JPH0262790U - - Google Patents
Info
- Publication number
- JPH0262790U JPH0262790U JP14114288U JP14114288U JPH0262790U JP H0262790 U JPH0262790 U JP H0262790U JP 14114288 U JP14114288 U JP 14114288U JP 14114288 U JP14114288 U JP 14114288U JP H0262790 U JPH0262790 U JP H0262790U
- Authority
- JP
- Japan
- Prior art keywords
- board
- block assembly
- mounting
- chassis
- fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14114288U JPH0262790U (cs) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14114288U JPH0262790U (cs) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262790U true JPH0262790U (cs) | 1990-05-10 |
Family
ID=31405950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14114288U Pending JPH0262790U (cs) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262790U (cs) |
-
1988
- 1988-10-31 JP JP14114288U patent/JPH0262790U/ja active Pending
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