JPH0262721U - - Google Patents

Info

Publication number
JPH0262721U
JPH0262721U JP14257088U JP14257088U JPH0262721U JP H0262721 U JPH0262721 U JP H0262721U JP 14257088 U JP14257088 U JP 14257088U JP 14257088 U JP14257088 U JP 14257088U JP H0262721 U JPH0262721 U JP H0262721U
Authority
JP
Japan
Prior art keywords
package
integrated circuit
molding
recessed portion
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14257088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526741Y2 (US06534493-20030318-C00166.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14257088U priority Critical patent/JPH0526741Y2/ja
Publication of JPH0262721U publication Critical patent/JPH0262721U/ja
Application granted granted Critical
Publication of JPH0526741Y2 publication Critical patent/JPH0526741Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP14257088U 1988-10-31 1988-10-31 Expired - Lifetime JPH0526741Y2 (US06534493-20030318-C00166.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14257088U JPH0526741Y2 (US06534493-20030318-C00166.png) 1988-10-31 1988-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14257088U JPH0526741Y2 (US06534493-20030318-C00166.png) 1988-10-31 1988-10-31

Publications (2)

Publication Number Publication Date
JPH0262721U true JPH0262721U (US06534493-20030318-C00166.png) 1990-05-10
JPH0526741Y2 JPH0526741Y2 (US06534493-20030318-C00166.png) 1993-07-07

Family

ID=31408644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14257088U Expired - Lifetime JPH0526741Y2 (US06534493-20030318-C00166.png) 1988-10-31 1988-10-31

Country Status (1)

Country Link
JP (1) JPH0526741Y2 (US06534493-20030318-C00166.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303327A (ja) * 2005-04-22 2006-11-02 Denso Corp 電子回路装置およびその製造方法
JP2009033065A (ja) * 2007-07-30 2009-02-12 Mitsubishi Electric Corp フィン一体型半導体モジュールおよびその製造方法
JP2011528858A (ja) * 2008-07-24 2011-11-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング シールフレームならびに構成要素をカバーする方法
JP2018146264A (ja) * 2017-03-01 2018-09-20 矢崎総業株式会社 絶縁状態検出装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303327A (ja) * 2005-04-22 2006-11-02 Denso Corp 電子回路装置およびその製造方法
JP4548199B2 (ja) * 2005-04-22 2010-09-22 株式会社デンソー 電子回路装置の製造方法
JP2009033065A (ja) * 2007-07-30 2009-02-12 Mitsubishi Electric Corp フィン一体型半導体モジュールおよびその製造方法
JP2011528858A (ja) * 2008-07-24 2011-11-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング シールフレームならびに構成要素をカバーする方法
JP2018146264A (ja) * 2017-03-01 2018-09-20 矢崎総業株式会社 絶縁状態検出装置

Also Published As

Publication number Publication date
JPH0526741Y2 (US06534493-20030318-C00166.png) 1993-07-07

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