JPH0261093A - Electroplating equipment for long-sized work - Google Patents

Abstract

PURPOSE:To uniformize plating thickness of a cylindrical work by constituting the title plating equipment so that a work driving mechanism having a driving shaft tilted for the axial center of the cylindrical work is arranged to the work inlet side of a plating tank and both rotation of the work and transfer in the lengthwise direction are performed by rotation of a driving roller. CONSTITUTION:Negative electricity is imparted to a cylindrical or round bar-like work W and also the work W is sent forward while being rotated to the direction S by rotation of a driving roller 37 to the direction R. This work W is sent into a plating tank 1 from a work inlet 5 and plated while the work is passed through plating liquid in the tank 1. In the meantime, the work W is rotated at constant velocity and moved forward and plating uniform in thickness is performed in the circumferential direction and the lengthwise direction of the work W and thereafter the work W is take out forward from a work outlet 6. Further an anodic plate 14, an ejection pipe 23 of plating liquid and a driving shaft 36 are shown in the figure, respectively.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to an apparatus for electroplating long workpieces.

(Prior art) As a long workpiece, for example a cylinder rod, 1
When electroplating workpieces having a length of 3 m to 3 m, for example, the workpieces are suspended in a rack U) in groups of a plurality of lots and immersed in a plating bath. However, in the above-mentioned hanging type plating apparatus, the plating thickness tends to vary between the upper and lower ends and the center of the workpiece, and the work efficiency is also poor. It is also difficult to make the plating tank body compact.

On the other hand, as an apparatus for continuously plating hoop materials such as strips, an apparatus has been developed in which a workpiece port and a workpiece outlet are formed at both ends of a plating tank, and the workpiece is continuously passed through for plating. However, when a long workpiece in the shape of a cylinder or a round bar is plated using such an apparatus, variations in the plating thickness tend to occur in the circumferential direction of the workpiece.

In addition, attempts have been made to improve and make the current density uniform by stirring the plating bath, but this is not sufficient.

(Objective of the Invention) The object of the present invention is to uniformize the plating thickness in the longitudinal direction and circumferential direction of the workpiece and thereby improve the quality thereof, when plating a long cylindrical or rod-like workpiece. The aim is to improve efficiency and make equipment space more compact.

(Technical Means for Achieving the Object) In order to achieve the above object, the invention described in claim (1) provides a work inlet and a work outlet at both ends of the plating bath in the work feed direction into which the plating solution is injected. In an electroplating device for long workpieces, in which an anode plate is placed on both sides of the workpiece passageway in the plating tank, the workpiece inlet side of the plating tank is
A workpiece drive mechanism having a drive shaft inclined with respect to the axis of a cylindrical or round bar-shaped workpiece is arranged, and a drive roller that presses against the outer peripheral surface of the workpiece is fixed to the drive shaft, and the workpiece is rotated by the rotation of the drive roller. and movement in the length direction.

The invention set forth in claim (2), in addition to the structure of the invention set forth in claim (1), further comprises arranging a plating solution jet pipe in the plating tank, and directing a jet of plating solution onto the workpiece passing through the jet pipe. A plurality of spray nozzles are provided.

The invention set forth in claim (3) is such that the plating solution jetting pipe according to the invention set forth in claim (2) is located below the workpiece passing passage, and the nozzle portion is configured to spray the plating solution upward from below onto the workpiece. It is located in

The invention as claimed in claim (4) is such that the plating solution jetting tube according to the invention as claimed in claim (2) is located on both the left and right sides of the workpiece passing passage, and a plurality of nozzle portions are attached to the workpiece from both the left and right sides. It is arranged so that the plating solution is sprayed out.

The invention set forth in claim (5), in addition to the invention set forth in claim (1), includes arranging a cylindrical jet duct in the plating tank so as to surround the workpiece, and connecting a plating solution circulation pump to the jet duct. By doing so, the plating solution flows at high speed along the length of the duct, and numerous current passing holes are formed in the peripheral wall of the duct to allow current to pass between the workpiece inside the duct and the anode plate outside the duct. are doing.

(Operation) A long workpiece in the form of a cylinder or round bar is fed into the plating tank in the length direction while rotating at a constant speed by the rotation of the inclined drive roller of the drive mechanism, and is continuously rotated in the plating tank. plated on.

In the invention described in claims (2), (3), and (4), the plating solution is jetted or sprayed onto the workpiece while it is passing through the plating tank, thereby promoting the supply of ions to the workpiece surface and generating a high current. density is ensured.

