space of the mold to integrally mold the resin base holding the axis of the lead part and the magnet body inside, and after removing the mold. The semiconductor element is fitted and fixed in a recess provided in the vicinity of the exposed position of the wire bonding terminal surface of the resin base, and the semiconductor element and the wire bonding terminal surface of the lead part are electrically connected and assembled. During this process, if the lead portion is pitch-fed using a lead frame, the resin base can be continuously injection molded using a mold.
作用
この磁気センサーの製造方法ではリード部を樹脂基体の
インジェクション成形時に一体成形するから、複数本の
リード部を必要とするときでも半導体素子との各ボンデ
ィング面を定位置で正確に形状出しさせて装備できしか
も事後に組付ける半導体素子と正確に接続できるばかり
でなく、そのインジェクション成形時にマグネット体も
樹脂基体と一体成形するため組立て工数を少なくできる
と共に極めて簡単な作業で組立てでき、また、リード部
をリードフレームでピッチ送りすることにより樹脂基体
を連続的に成形できるから製造能率を極めて向上できる
ようになる。Function: In this magnetic sensor manufacturing method, the lead portion is integrally molded during injection molding of the resin base, so even when multiple lead portions are required, each bonding surface with the semiconductor element can be accurately shaped in a fixed position. Not only can it be accurately connected to the semiconductor element that is installed and assembled after the fact, but also the magnet body is integrally molded with the resin base during injection molding, which reduces the number of assembly steps and allows for extremely simple assembly. Since the resin substrate can be continuously molded by pitch-feeding with a lead frame, manufacturing efficiency can be greatly improved.
実施例
以下、添付図面を参照して説明すれば、次の通りである
。Embodiments will now be described with reference to the accompanying drawings.
この製造方法はＶＴＲやテープデツキの回転ドラム等を
被検出体とし、その着磁帯数をカウントすることにより
被検出体の回転状況をフィードバック制御するのに用い
られる磁気センサーの製造に適用するものである。この
磁気センサーは第１図で示すように樹脂基体１が被検出
体と対向する側にチップ状の半導体素子２を備え、その
半導体素子２の背後側に位置させて被検出体の磁力か弱
いときに半導体素子２を励磁することにより着磁帯を確
実に検出できるよう半導体素子２に磁束を作用するマグ
ネット体３と半導体素子２の端子部を所定のボディング
面で接続する複数本のリード部４，５…とを備えて組立
てられている。この各構成部のうち、樹脂基体ｌはポリ
フェニレンサルファイド（ｐｐｓ）、ポリブチレンテレ
フタレート（ＰＢＴ）等の熱可塑性の絶縁樹脂を用いて
形成できる。その樹脂基体１には第２図で示すように被
検出体の機器近傍にビス止めて固定する止め穴６．７を
基板部１ａに設けることができ、この被検出体との対向
間隔を調整可能にするべく止め穴６．７の真内側を中心
に楕円側で位置ズレさせるギヤー歯８も基板部１ａの片
側部に設けるようにできる。また、リード部４．５…は
片端側４ａ、５ａ…を半導体素子２と電気的に接続する
ワイヤーボンディング端子面として下向き直角に軸線的
げすると共に、そのワイヤーボンディング端子面４ａ、
５ａ…から延在する軸線部４ｂ。This manufacturing method is applied to the manufacture of magnetic sensors that use a rotating drum of a VTR or tape deck as an object to be detected, and are used to feedback control the rotational status of the object by counting the number of magnetized bands. be. As shown in FIG. 1, this magnetic sensor has a resin base 1 equipped with a chip-shaped semiconductor element 2 on the side facing the object to be detected, and is placed behind the semiconductor element 2 when the magnetic force of the object to be detected is weak. A plurality of lead portions 4 connect the terminal portions of the semiconductor device 2 with a magnet body 3 that applies a magnetic flux to the semiconductor device 2 so that a magnetized band can be reliably detected by exciting the semiconductor device 2 at a predetermined boarding surface. , 5... are assembled. Among these components, the resin base l can be formed using thermoplastic insulating resin such as polyphenylene sulfide (pps) and polybutylene terephthalate (PBT). As shown in FIG. 2, the resin base 1 can be provided with a fixing hole 6.7 in the substrate part 1a, which is fixed with a screw near the device of the detected object, and the distance between the facing object and the detected object can be adjusted. In order to make this possible, gear teeth 8 for shifting the position on the oval side centering on the inner side of the stop hole 6.7 can also be provided on one side of the base plate portion 1a. Further, the lead portions 4.5... have one end side 4a, 5a... directed downward at right angles to the axis as a wire bonding terminal surface for electrically connecting with the semiconductor element 2, and the wire bonding terminal surface 4a,
Axis line portion 4b extending from 5a...
