JPH0260434U - - Google Patents
Info
- Publication number
- JPH0260434U JPH0260434U JP13837988U JP13837988U JPH0260434U JP H0260434 U JPH0260434 U JP H0260434U JP 13837988 U JP13837988 U JP 13837988U JP 13837988 U JP13837988 U JP 13837988U JP H0260434 U JPH0260434 U JP H0260434U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- connection part
- cable
- quick
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Cable Accessories (AREA)
Description
第1図は本考案のケーブル接続部の一実施例を
示す断面図、第2図は従来のケーブル接続部を示
す断面図、第3図a,bはその補強絶縁層の移動
状況を示す断面図である。
1,11…導体、2,12…圧縮スリーブ、3
,13…内部半導電層、4,14…ケーブル絶縁
層、5,15…補強絶縁層、6,16…ゴム遮蔽
層、7,17…外部半導電層、8…絶縁コンパウ
ンド、19…急速硬化型もしくは急速乾燥型の絶
縁コンパウンドまたは接着剤。
Fig. 1 is a sectional view showing an embodiment of the cable connection part of the present invention, Fig. 2 is a sectional view showing a conventional cable connection part, and Figs. 3 a and b are sectional views showing the movement of the reinforcing insulating layer. It is a diagram. 1, 11...Conductor, 2,12...Compression sleeve, 3
, 13... Inner semiconductive layer, 4, 14... Cable insulating layer, 5, 15... Reinforcement insulating layer, 6, 16... Rubber shielding layer, 7, 17... Outer semiconducting layer, 8... Insulating compound, 19... Rapid curing mold or quick-drying insulation compound or adhesive.
Claims (1)
を段剥して導体接続を行なつた導体接続部の外周
に、ケーブル絶縁層にまたがつて補強絶縁層を形
成してなるケーブル接続部において、前記ケーブ
ル絶縁層上に、急速硬化型もしくは急速乾燥型の
、絶縁コンパウンドまたは接着剤の薄層を形成し
、その上に前記補強絶縁層を形成したことを特徴
とするケーブル接続部。 In a cable connection part where a reinforcing insulating layer is formed over a cable insulation layer on the outer periphery of a conductor connection part where conductor connection is made by stripping the ends of rubber/plastic cables to be connected, the cable insulation layer is A cable connection part characterized in that a thin layer of a quick-curing or quick-drying insulating compound or adhesive is formed on the layer, and the reinforcing insulating layer is formed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13837988U JPH0260434U (en) | 1988-10-24 | 1988-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13837988U JPH0260434U (en) | 1988-10-24 | 1988-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260434U true JPH0260434U (en) | 1990-05-02 |
Family
ID=31400661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13837988U Pending JPH0260434U (en) | 1988-10-24 | 1988-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260434U (en) |
-
1988
- 1988-10-24 JP JP13837988U patent/JPH0260434U/ja active Pending
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