Furthermore, in the invention as set forth in claim (5), a high current density is ensured by causing the plating solution to flow in the duct at high speed.

(Example) Figures 1 to 7 are claims (1), (2), and (3) of the present application.
1 is an overall perspective view of an electroplating apparatus to which the described invention is applied; in FIG. 1, assuming that the work feed direction side is the front side, a plating tank 1 is placed above a plating solution sub-tank 2;
The plating tank 1 has an open top surface and is formed into a box shape that is long in the front-rear direction, while the sub tank 2 is formed in a box shape that is wider than the plating tank 1 and has an open top surface.

On the rear side of the plating tank 1, in order from the rear, there are a first support mechanism 10a on the inlet side, a workpiece drive mechanism 8, and a second support mechanism 10 on the inlet side.
b is arranged, and an outlet side support mechanism 10c is arranged at the front side of the plating tank 1.

A work piece 5 is formed on the rear end wall of the plating tank 1, and a plating solution outlet 18 is formed above this, and a plating solution return port 20 is formed on the upper end portion of the rear end wall of the sub-tank 2. The return port 20 is connected to the plating solution outlet 18 of the plating tank 1 through a communication pipe.

A workpiece outlet 6 is formed at a position corresponding to the workpiece inlet 5 on the front end wall of the plating [1], and a plating solution supply port 17 is formed at the lower end, and a plating solution suction port is formed at the lower end of the front end wall of the sub-tank 2. A port 19 is formed, and the suction port 19 is connected to the plating tank 1 through a connecting pipe and a plating solution circulation pump 12.
The plating solution supply port 17 is connected to the plating solution supply port 17, and the plating solution is pumped from the sub-tank 2 to the plating solution supply port 17 by the circulation pump 12.

Inside the plating bath 1, a straight line connecting the workpiece inlet 5 and the workpiece outlet 6 is a workpiece passage P, and an anode plate 14 is arranged on both sides of the workpiece passage P. It is suspended from a bar, etc. A plating solution jetting pipe 23 extending in the front-rear direction over approximately the entire length of the plating tank 1 is arranged below the work passage P, and the front end of the jetting pipe 23 is connected to the plating solution supply port 1.
7, and the rear end is closed. A plurality of upward nozzle portions 24 are provided on the upper surface of the ejection pipe 23 at intervals in the front-rear direction.

In FIG. 3, which is a vertical cross-sectional view of FIG.
Inside and sub tank 2, the plating solution is at the liquid level Ll.
, up to L2, and each nozzle portion 24 is arranged so as to spray the plating solution from substantially directly below to vertically upwardly toward the workpiece W passing through.

Figure 2 shows the workpiece drive mechanism 8 and workpiece support mechanisms 10a and 1.
0b, the drive motor 35 of the workpiece drive mechanism 8 has its drive shaft 36 inclined with respect to the workpiece W at a desired angle θ1.

A synthetic resin or hard rubber drive roller 37 is fixed to the drive shaft 36 coaxially with the drive shaft 36, and the drive roller 37 is in pressure contact with the upper surface of the work W, and the rotation of the drive roller 37 in the R direction The workpiece W is fed forward while being rotated in the S direction. Note that it is also possible to arrange a pair of drive rollers 37 above and below so that the workpiece W can be driven while being held between the top and bottom.

The drive motor 35 is fixed to the vertical portion 31 of the motor mounting plate 30 with bolts 46 and nuts 47. Mounting plate 3
0 is a frame 29 with the vertical fulcrum shaft bolt 40 as the center of rotation.
It is rotatably mounted on the fulcrum shaft bolt 40.
It is fixed to the pedestal 29 by bolts 43 and nuts 44 inserted into arc-shaped elongated holes 41 centered at . That is, by adjusting the rotation of the mounting plate 30 around the fulcrum shaft bolt 40, the inclination angle θ1 of the axis of the drive roller 37 with respect to the workpiece W can be changed.

The first support mechanism 10a includes support rollers 55 rotatably supported by vertical brackets 50 on both sides of the work W, and the axis of the support rollers 55 is inclined with respect to the work at the same angle as the inclination angle of the drive axis. It is inclined at an angle θ2 and on the opposite side to the drive shaft 36. Four horizontal mounting plates are integrally formed on the bracket 50, and the mounting plates 49 are connected to the drive motor 35.
Similarly to the mounting plate 30 for the mount 29, it is mounted on two mounts so as to be rotatable about the fulcrum shaft bolt 62, and is attached to the mount 29 by means of bolts 53 and nuts 54 inserted through arc-shaped elongated holes 51. Fixed. That is, by rotating and adjusting the mounting plate 49, the inclination angle θ2 and the workpiece support height can be changed.