５ｂ…を中央寄りに折曲成形することにより半導体素子
２の端子部との間隔を調整できるように予め所定形状に
形成されている。5b... are formed in a predetermined shape so that the distance between them and the terminal portions of the semiconductor element 2 can be adjusted by bending them toward the center.
この磁気センサーを製造するにあたっては、第３図で示
す如き上下の各型部１０（片側のみ図示）と第４図で示
すスライドコア１１とを備えるインジェクション成形金
型を用いることができる。その上下の各型部１０は白抜
きで示すキャビティ空間１０ａと斜線で示すランド面１
０ｂとから形成され、キャビティ空間１０ａの中央側で
前後の縁辺にはリード部４．５…の軸線部４ｂ。In manufacturing this magnetic sensor, an injection molding die including upper and lower mold parts 10 (only one side is shown) as shown in FIG. 3 and a slide core 11 as shown in FIG. 4 can be used. Each of the upper and lower mold parts 10 has a cavity space 10a shown in outline and a land surface 1 shown in diagonal lines.
0b, and the axis portions 4b of the lead portions 4.5 are formed on the front and rear edges on the center side of the cavity space 10a.
５ｂ…を嵌込み係止（する凹溝１２ａ、１２ｂ。Concave grooves 12a and 12b that are fitted and locked.
１３ａ、１３ｂ…が設けられている。この凹溝のうち、
前縁側１２ａ、１３ａ…にあ）ては第４図で示すように
ワイヤーボンディング端子面として折曲された突端側４
ａ、５ａ…がキャビィティ空間１０ａから型外に露出す
るよう位置され、その突端側４ａ、５ａ”−をスライド
コア１１で型締め挟持できるようになっている。また、
キャビティ空間１０ａの内側には上下の各型部から突出
させてマグネット体３並びにリード部４．５…を位置決
め支持する支ビン１４… １５…が装着されている。こ
れら支ビンのうち、マグネット体３を支持する支ピン１
４…は第５．６図で示すように下型側のもの１４ａ…を
長くしかも上型側のもの１４ｂ…を短く突出させ、また
、第７図で示す如く突端側を半割りさせて段付面を設け
ることにより前後４個所からマグネット体３を安定よく
支持できるようになっている。リード部４．５…の支ピ
ン１５…は第８図で示すように各リード部４゜５…の間
隔内に位置し、樹脂を射出するに伴ってリード部４．５
…がズレ動かないよう位置決め係止できるようになって
いる。なお、これら各支ビン１４… １５…に加えて上
下の冬型部１０には樹脂基体１を金型から型外しするエ
ジェクトビン１６…も備付けられている。13a, 13b... are provided. Of this groove,
As shown in FIG. 4, the front edge sides 12a, 13a... have a protruding end 4 bent as a wire bonding terminal surface.
a, 5a, .
Inside the cavity space 10a, supporting pins 14, 15, . Among these support pins, the support pin 1 that supports the magnet body 3
4. As shown in Fig. 5.6, the lower part 14a is made longer and the upper part 14b is made to protrude shorter, and as shown in Fig. 7, the tip end is divided in half to form a step. By providing the attached surfaces, the magnet body 3 can be stably supported from four locations at the front and rear. The support pins 15 of the lead parts 4.5 are located within the interval of each lead part 4.5 as shown in FIG.
... can be positioned and locked to prevent it from shifting. In addition to these support bins 14...15..., the upper and lower winter mold sections 10 are also provided with eject bins 16 for removing the resin base 1 from the mold.
１６・・・も備付けられている。16... are also provided.
