JPH0260305A - Manufacture of dielectric filter - Google Patents

Manufacture of dielectric filter

Info

Publication number
JPH0260305A
JPH0260305A JP21178588A JP21178588A JPH0260305A JP H0260305 A JPH0260305 A JP H0260305A JP 21178588 A JP21178588 A JP 21178588A JP 21178588 A JP21178588 A JP 21178588A JP H0260305 A JPH0260305 A JP H0260305A
Authority
JP
Japan
Prior art keywords
coupling hole
dielectric
holes
dielectric block
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21178588A
Other languages
Japanese (ja)
Inventor
Kazuhisa Sano
和久 佐野
Akiji Miyashita
宮下 明司
Yasuhiko Kikuyama
菊山 泰彦
Satoshi Miyoshi
三好 智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP21178588A priority Critical patent/JPH0260305A/en
Publication of JPH0260305A publication Critical patent/JPH0260305A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To obtain a dielectric filter with a low cost to simplify a manufacturing process by coating and baking a conductor paste to the aperture surface of a coupling hole, and grinding the surface of the aperture surface facing of the coupling hole to form a conductor film until the coupling hole is exposed. CONSTITUTION:When immersion is executed up to the immediate bottom of the aperture surface to a conductor paste 16 with the aperture surface of a coupling hole 12 upwards, the paste 16 is invaded into through holes 11 and 14 and even at the side surface and bottom surface of a dielectric block 10, a conductor film 13 is formed. On the aperture surface of the coupling hole 12, namely, on the upper surface of the block 10, a conductor film is coated, put into the furnace and the baking processing is executed. Thereafter, the grinding is executed until the opposite side edge of the aperture part of the coupling hole 12 is exposed. As the result, the surface having the conductor film of the upper surface becomes a shorting edge surface and the surface to expose the dielectric of the lower surface becomes the open edge surface. The dimension after the grinding corresponds to the resonance frequency of the resonator unit.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、誘電体フィルタの製造方法に係るもので、特
に複数個の共振子ユニットを一体化したブロック型の誘
電体フィルタの導体膜の形成方法に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a dielectric filter, and particularly to a method for manufacturing a conductive film of a block-type dielectric filter that integrates a plurality of resonator units. This relates to a forming method.

〔従来技術〕[Prior art]

誘電体ブロックに所定の間隔で貫通孔を形成してその表
面に内導体を形成し、外周面に外導体を形成し、貫通孔
の一端側に導体膜を形成して短絡端面とした誘電体フィ
ルタが、マイクロ波帯において各方面で用いられるよう
になっている。
A dielectric material in which through-holes are formed in a dielectric block at predetermined intervals, an inner conductor is formed on the surface of the dielectric block, an outer conductor is formed on the outer peripheral surface, and a conductive film is formed on one end of the through-hole to create a short-circuited end surface. Filters are now being used in various fields in the microwave band.

このようなブロック形の誘電帯フィルタは組立が容易で
あけ、機械的な強度の面でも優れている利点がある。
Such a block-shaped dielectric band filter has the advantage of being easy to assemble and having excellent mechanical strength.

第7図は、そのようなブロック形の誘電体フィルタの斜
視図である。直方体の誘電体ブロック40に断面が円形
となる二個の貫通孔41が形成されておけ、この貫通孔
41の表面には導体膜が形成されて、内導体となってい
る。貫通孔41と平行な外周面にも導体膜が形成され、
外導体と・なっている。
FIG. 7 is a perspective view of such a block-shaped dielectric filter. Two through holes 41 having a circular cross section are formed in the rectangular parallelepiped dielectric block 40, and a conductive film is formed on the surface of the through holes 41 to serve as an inner conductor. A conductive film is also formed on the outer peripheral surface parallel to the through hole 41,
It becomes the outer conductor.