The second support mechanism 10b and the outlet side support mechanism 10c in FIG.
has a similar structure. Figure 5 shows the support mechanism 1 and the second part of Oa.
It is a view in the direction of the ■ arrow in the figure.

FIG. 4 is a view taken in the direction of the ■ arrow in FIG. The vertical position of the motor 35 is adjusted.

FIG. 6 is a longitudinal cross-sectional view of the workpiece outlet 6, and the seal 26 has a slit 28 for passing the workpiece, and also has a separate lower seal 26a, and as shown in FIG. W is designed to pass through. The inlet seal 26 in FIG. 1 has a similar structure.

A brief explanation of plating work and circulation of plating solution will be given below. As the round bar-shaped workpiece, for example, one in which cylinder rods are successively connected in the longitudinal direction in a screwing manner is used. The work W is supplied with negative electricity by a power supply device (not shown), and is sent forward while rotating in the S direction by the rotation of the drive roller 37 in the R direction in FIG. plating is applied while passing through the plating solution in the plating tank 1. At this time, the workpiece W is rotating at a constant speed and moving forward, so that the workpiece W is plated to a uniform thickness in the circumferential direction and lengthwise direction. The workpiece is then taken out forward from the workpiece outlet 6 in FIG.

Note that if the outer diameter of the drive roller 37 in FIG.
Move forward cos(90-θ1). Further, the rotation speed of the workpiece W is inversely proportional to the diameter of the workpiece and proportional to the diameter of the drive roller.

During plating work, the plating solution sucked out from the sub-tank 2 by the circulation pump 12 is fed under pressure from the plating solution supply port 17 into the ejection pipe 23 in the plating tank 1, and is ejected from each nozzle portion 24 toward the workpiece W above. be done. This accelerates the supply of ions to the workpiece surface, increases current density, increases plating speed, and improves plating work efficiency.

The plating solution in the plating chamber 1 overflows from the plating solution outlet 18 and is returned into the sub-tank 2.

Further, the plating solution leaking from the workpiece inlet 5 and workpiece outlet 6 falls into the sub-tank 2.

(Embodiment of the invention set forth in claim 4) FIGS. 8 and 9 are vertical sectional views of a plating apparatus to which the invention set forth in claim 4 is applied, and the plating apparatus shown in FIG. The structure is different.

That is, a pair of left and right plating solution ejection source pipes 61 are arranged at the bottom of the plating tank 1, each ejection source pipe 61 is provided with a riser pipe 62 extending upward, and each riser pipe 62 is provided with an interval in the vertical direction. A plurality of nozzle parts 24 are provided at intervals, and each nozzle part 24 opens toward the workpiece side. The front end of the ejection source pipe 61 is connected to the plating solution circulation pump 12 via the plating solution supply port 17 . The riser 62 is the ninth
As shown in the figure, a plurality of them are provided at intervals in the front and back direction. That is, in the apparatuses shown in FIGS. 8 and 9, the plating solution is ejected from both left and right sides of the workpiece W passing through the plating tank 1.

The rest of the structure is the same as the plating apparatus shown in FIG. 1, and the same parts are given the same numbers. Of course, it is equipped with a drive mechanism as shown in FIG.

(Embodiment of the invention set forth in claim 5) FIG. 10 shows a plating apparatus to which the invention set forth in claim 5 is applied, in which a plating solution jet duct 70 is arranged instead of the plating solution jet pipe as shown in FIG. Then, the workpiece W is placed inside the duct 70.
It has a structure that allows it to pass through while rotating.

That is, a jet duct 70 extending in the front-rear direction so as to surround the work passage P is arranged in the plating tank 1, and the jet duct 70
The front end 70a of the jet duct 70 is connected to the plating solution circulation pump 12 via the plating solution supply port 17, and the rear end of the jet duct 70 is closed. As shown in FIG. 12, a large number of small holes 71 for passing current are formed in the peripheral wall of the jet duct 70.
As shown in FIG. 11, current is made to flow between the anodes 14 on both sides and the workpiece W in the duct 70.

The rest of the structure is the same as that of the plating apparatus shown in FIG. 1, and the same parts are given the same numbers. Of course, it is equipped with a drive mechanism as shown in FIG.

In this structure, the plating solution flows from the front to the rear inside the duct 70 at high speed, and the high-speed flow of the plating solution promotes the supply of ions to the workpiece surface, increasing the current density.