このインジェクション金型で樹脂基体１を成形するにあ
たっては第９図で示すようにリード部４．５…を所定本
−組で定間隔毎に一体成形したリードフレーム２０を用
いるとよく、そのリードフレーム２０を送り孔２１．２
１…でピッチ送りすることにより第１０図に示す如く複
数個の樹脂基体１．１…を−度に成形できしかも各組の
リード部４．５…を連続的に供給させて樹脂基体１゜１
…を形成することができる。このリードフレーム２０の
ピッチ送りで下型側１０の凹溝１２ａ。When molding the resin base 1 with this injection mold, it is preferable to use a lead frame 20 in which lead parts 4,5... are integrally molded at regular intervals in predetermined pairs as shown in FIG. 20 to feed hole 21.2
By pitch-feeding the resin substrates 1.1... as shown in FIG. 1
... can be formed. This pitch feeding of the lead frame 20 causes the groove 12a on the lower mold side 10 to be formed.
１２ｂ、１３ａ、１３ｂ＝−にリード部４．５−・・を
嵌込み位置すると、突端側４ａ、５ａ…が金型１０の側
縁に係合位置すると共に軸線部４ｂ。12b, 13a, 13b = - When the lead portions 4.5-... are fitted and positioned, the protruding ends 4a, 5a... are engaged with the side edges of the mold 10, and the axis portion 4b.
５ｂ…がキャビティ空間１０ａの内部に位置する。5b... are located inside the cavity space 10a.
そのリード部４．５…の組付けと共に、マグネット体３
を下型側１０の支ピン１４ａの半割りされた段付面に嵌
込むことにより下型１０のキャビティ空間１０ａに位置
決めさせて挿置する。この状態で上型側並びにスライド
コア１１を型締めすると、リード部４．５…は上下の支
ピン１４…が間隔内に割込むことにより位置決め保持さ
れ、
また、突端側４ａ、５ａ…がスライドコア１１で挾持さ
れてズレ動かないよう確実に保持される。Along with the assembly of the lead parts 4.5..., the magnet body 3
is positioned and inserted into the cavity space 10a of the lower mold 10 by fitting into the stepped surface of the supporting pin 14a of the lower mold side 10, which is divided into halves. When the upper mold side and the slide core 11 are clamped in this state, the lead parts 4.5... are held in position by the upper and lower support pins 14... inserted within the interval, and the tip ends 4a, 5a... are slid. It is held securely by the core 11 so that it does not shift.
それと同時にマグネット体３は上側の支ビン１４ｂ…で
押圧係止されて下側の支ピン１４ａ…とで保持される。At the same time, the magnet body 3 is pressed and locked by the upper support pins 14b and held by the lower support pins 14a.
この型締め後に金型のキャビティの空間１０ａに溶融樹
脂を射出すれば、リード部４．５…並びにマグネット体
３を所定位置にインサートさせて事後に半導体素子２を
嵌込み固定する凹部１ｂを持つ樹脂基体１を成形できる
ようになる。その樹脂基体１を型外し後はリード部４゜
５…のワイヤーボンディング端子面となる突端側４ａ、
５ａ…が樹脂基体１の外部に露出するため、第１図で示
したように近傍位置の凹部１ｂに嵌込み固定する半導体
素子２と簡単に電気的に接続できるようになる。If molten resin is injected into the cavity space 10a of the mold after this mold clamping, the lead parts 4, 5... and the magnet body 3 are inserted into predetermined positions to form a recess 1b into which the semiconductor element 2 is fitted and fixed afterwards. The resin base 1 can now be molded. After removing the resin base 1 from the mold, the tip side 4a becomes the wire bonding terminal surface of the lead portion 4゜5...
5a are exposed to the outside of the resin base 1, so that they can be easily electrically connected to the semiconductor element 2 which is fitted and fixed into the recess 1b located in the vicinity, as shown in FIG.