上面にも導体膜が形成され、短絡端面となっているが、
下面のみは導体膜が形成されず、開放端面となっている
A conductive film is also formed on the top surface, making it a short-circuited end surface.
No conductor film is formed on only the bottom surface, which is an open end surface.

貫通孔41の内導体と外周面の導体膜によって、−個の
共振子ユニットが形成される。これらの共振子ユニット
間には、結合を調整するための結合孔42が形成されて
おけ、この結合孔42の表面には導体膜が形成されず、
誘電体が露出している。
- resonator units are formed by the inner conductor of the through hole 41 and the conductor film on the outer peripheral surface. Coupling holes 42 for adjusting coupling are formed between these resonator units, and no conductor film is formed on the surface of the coupling holes 42.
Dielectric is exposed.

〔課題〕〔assignment〕

上記のように、貫通孔には、導体膜が必要なものと、導
体膜があってはならないもの、の二種類がある。
As mentioned above, there are two types of through holes: those that require a conductive film and those that do not require a conductive film.

そのため、導体膜の形成は、結合孔を粘土、シリコンゴ
ム等で塞いだけ、筆を用いて導体ペーストを所定の表面
および貫通孔内に塗布する作業などが必要である。した
がって、導体膜の形成に多くの工数を必要としている。
Therefore, forming the conductive film requires the following steps: simply closing the bonding holes with clay, silicone rubber, etc., and applying conductive paste to the predetermined surface and inside the through holes using a brush. Therefore, many man-hours are required to form the conductive film.

本発明は、誘電体ブロックを導体ペーストに浸漬して表
面および所定の貫通孔内のみに導体膜を形成できる、効
率的な誘電体フィルタの製造方法を提供するものである
The present invention provides an efficient method for manufacturing a dielectric filter in which a dielectric block is immersed in a conductive paste to form a conductive film only on the surface and within predetermined through holes.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、結合孔を誘電体ブロックを貫通して形成せず
、開放端面にのみ開口した構造とし、短絡端面が塞がっ
ていることを利用して導体ペーストに誘電体ブロックを
浸漬することによって、上記の課題を解決するものであ
る。
In the present invention, the coupling hole is not formed through the dielectric block, but is opened only on the open end surface, and the dielectric block is immersed in the conductive paste by utilizing the fact that the short-circuited end surface is closed. This solves the above problems.

すなわち、共振子ユニットの内導体が形成される複数の
貫通孔とその間に結合孔を有する誘電体ブロックの該貫
通孔と側面に導体膜を形成する誘電体フィルタの製造方
法において、該結合孔を該貫通孔と平行な方向に該誘電
体ブロックを貫通しないように形成し、該結合孔の開口
面に対向する面を下にして導体ペーストに浸漬し、該貫
通孔内および該誘電体ブロックの側面と下面に導体膜を
形成し、該誘電体ブロックの該結合孔の開口面に導体ペ
ーストを塗布し、該導体ペーストを焼付けし、該結合孔
の開口面に対抗する面を該結合孔が露出するまで研磨す
ることに特徴を有するものである。
That is, in a method for manufacturing a dielectric filter in which a conductor film is formed on the through holes and side surfaces of a dielectric block having a plurality of through holes in which inner conductors of a resonator unit are formed and a coupling hole between them, the coupling hole is The dielectric block is formed in a direction parallel to the through hole so as not to penetrate through the dielectric block, and is immersed in a conductive paste with the surface opposite to the opening surface of the coupling hole facing down. A conductive film is formed on the side surface and the bottom surface, a conductive paste is applied to the opening surface of the coupling hole of the dielectric block, and the conductive paste is baked, so that the surface opposite to the opening surface of the coupling hole is coated with a conductive paste. It is characterized by polishing until it is exposed.

また、粘着テープで結合孔を塞いで浸漬すれば貫通孔内
と誘電体ブロックの全表面に同時に導体膜を形成するこ
とができる。
Furthermore, if the bonding holes are covered with an adhesive tape and immersion is performed, a conductive film can be simultaneously formed inside the through holes and on the entire surface of the dielectric block.

