JPH025849U - - Google Patents
Info
- Publication number
- JPH025849U JPH025849U JP8472188U JP8472188U JPH025849U JP H025849 U JPH025849 U JP H025849U JP 8472188 U JP8472188 U JP 8472188U JP 8472188 U JP8472188 U JP 8472188U JP H025849 U JPH025849 U JP H025849U
- Authority
- JP
- Japan
- Prior art keywords
- card
- spring block
- block
- spring
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
Landscapes
- Credit Cards Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
第１図は本考案の実施例の要部斜視図、第２図
は同上のバネブロツクの斜視図、第３図は同上の
要部平面図、第４図は同上のカードブロツクの斜
視図、第５図は従来例のリレー全体の分解斜視図
、第６図は同上の要部平面図である。
３……電磁石ブロツク、４……バネブロツク、
５……カード、８……接点部、１９……テーパ溝
、２１……接着剤、２２……リブ。
Fig. 1 is a perspective view of the main parts of the embodiment of the present invention, Fig. 2 is a perspective view of the same spring block, Fig. 3 is a plan view of the main parts of the same, Fig. 4 is a perspective view of the card block same as the above, FIG. 5 is an exploded perspective view of the entire conventional relay, and FIG. 6 is a plan view of the main parts of the same. 3...Electromagnetic block, 4...Spring block,
5... Card, 8... Contact portion, 19... Taper groove, 21... Adhesive, 22... Rib.
Claims (1)
されるカードと、このカードにより押接駆動され
るバネブロツクと、このバネブロツクにより接点
の開閉が行なわれる接点部とを備え、上記カード
の平面状の側面とバネブロツクの接触バネを支持
する成形材の平面状の側面との間に接着剤を流し
込んでカードとバネブロツクとを接着固定するリ
レーの構造において、カードとバネブロツクとの
間に至る接着剤流し込み用のテーパ溝をカードの
上面から側面にかけて形成し、上記テーパ溝の下
部開口部の両縁に対応したリブをバネブロツクの
成形材の側面に突設して成ることを特徴とするリ
レーの構造。 The device is equipped with an electromagnetic block, a card driven by the electromagnetic block, a spring block pushed into contact by the card, and a contact portion whose contacts are opened and closed by the spring block. In a relay structure in which a card and a spring block are bonded and fixed by pouring an adhesive between the flat side surface of a molded material that supports a contact spring, a tapered groove for pouring the adhesive is formed between the card and the spring block. A relay structure characterized in that ribs are formed from the top surface to the side surface of the card and protrude from the side surface of the molded material of the spring block, corresponding to both edges of the lower opening of the tapered groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8472188U JPH0723888Y2 (en) | 1988-06-27 | 1988-06-27 | Relay structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8472188U JPH0723888Y2 (en) | 1988-06-27 | 1988-06-27 | Relay structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH025849U true JPH025849U (en) | 1990-01-16 |
| JPH0723888Y2 JPH0723888Y2 (en) | 1995-05-31 |
Family
ID=31309401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8472188U Expired - Lifetime JPH0723888Y2 (en) | 1988-06-27 | 1988-06-27 | Relay structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723888Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS531061U (en) * | 1976-06-23 | 1978-01-07 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018100821A (en) * | 2016-12-20 | 2018-06-28 | パナソニック株式会社 | Dew condensation removal structure and cold equipment including the same |
-
1988
- 1988-06-27 JP JP8472188U patent/JPH0723888Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS531061U (en) * | 1976-06-23 | 1978-01-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0723888Y2 (en) | 1995-05-31 |
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