このように構成する磁気センサーは、半導体素子２の露
出面側を被検出体に対向させて樹脂基体１の基板部１ａ
に設けた止め穴６．７で被検出体の機器近傍にビス止め
すると共に、円形の止め穴６を中心にギヤー歯８で被検
出体と半導体素子２との対向間隔を調整させて固定すれ
ばＶＴＲやテープデツキの回転ドラム等を被検出体とし
て取付けることができる。その６Ｔ１気センサーでは、
回転ドラムの周側面に設けられた複数の着磁帯を半導体
素子２が検出して磁気パルスとしてカウントするよう作
用する。また、この着磁帯の磁力が弱いときにはマグネ
ット体３が半導体素子２を例示することにより着磁帯を
確実に検出し、その時間当りのカウント数如何に応じて
リード部４，５…から回転ドラムの駆動速度をフィード
バック制御する回路部に出力信号を出すよう機能する。The magnetic sensor configured in this manner is constructed by attaching the substrate portion 1a of the resin base 1 with the exposed surface side of the semiconductor element 2 facing the object to be detected.
The object to be detected is screwed to the vicinity of the device using the stop holes 6 and 7 provided in the hole 6, and the distance between the object to be detected and the semiconductor element 2 is adjusted using the gear teeth 8 around the circular stop hole 6. For example, a VTR, a rotating drum of a tape deck, etc. can be attached as the detected object. With that 6T1 ki sensor,
The semiconductor element 2 functions to detect a plurality of magnetized bands provided on the circumferential side of the rotating drum and count them as magnetic pulses. In addition, when the magnetic force of this magnetized band is weak, the magnet body 3 reliably detects the magnetized band by exemplifying the semiconductor element 2, and rotates from the lead parts 4, 5, etc. according to the number of counts per time. It functions to output an output signal to a circuit section that feedback controls the driving speed of the drum.
このリード部４．５…と制御回路部とは樹脂基体１から
外方に延在する軸線部４ｃ、５ｃ…を端子として接続で
き、また、上述した如く樹脂基体１の端面に露出する突
端側４ａ、５ａ…を半導体素子２とのボンディング面と
して接続すれば必要な回路構成に組立てることができる
。The lead parts 4.5... and the control circuit part can be connected to the axis parts 4c, 5c... extending outward from the resin base 1 as terminals, and as described above, the protruding end side exposed on the end surface of the resin base 1 By connecting 4a, 5a, . . . to the semiconductor element 2 as a bonding surface, a necessary circuit configuration can be assembled.
発明の効果
以上の如く、本発明に係る磁気センサーの製造方法に依
れば、マグネット体とリード部とを樹脂基体のインジェ
クション成形時に位置決めさせて一体成形するから、個
々別にアッセンブリするよりも手間を掛けずに少ない工
数で組立て得るばかりでなく、ワイヤーボンディング面
を樹脂基体の外部に露出させてリード部を定位置に装着
できることにより半導体素子を正確な回路構成で簡単に
組付けることを可能にするものである。Effects of the Invention As described above, according to the method for manufacturing a magnetic sensor according to the present invention, the magnet body and the lead portion are positioned and integrally molded during injection molding of the resin base, which saves time and effort compared to assembling them individually. Not only can it be assembled with less time and fewer man-hours, but the wire bonding surface can be exposed to the outside of the resin base and the leads can be mounted in a fixed position, making it possible to easily assemble semiconductor elements with an accurate circuit configuration. It is something.
