JPH0258393U - - Google Patents

Info

Publication number
JPH0258393U
JPH0258393U JP1988136788U JP13678888U JPH0258393U JP H0258393 U JPH0258393 U JP H0258393U JP 1988136788 U JP1988136788 U JP 1988136788U JP 13678888 U JP13678888 U JP 13678888U JP H0258393 U JPH0258393 U JP H0258393U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation electrode
pad
soldered
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988136788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988136788U priority Critical patent/JPH0258393U/ja
Publication of JPH0258393U publication Critical patent/JPH0258393U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988136788U 1988-10-19 1988-10-19 Pending JPH0258393U (US20030220297A1-20031127-C00074.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988136788U JPH0258393U (US20030220297A1-20031127-C00074.png) 1988-10-19 1988-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988136788U JPH0258393U (US20030220297A1-20031127-C00074.png) 1988-10-19 1988-10-19

Publications (1)

Publication Number Publication Date
JPH0258393U true JPH0258393U (US20030220297A1-20031127-C00074.png) 1990-04-26

Family

ID=31397622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988136788U Pending JPH0258393U (US20030220297A1-20031127-C00074.png) 1988-10-19 1988-10-19

Country Status (1)

Country Link
JP (1) JPH0258393U (US20030220297A1-20031127-C00074.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025228A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体
JP2016122679A (ja) * 2014-12-24 2016-07-07 株式会社オートネットワーク技術研究所 回路構成体およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025228A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体
JP2016122679A (ja) * 2014-12-24 2016-07-07 株式会社オートネットワーク技術研究所 回路構成体およびその製造方法

Similar Documents

Publication Publication Date Title
JPH0258393U (US20030220297A1-20031127-C00074.png)
JPH0418474U (US20030220297A1-20031127-C00074.png)
JPS63162563U (US20030220297A1-20031127-C00074.png)
JPS5847718Y2 (ja) 放熱型プリント基板
JPS6315033U (US20030220297A1-20031127-C00074.png)
JPH038446U (US20030220297A1-20031127-C00074.png)
JPS59146960U (ja) 混成集積回路
JPS63105331U (US20030220297A1-20031127-C00074.png)
JPH0430720U (US20030220297A1-20031127-C00074.png)
JPH01162273U (US20030220297A1-20031127-C00074.png)
JPS63105349U (US20030220297A1-20031127-C00074.png)
JPS62160538U (US20030220297A1-20031127-C00074.png)
JPS61157369U (US20030220297A1-20031127-C00074.png)
JPS61102039U (US20030220297A1-20031127-C00074.png)
JPS6292644U (US20030220297A1-20031127-C00074.png)
JPS61158955U (US20030220297A1-20031127-C00074.png)
JPS63153570U (US20030220297A1-20031127-C00074.png)
JPH0420202U (US20030220297A1-20031127-C00074.png)
JPS6398653U (US20030220297A1-20031127-C00074.png)
JPS606235U (ja) マイクロ波混成集積回路用ケ−ス
JPS5958928U (ja) 半田コンデンサの取付構造
JPS61149354U (US20030220297A1-20031127-C00074.png)
JPS6217144U (US20030220297A1-20031127-C00074.png)
JPS6413147U (US20030220297A1-20031127-C00074.png)
JPS6240869U (US20030220297A1-20031127-C00074.png)