〔実施例〕〔Example〕

以下、図面を参照して、本発明の実施例について説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.

第1図から第5図までは本発明の実施例の各工程を示す
正面断面図である。第1図のように、直方体の誘電体ブ
ロック10に所定の間隔で貫通孔11を形成する。この
例は二個の共振子ユニットを一体にしたものであけ、貫
通孔11は二本形成される。
1 to 5 are front sectional views showing each step of an embodiment of the present invention. As shown in FIG. 1, through holes 11 are formed at predetermined intervals in a dielectric block 10 having a rectangular parallelepiped shape. In this example, two resonator units are integrated, and two through holes 11 are formed.

共振子ユニット間、すなわち貫通孔11間には結合孔1
2が形成される。この結合孔12は貫通孔11と平行に
伸びるように形成され、誘電体ブロック10を貫通せず
に、一方のみに開口を有する形状としである。この例で
は、上面に開口を有しておけ、下面は誘電体で塞がれて
いる。
A coupling hole 1 is provided between the resonator units, that is, between the through holes 11.
2 is formed. This coupling hole 12 is formed to extend parallel to the through hole 11, and has a shape that does not penetrate through the dielectric block 10 but has an opening only on one side. In this example, an opening is provided on the top surface, and the bottom surface is closed with a dielectric material.

次に、第2図に示したように、この誘電体ブロック10
を導体ペースト16に浸漬する。結合孔12の開口する
面を上にして、その面の直下まで導体ぺ−スト16に浸
かるようにする。貫通孔11内にも導体ペースト16が
浸入し、誘電体ブロック10の表面にイ」着する。
Next, as shown in FIG. 2, this dielectric block 10
is immersed in conductor paste 16. The surface where the coupling hole 12 is opened is facing up, and the conductor paste 16 is immersed in the conductor paste 16 to just below that surface. The conductive paste 16 also penetrates into the through hole 11 and is deposited on the surface of the dielectric block 10.

導体ペーストから引き上げた誘電体ブロックは第3図の
ように、側面と底面に導体膜13が形成されるとともに
、貫通孔11内の表面にも導体膜14が形成される。こ
の導体膜13が共振子ユニットの外導体となけ、導体膜
14が内導体となる。結合孔12内の表面には導体膜が
形成されない。
As shown in FIG. 3, the dielectric block lifted from the conductive paste has a conductive film 13 formed on the side and bottom surfaces, and a conductive film 14 also formed on the surface inside the through hole 11. This conductor film 13 serves as the outer conductor of the resonator unit, and the conductor film 14 serves as the inner conductor. No conductor film is formed on the surface inside the bonding hole 12.

次に、第4図のように、誘電体ブロック10の上面、す
なわち結合孔の開口面に導体膜15を形成する。この形
成は、筆塗りあるいは印刷等の方法で行い、結合孔12
内に導体膜が形成されないように注意しなければならな
い。
Next, as shown in FIG. 4, a conductive film 15 is formed on the upper surface of the dielectric block 10, that is, on the opening surface of the coupling hole. This formation is performed by a method such as brush painting or printing.
Care must be taken to ensure that no conductive film is formed inside.

上記のように、誘電体ブロックの貫通孔内と表面に付い
た導体ペーストは炉に入れられ、焼付処理が施される。
As described above, the conductive paste adhered to the inside of the through hole and the surface of the dielectric block is placed in a furnace and subjected to a baking process.