第１図は本発明に係る方法で製造した磁気センサーの側
断面図、第２図は同センサーの平面図、第３図は同方法
で適用する金型の片部側を示す平面図、第４図は同金型
のスライドコアを示す側面図、第５図は第３図で示す型
部の正面図、第６図並びに第７図ａ、ｂはマグネット体
の支ピンを示す説明図、第８図はリード部の支ピンを示
す説明図、第９．１０図はリードフレームによる樹脂基
体のインジェクション成形状態を示す説明図である。
１：樹脂基体、１ｂ：凹部、２：半導体素子、３；マグ
ネット体、４，５…：リード部、４ａ。
５ａ…：ワイヤーボンディング端子面となる突端側、４
ｂ、５ｂ…：軸線部、１０，１１：金型、１０ａ：キャ
ビティ空間、２０：リードフレーム。
第６図FIG. 1 is a side sectional view of a magnetic sensor manufactured by the method according to the present invention, FIG. 2 is a plan view of the sensor, and FIG. 3 is a plan view showing one side of a mold to which the method is applied. Figure 4 is a side view showing the slide core of the same mold, Figure 5 is a front view of the mold part shown in Figure 3, Figures 6 and 7 a and b are explanatory views showing the support pins of the magnet body, FIG. 8 is an explanatory view showing the support pin of the lead portion, and FIGS. 9 and 10 are explanatory views showing the state of injection molding of the resin base by the lead frame. DESCRIPTION OF SYMBOLS 1: Resin base, 1b: Recessed part, 2: Semiconductor element, 3: Magnet body, 4, 5...: Lead part, 4a. 5a...: Tip end side that becomes the wire bonding terminal surface, 4
b, 5b...: axis line part, 10, 11: mold, 10a: cavity space, 20: lead frame. Figure 6
Claims (2)
２）を組付ける樹脂基体（１）をインジェクション成形
する際に半導体素子（２）と片端側で接続するリード部
（４、５…）並びに半導体素子（２）を適宜に励磁する
マグネット体（３）を金型（１０、１１）のキャビティ
空間（１０ａ）内に夫々位置決め挿置し、この金型（１
０、１１）の型締めに伴ってリード部（４、５…）の所
定形状に折り曲げ成形された突端側（４ａ、５ａ…）を
半導体素子（２）とのワイヤーボンディング端子面とし
てキャビティ空間（１０ａ）の外部に位置させ、その金
型（１０、１１）のキャビティ空間（１０ａ）に射出す
る樹脂でリード部（４、５…）の軸線（４ｂ、５ｂ…）
並びにマグネット体（３）を内部に保持した樹脂基体（
１）を一体成形し、この型外し後に樹脂基体（１）のワ
イヤーボンディング端子面が露出位置する近傍個所に設
けた凹部（１ｂ）で半導体素（２）を嵌込み固定すると
共に、半導体素子（２）とリード部（４、５…）のワイ
ヤーボンディング端子面とを電気的に接続させて組立て
るようにしたことを特徴とする磁気センサーの製造方法
。(1) A semiconductor element (
When injection molding the resin base (1) to which the semiconductor element (2) is assembled, lead parts (4, 5...) that connect to the semiconductor element (2) at one end, and a magnet body (3) that appropriately excites the semiconductor element (2). ) are positioned and inserted into the cavity spaces (10a) of the molds (10, 11), and the molds (1
0, 11), the tip sides (4a, 5a...) of the lead parts (4, 5...) bent into a predetermined shape are used as wire bonding terminal surfaces with the semiconductor element (2) in the cavity space ( 10a) and injected into the cavity space (10a) of the mold (10, 11) to form the axes (4b, 5b...) of the lead parts (4, 5...).
and a resin base holding the magnet body (3) inside (
1) is integrally molded, and after removing the mold, the semiconductor element (2) is fitted and fixed in the recess (1b) provided in the vicinity of the exposed wire bonding terminal surface of the resin base (1), and the semiconductor element (2) is 2) and the wire bonding terminal surfaces of the lead parts (4, 5, . . . ) are electrically connected and assembled.
０）でピッチ送りしつつ樹脂基体（１）を金型（１０、
１１）で連続的にインジェクション成形するようにした
ことを特徴とする請求項１記載の磁気センサーの製造方
法。(2) Connect the lead parts (4, 5...) to the lead frame (2)
0), the resin base (1) is placed into the mold (10,
2. The method for manufacturing a magnetic sensor according to claim 1, wherein step 11) involves continuous injection molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63215398A JPH067157B2 (en) | 1988-08-30 | 1988-08-30 | Method of manufacturing magnetic sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63215398A JPH067157B2 (en) | 1988-08-30 | 1988-08-30 | Method of manufacturing magnetic sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262988A true JPH0262988A (en) | 1990-03-02 |
| JPH067157B2 JPH067157B2 (en) | 1994-01-26 |
Family
ID=16671663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63215398A Expired - Lifetime JPH067157B2 (en) | 1988-08-30 | 1988-08-30 | Method of manufacturing magnetic sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH067157B2 (en) |
-
1988
- 1988-08-30 JP JP63215398A patent/JPH067157B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH067157B2 (en) | 1994-01-26 |
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