Furthermore, the plating liquid in the duct 70 is applied through the numerous small holes 71. The plating solution is discharged into the sub-tank 1 and returned to the sub-tank 2 from the plating solution outlet 18.

(Other Examples) (+) As the workpiece support mechanism, various types of bearings that can guide rotation and longitudinal movement can be used, such as a pair of ball-shaped bearings.

(Effects of the Invention) As explained above, according to the present invention: (1) A cylindrical or rod-shaped long work is rotated at a constant speed by the work drive mechanism 8 and continuously passes through the plating tank 1. Compared to the conventional structure in which every 10 pieces are suspended and immersed in the electroplating process, the uniformity of the plating thickness in the circumferential direction and length direction of the workpiece W can be improved. It is possible to improve product quality.

(2) Since the workpiece W is continuously passed through the plating tank 1, the equipment space can be made compact and work efficiency can be improved.

In addition to the above-mentioned effects, the following effects can also be expected in the inventions described in claims (2) to (5).

(1) Since the workpiece W moving in the plating tank 1 is bombarded with a jet of plating solution from below or from both sides, or the workpiece is passed through the jet duct 70 through which the plating solution flows at high speed, The jet stream and the like promote the supply of ions to the surface of the workpiece, thereby increasing the current density, increasing the plating speed, and further improving the plating work efficiency. 4,

[Brief explanation of the drawing]

Fig. 1 is an overall perspective view of a plating apparatus to which claims (1), (2), and (3) of the present application are applied, Fig. 2 is a plan view of a workpiece drive mechanism, and Fig. 3 is a schematic vertical cross-sectional view of Fig. 1. , Figure 4 is the second
Figure 5 is the support mechanism shown in Figure 2. Figure 6 is an enlarged vertical cross-sectional view of the outlet of the plating tank. FIG. 8 is a vertical sectional view of a plating apparatus to which claim (4) is applied, FIG. 9 is a partial view in the direction of the ■ arrow in FIG. 8,
FIG. 10 is an overall perspective view of a plating apparatus to which claim (5) is applied, FIG. 11 is a vertical sectional view of the jet duct of FIG. 10,
FIG. 12 is a partially enlarged side view of the jet duct shown in FIG. 10. 1... Plating tank, 5... Work inlet, 6...
Work outlet, 8... Work drive mechanism, 14... Anode plate, 23... Plating solution jet pipe, 24... Nozzle part,
35... Drive motor, 36... Drive shaft, 37... Drive roller, 61... Plating solution jet source pipe, 62... Rising pipe, 70... Plating solution jet duct, 71... Patent applicant for small hole for passing current: Uemura Kogyo Co., Ltd.

Claims (5)

[Claims] (1) In an electroplating apparatus for long workpieces, a workpiece inlet and a workpiece outlet are formed at both ends in the workpiece feeding direction of a plating tank into which a plating solution is injected, and anode plates are arranged on both sides of a workpiece passageway in the plating tank, A workpiece drive mechanism having a drive shaft inclined with respect to the axis of the cylindrical or round bar-shaped workpiece is disposed on the workpiece inlet side of the plating tank, and a drive roller that presses against the outer peripheral surface of the workpiece is fixed to the drive shaft, An electroplating device for long workpieces in which the workpiece is rotated and moved in the length direction by rotation of a drive roller. (2) The long piece according to claim (1), wherein a plating solution jetting pipe is arranged in the plating tank, and the jetting pipe is provided with a plurality of nozzle parts for spraying a jet of plating solution onto the workpiece passing through the plating tank. Electroplating equipment for workpieces. (3) Claim (2), wherein the plating solution jetting pipe is located below the workpiece passing passage in the plating tank, and the nozzle portion is arranged so as to spray the plating solution upward from below onto the workpiece.
Electroplating equipment for long workpieces as described. (4) The long strip according to claim (2), wherein the plating solution jetting pipe is located on both the left and right sides of the work passage, and the plurality of nozzle parts are arranged so as to spray the plating solution from both the left and right sides of the workpiece. Electroplating equipment for workpieces. (5) A cylindrical jet duct is arranged in the plating tank so as to surround the workpiece passing through, and a plating solution circulation pump is connected to the jet duct, so that the plating solution is distributed along the length of the duct. The electroplating apparatus for long workpieces according to claim (1), wherein a large number of current passing holes are formed in the peripheral wall of the duct to allow the current to pass between the workpiece inside the duct and the anode plate outside the duct. .