JPH0262726U - - Google Patents

Info

Publication number

JPH0262726U

JPH0262726U JP14053788U JP14053788U JPH0262726U JP H0262726 U JPH0262726 U JP H0262726U JP 14053788 U JP14053788 U JP 14053788U JP 14053788 U JP14053788 U JP 14053788U JP H0262726 U JPH0262726 U JP H0262726U

Authority

JP

Japan

Prior art keywords

resin

semiconductor device

protrusion

sealed semiconductor

bonding portion

Prior art date

1988-10-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002184 metal Substances 0.000 claims description 5
• 239000004065 semiconductor Substances 0.000 claims description 5
• 230000000630 rising effect Effects 0.000 claims description 2
• 238000010586 diagram Methods 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1