JPH0260238U - - Google Patents
Info
- Publication number
- JPH0260238U JPH0260238U JP14058588U JP14058588U JPH0260238U JP H0260238 U JPH0260238 U JP H0260238U JP 14058588 U JP14058588 U JP 14058588U JP 14058588 U JP14058588 U JP 14058588U JP H0260238 U JPH0260238 U JP H0260238U
- Authority
- JP
- Japan
- Prior art keywords
- card
- semiconductor
- barcode
- plan
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000008188 pellet Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14058588U JPH0260238U (cs) | 1988-10-27 | 1988-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14058588U JPH0260238U (cs) | 1988-10-27 | 1988-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260238U true JPH0260238U (cs) | 1990-05-02 |
Family
ID=31404893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14058588U Pending JPH0260238U (cs) | 1988-10-27 | 1988-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260238U (cs) |
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1988
- 1988-10-27 JP JP14058588U patent/JPH0260238U/ja active Pending