JPH0259912U - - Google Patents
Info
- Publication number
- JPH0259912U JPH0259912U JP13872788U JP13872788U JPH0259912U JP H0259912 U JPH0259912 U JP H0259912U JP 13872788 U JP13872788 U JP 13872788U JP 13872788 U JP13872788 U JP 13872788U JP H0259912 U JPH0259912 U JP H0259912U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molded product
- flange portion
- resin molded
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000012778 molding material Substances 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
図面は本考案の実施例を示すもので、第１図は
本実施例に係るインモールドコーテイング用金型
構造が適用された成形用金型の縦断面図、第２〜
４図はインモールドコート材がコーテイングされ
た樹脂成形品を成形する成形工程を示す成形用金
型の縦断面図、第５図は本実施例の成形用金型を
用いて成形された完成品の一部分を拡大して示す
斜視図である。
２…上型、３…下型、７…スライドコア、１３
…空間、ａ…樹脂成形素材（ＳＭＣ成形素材）、
Ａ…樹脂成形品、Ａ′…フランジ部、ｂ…インモ
ールドコート材、Ｂ…コーテイング層。
The drawings show an embodiment of the present invention, and FIG. 1 is a vertical sectional view of a molding die to which the in-mold coating mold structure according to the embodiment is applied, and FIG.
Figure 4 is a vertical cross-sectional view of a molding die showing the molding process for molding a resin molded product coated with the in-mold coating material, and Figure 5 is a finished product molded using the molding die of this example. It is a perspective view which expands and shows a part of. 2...Upper die, 3...Lower die, 7...Slide core, 13
...Space, a...Resin molding material (SMC molding material),
A... Resin molded product, A'... Flange portion, b... In-mold coating material, B... Coating layer.
Claims (1)
ることにより樹脂成形品を成形したのち、上記上
型あるいは下型の少なくとも一方を型開き方向に
移動させて樹脂成形品の表面と該表面に対向する
型面との間に間隙を形成すると共に、該間隙内に
所定の加圧力により加圧されたインモールドコー
ト材を充填することにより樹脂成形品の表面をコ
ーテイングするようにしたインモールドコーテイ
ング用金型構造であつて、上記上型および下型が
、樹脂成形品の端部に略直交するフランジ部を形
成する形状とされていると共に、上記上型あるい
は下型の一方に設けられて、上記フランジ部の内
側面を形成し、且つインモールドコート材のコー
テイング時に後退して上記成形品のフランジ部の
内側に該フランジ部を変形させ得る空間を形成す
るスライドコアが設けられていることを特徴とす
るインモールドコーテイング用金型構造。 After molding a resin molded product by heat pressing the resin molding material between an upper mold and a lower mold, at least one of the upper mold or the lower mold is moved in the mold opening direction to contact the surface of the resin molded product. An in-mold coating method coats the surface of a resin molded product by forming a gap between the surface and the mold surface facing the surface and filling the gap with an in-mold coat material pressurized with a predetermined pressure. The mold coating mold structure is such that the upper mold and the lower mold are shaped to form a flange portion substantially perpendicular to the end of the resin molded product, and a flange portion is provided on one of the upper mold or the lower mold. A slide core is provided that forms the inner surface of the flange portion and that retreats during coating with the in-mold coating material to form a space inside the flange portion of the molded product in which the flange portion can be deformed. A mold structure for in-mold coating that is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13872788U JPH0259912U (en) | 1988-10-24 | 1988-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13872788U JPH0259912U (en) | 1988-10-24 | 1988-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0259912U true JPH0259912U (en) | 1990-05-01 |
Family
ID=31401335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13872788U Pending JPH0259912U (en) | 1988-10-24 | 1988-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0259912U (en) |
-
1988
- 1988-10-24 JP JP13872788U patent/JPH0259912U/ja active Pending
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