その後、第5図に示したように、下側の面、すなわち結
合孔の開口部の反対側の表面を研磨する。誘電体ブロッ
ク10の下面の導体膜および誘電体が削られ、結合孔1
2の他端が下面に露出するまで研磨される。」−面の導
体膜がある面が短絡端面となけ、下面の誘電体の露出し
た面が開放端面となる。研磨後の寸法は、共振子ユニッ
トの共振周波数に応したものとなる。
Thereafter, as shown in FIG. 5, the lower surface, that is, the surface opposite to the opening of the bonding hole, is polished. The conductor film and dielectric material on the lower surface of the dielectric block 10 are shaved, and the coupling hole 1 is
2 is polished until the other end is exposed on the bottom surface. The surface with the conductive film on the "-" side is the short-circuited end surface, and the exposed surface of the dielectric material on the bottom surface is the open end surface. The dimensions after polishing correspond to the resonant frequency of the resonator unit.

第6図は、本発明の他の実施例を示したものである。誘
電体ブロック20に前記と同様に貫通孔21と結合孔2
2を形成し、粘着テープ27で結合孔22の開口部を塞
いで導体ペースト26に浸漬する。この場合は、」二面
を含めて全体を導体ペースト26に沈めることができる
。したがって、前記の例の第4図で示したペースト塗布
の工程は不要となる。
FIG. 6 shows another embodiment of the invention. A through hole 21 and a coupling hole 2 are formed in the dielectric block 20 in the same manner as described above.
2 is formed, the opening of the bonding hole 22 is covered with an adhesive tape 27, and then immersed in the conductive paste 26. In this case, the entire body including the two sides can be submerged in the conductive paste 26. Therefore, the paste application process shown in FIG. 4 in the above example is unnecessary.

粘着テープは導体ペース1−の焼何時に燃焼してしまう
ので、これを剥がす作業などは不要である。
Since the adhesive tape burns when the conductive paste 1- is burned, there is no need to remove it.

ただし、粘着テープを貼ってあった部分には導体膜が形
成されていないので、短絡端面からの磁束の漏れを防く
ため、焼付後導体を塗布しておいた方がよい。
However, since a conductor film is not formed on the part where the adhesive tape was pasted, it is better to apply a conductor after baking to prevent leakage of magnetic flux from the shorted end face.

〔効果〕〔effect〕

本発明によれば、導体ペーストへの浸漬によって導体膜
を容易に形成することができる。しまたがって、誘電体
フィルタの製造工程を大幅に簡略化でき、低コスI・の
誘電体フィルタが得られる。
According to the present invention, a conductive film can be easily formed by dipping into a conductive paste. In addition, the manufacturing process of the dielectric filter can be greatly simplified, and a dielectric filter with low cost I can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図から第5図までは本発明の実施例を示す正面断面
図、第6図は本発明の他の実施例を示す正面断面図であ
け、第7図は誘電体フィルタの斜視図である。 10.20・・・・・・誘電体ブロック11.21・・
・・・・貫通孔 12.22・・・・・結合孔 13.1.4.15・・・・導体膜
1 to 5 are front sectional views showing an embodiment of the present invention, FIG. 6 is a front sectional view showing another embodiment of the invention, and FIG. 7 is a perspective view of a dielectric filter. be. 10.20...Dielectric block 11.21...
...Through hole 12.22...Coupling hole 13.1.4.15...Conductor film

Claims (5)

【特許請求の範囲】[Claims] (1)共振子ユニットの内導体が形成される複数の貫通
孔とその間に結合孔を有する誘電体ブロックの該貫通孔
と側面に導体膜を形成する誘電体フィルタの製造方法に
おいて、該結合孔を該貫通孔と平行な方向に該誘電体ブ
ロックを貫通しないように形成し、該結合孔の開口面に
対向する面を下にして導体ペーストに浸漬し、該貫通孔
内および該誘電体ブロックの側面と下面に導体膜を形成
し、該誘電体ブロックの該結合孔の開口面に導体ペース
トを塗布し、それらの導体ペーストを焼付けし、該結合
孔の開口面に対抗する面を該結合孔が露出するまで研磨
することを特徴とする誘電体フィルタの製造方法。
(1) A method for manufacturing a dielectric filter in which a conductor film is formed on the through holes and side surfaces of a dielectric block having a plurality of through holes in which inner conductors of a resonator unit are formed and a coupling hole between the through holes, the coupling hole is formed in a direction parallel to the through hole so as not to penetrate through the dielectric block, and is immersed in a conductive paste with the surface facing the opening surface of the coupling hole facing down, and the inside of the through hole and the dielectric block are immersed in the conductor paste. A conductive film is formed on the side and bottom surfaces of the dielectric block, a conductive paste is applied to the opening surface of the coupling hole of the dielectric block, the conductive paste is baked, and the surface opposite to the opening surface of the coupling hole is coated with the coupling hole. A method for manufacturing a dielectric filter, comprising polishing until holes are exposed.
(2)該誘電体ブロックを該結合孔の開口面まで浸漬す
る請求項第1項記載の誘電体フィルタの製造方法。
(2) The method for manufacturing a dielectric filter according to claim 1, wherein the dielectric block is immersed up to the opening surface of the coupling hole.
(3)共振子ユニットの内導体が形成される複数の貫通
孔とその間に結合孔を有する誘電体ブロックの該貫通孔
と側面に導体膜を形成する誘電体フィルタの製造方法に
おいて、該結合孔を該貫通孔と平行な方向に該誘電体ブ
ロックを貫通しないように形成し、該結合孔の開口部を
粘着テープで覆い、該誘電体ブロックを導体ペーストに
浸漬し、該貫通孔内および該誘電体ブロックの側面と上
下面に導体膜を形成し、該導体ペーストを焼付け、該結
合孔の開口面に対抗する面を該結合孔が露出するまで研
磨することを特徴とする誘電体フィルタの製造方法。
(3) A method for manufacturing a dielectric filter in which a conductive film is formed on the through holes and side surfaces of a dielectric block having a plurality of through holes in which inner conductors of a resonator unit are formed and a coupling hole between the through holes, the coupling hole is formed in a direction parallel to the through hole so as not to penetrate through the dielectric block, the opening of the coupling hole is covered with adhesive tape, and the dielectric block is immersed in a conductive paste to A dielectric filter characterized in that a conductive film is formed on the side and upper and lower surfaces of a dielectric block, the conductive paste is baked, and the surface facing the opening surface of the coupling hole is polished until the coupling hole is exposed. Production method.
(4)請求項第3項の誘電体フィルタの製造方法におい
て、更に導体ペーストを焼付するとともに、該粘着テー
プを燃焼させる誘電体フィルタの製造方法。
(4) The method for manufacturing a dielectric filter according to claim 3, further comprising baking the conductive paste and burning the adhesive tape.
(5)粘着テープの燃焼後、粘着テープの貼られていた
部分に導体膜を形成する請求項第3項記載の誘電体フィ
ルタの製造方法。
(5) The method for manufacturing a dielectric filter according to claim 3, wherein after burning the adhesive tape, a conductive film is formed on the portion where the adhesive tape was pasted.
JP21178588A 1988-08-26 1988-08-26 Manufacture of dielectric filter Pending JPH0260305A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21178588A JPH0260305A (en) 1988-08-26 1988-08-26 Manufacture of dielectric filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21178588A JPH0260305A (en) 1988-08-26 1988-08-26 Manufacture of dielectric filter

Publications (1)

Publication Number Publication Date
JPH0260305A true JPH0260305A (en) 1990-02-28

Family

ID=16611565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21178588A Pending JPH0260305A (en) 1988-08-26 1988-08-26 Manufacture of dielectric filter

Country Status (1)

Country Link
JP (1) JPH0260305A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06296107A (en) * 1993-04-08 1994-10-21 Fuji Elelctrochem Co Ltd Manufacture of dielectric resonator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06296107A (en) * 1993-04-08 1994-10-21 Fuji Elelctrochem Co Ltd Manufacture of dielectric resonator

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